JPWO2024047809A1 - - Google Patents
Info
- Publication number
- JPWO2024047809A1 JPWO2024047809A1 JP2024543704A JP2024543704A JPWO2024047809A1 JP WO2024047809 A1 JPWO2024047809 A1 JP WO2024047809A1 JP 2024543704 A JP2024543704 A JP 2024543704A JP 2024543704 A JP2024543704 A JP 2024543704A JP WO2024047809 A1 JPWO2024047809 A1 JP WO2024047809A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/032830 WO2024047809A1 (ja) | 2022-08-31 | 2022-08-31 | 電子制御装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024047809A1 true JPWO2024047809A1 (https=) | 2024-03-07 |
Family
ID=90098967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024543704A Pending JPWO2024047809A1 (https=) | 2022-08-31 | 2022-08-31 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024047809A1 (https=) |
| DE (1) | DE112022007360T5 (https=) |
| WO (1) | WO2024047809A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001111232A (ja) * | 1999-10-06 | 2001-04-20 | Sony Corp | 電子部品実装多層基板及びその製造方法 |
| JP2005251889A (ja) * | 2004-03-03 | 2005-09-15 | Matsushita Electric Ind Co Ltd | 立体的電子回路装置 |
| JP2007299870A (ja) * | 2006-04-28 | 2007-11-15 | Matsushita Electric Ind Co Ltd | 中継用基板およびそれを用いた立体的電子回路構造体 |
| US8842443B2 (en) * | 2011-03-25 | 2014-09-23 | Lg Electronics Inc. | Printed circuit board assembly for a mobile terminal and method for fabricating the same |
| JP2019175949A (ja) * | 2018-03-27 | 2019-10-10 | 京セラ株式会社 | 電子機器、撮像装置、および移動体 |
| US20200093040A1 (en) * | 2018-09-19 | 2020-03-19 | Samsung Electronics Co., Ltd. | Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board |
| WO2020258447A1 (zh) * | 2019-06-26 | 2020-12-30 | 昆山首源电子科技有限公司 | 拼接式多层线路板 |
-
2022
- 2022-08-31 DE DE112022007360.8T patent/DE112022007360T5/de active Pending
- 2022-08-31 JP JP2024543704A patent/JPWO2024047809A1/ja active Pending
- 2022-08-31 WO PCT/JP2022/032830 patent/WO2024047809A1/ja not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001111232A (ja) * | 1999-10-06 | 2001-04-20 | Sony Corp | 電子部品実装多層基板及びその製造方法 |
| JP2005251889A (ja) * | 2004-03-03 | 2005-09-15 | Matsushita Electric Ind Co Ltd | 立体的電子回路装置 |
| JP2007299870A (ja) * | 2006-04-28 | 2007-11-15 | Matsushita Electric Ind Co Ltd | 中継用基板およびそれを用いた立体的電子回路構造体 |
| US8842443B2 (en) * | 2011-03-25 | 2014-09-23 | Lg Electronics Inc. | Printed circuit board assembly for a mobile terminal and method for fabricating the same |
| JP2019175949A (ja) * | 2018-03-27 | 2019-10-10 | 京セラ株式会社 | 電子機器、撮像装置、および移動体 |
| US20200093040A1 (en) * | 2018-09-19 | 2020-03-19 | Samsung Electronics Co., Ltd. | Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board |
| WO2020258447A1 (zh) * | 2019-06-26 | 2020-12-30 | 昆山首源电子科技有限公司 | 拼接式多层线路板 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024047809A1 (ja) | 2024-03-07 |
| DE112022007360T5 (de) | 2025-04-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250110 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260127 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260313 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20260407 |