JPWO2024004459A1 - - Google Patents

Info

Publication number
JPWO2024004459A1
JPWO2024004459A1 JP2024530383A JP2024530383A JPWO2024004459A1 JP WO2024004459 A1 JPWO2024004459 A1 JP WO2024004459A1 JP 2024530383 A JP2024530383 A JP 2024530383A JP 2024530383 A JP2024530383 A JP 2024530383A JP WO2024004459 A1 JPWO2024004459 A1 JP WO2024004459A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024530383A
Other languages
Japanese (ja)
Other versions
JPWO2024004459A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024004459A1 publication Critical patent/JPWO2024004459A1/ja
Publication of JPWO2024004459A5 publication Critical patent/JPWO2024004459A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/03—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for supply of electrical power to vehicle subsystems or for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2024530383A 2022-07-01 2023-05-25 Pending JPWO2024004459A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022107066 2022-07-01
PCT/JP2023/019477 WO2024004459A1 (ja) 2022-07-01 2023-05-25 ユニット

Publications (2)

Publication Number Publication Date
JPWO2024004459A1 true JPWO2024004459A1 (https=) 2024-01-04
JPWO2024004459A5 JPWO2024004459A5 (https=) 2025-02-06

Family

ID=89382674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024530383A Pending JPWO2024004459A1 (https=) 2022-07-01 2023-05-25

Country Status (4)

Country Link
EP (1) EP4550410A4 (https=)
JP (1) JPWO2024004459A1 (https=)
CN (1) CN119487632A (https=)
WO (1) WO2024004459A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000196276A (ja) * 1998-12-25 2000-07-14 Mitsubishi Electric Corp 電子機器
JP2006132841A (ja) * 2004-11-05 2006-05-25 Mitsubishi Electric Corp 熱交換器
JP2006203159A (ja) * 2005-01-18 2006-08-03 Internatl Business Mach Corp <Ibm> 半導体用熱交換器
JP2019009433A (ja) * 2017-06-26 2019-01-17 株式会社巴川製紙所 冷却部材
WO2020235449A1 (ja) * 2019-05-21 2020-11-26 株式会社巴川製紙所 温調ユニット
WO2021241643A1 (ja) * 2020-05-29 2021-12-02 株式会社巴川製紙所 温調ユニット

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002046482A (ja) * 2000-07-31 2002-02-12 Honda Motor Co Ltd ヒートシンク式冷却装置
JP4985382B2 (ja) * 2007-12-21 2012-07-25 株式会社デンソー 半導体冷却構造
WO2012114475A1 (ja) * 2011-02-23 2012-08-30 トヨタ自動車株式会社 冷却器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000196276A (ja) * 1998-12-25 2000-07-14 Mitsubishi Electric Corp 電子機器
JP2006132841A (ja) * 2004-11-05 2006-05-25 Mitsubishi Electric Corp 熱交換器
JP2006203159A (ja) * 2005-01-18 2006-08-03 Internatl Business Mach Corp <Ibm> 半導体用熱交換器
JP2019009433A (ja) * 2017-06-26 2019-01-17 株式会社巴川製紙所 冷却部材
WO2020235449A1 (ja) * 2019-05-21 2020-11-26 株式会社巴川製紙所 温調ユニット
WO2021241643A1 (ja) * 2020-05-29 2021-12-02 株式会社巴川製紙所 温調ユニット

Also Published As

Publication number Publication date
EP4550410A4 (en) 2025-10-29
CN119487632A (zh) 2025-02-18
EP4550410A1 (en) 2025-05-07
WO2024004459A1 (ja) 2024-01-04

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