JPWO2024024860A1 - - Google Patents

Info

Publication number
JPWO2024024860A1
JPWO2024024860A1 JP2024537205A JP2024537205A JPWO2024024860A1 JP WO2024024860 A1 JPWO2024024860 A1 JP WO2024024860A1 JP 2024537205 A JP2024537205 A JP 2024537205A JP 2024537205 A JP2024537205 A JP 2024537205A JP WO2024024860 A1 JPWO2024024860 A1 JP WO2024024860A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024537205A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024024860A1 publication Critical patent/JPWO2024024860A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/104Esters of polyhydric alcohols or polyhydric phenols of tetraalcohols, e.g. pentaerythritol tetra(meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2024537205A 2022-07-28 2023-07-26 Pending JPWO2024024860A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022120901 2022-07-28
JP2023011970 2023-01-30
PCT/JP2023/027453 WO2024024860A1 (ja) 2022-07-28 2023-07-26 粘着シートおよび粘着シートの剥離方法

Publications (1)

Publication Number Publication Date
JPWO2024024860A1 true JPWO2024024860A1 (https=) 2024-02-01

Family

ID=89706551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024537205A Pending JPWO2024024860A1 (https=) 2022-07-28 2023-07-26

Country Status (5)

Country Link
JP (1) JPWO2024024860A1 (https=)
KR (1) KR20250041152A (https=)
CN (1) CN119487143A (https=)
TW (1) TW202411377A (https=)
WO (1) WO2024024860A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025205623A1 (ja) * 2024-03-29 2025-10-02 日東電工株式会社 粘着シート、構造体、構造体の製造方法および方法
WO2025205624A1 (ja) * 2024-03-29 2025-10-02 日東電工株式会社 粘着シート、構造体、構造体の製造方法および方法
WO2025205625A1 (ja) * 2024-03-29 2025-10-02 日東電工株式会社 粘着シート、構造体、構造体の製造方法および方法
WO2026014398A1 (ja) * 2024-07-11 2026-01-15 日東電工株式会社 粘着剤組成物、及び、保護シート

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10209087A (ja) 1997-01-16 1998-08-07 Toyo Chem Co Ltd 半導体ウエハ固定用シート及びチツプピツクアツプ方法
JP3566710B2 (ja) * 2001-11-15 2004-09-15 積水化学工業株式会社 接着性物質、接着性物質の剥離方法及び粘着テープ
JP4238037B2 (ja) * 2001-11-15 2009-03-11 積水化学工業株式会社 接着性物質、接着性物質の剥離方法及び粘着テープ
JP4792281B2 (ja) * 2005-12-08 2011-10-12 積水化学工業株式会社 極薄金属箔及び極薄金属箔転写体の製造方法
US9855734B2 (en) 2012-08-10 2018-01-02 Sekisui Chemical Co., Ltd. Wafer processing method
JP6565304B2 (ja) 2015-04-28 2019-08-28 三菱ケミカル株式会社 薬液保護用粘着シート用熱硬化性粘着剤組成物、これを架橋させてなる薬液保護用粘着シート用粘着剤、薬液保護用粘着シート及び薬液保護用粘着シートの使用方法
JP7139141B2 (ja) 2017-06-13 2022-09-20 マクセル株式会社 両面粘着テープ、及び薄膜部材と支持部材との積層体
EP3922692A4 (en) * 2019-02-06 2022-11-09 Nitto Denko Corporation PRESSURE SENSITIVE ADHESIVE FILM
JP7777913B2 (ja) * 2019-12-18 2025-12-01 ライオン・スペシャリティ・ケミカルズ株式会社 再剥離粘着剤組成物および粘着シート

Also Published As

Publication number Publication date
CN119487143A (zh) 2025-02-18
TW202411377A (zh) 2024-03-16
KR20250041152A (ko) 2025-03-25
WO2024024860A1 (ja) 2024-02-01

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