JPWO2024003973A1 - - Google Patents
Info
- Publication number
- JPWO2024003973A1 JPWO2024003973A1 JP2022552649A JP2022552649A JPWO2024003973A1 JP WO2024003973 A1 JPWO2024003973 A1 JP WO2024003973A1 JP 2022552649 A JP2022552649 A JP 2022552649A JP 2022552649 A JP2022552649 A JP 2022552649A JP WO2024003973 A1 JPWO2024003973 A1 JP WO2024003973A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2022/025471 WO2024003973A1 (ja) | 2022-06-27 | 2022-06-27 | レーザ加工装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP7205006B1 JP7205006B1 (ja) | 2023-01-16 |
JPWO2024003973A1 true JPWO2024003973A1 (ja) | 2024-01-04 |
JPWO2024003973A5 JPWO2024003973A5 (ja) | 2024-06-04 |
Family
ID=84901073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022552649A Active JP7205006B1 (ja) | 2022-06-27 | 2022-06-27 | レーザ加工装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7205006B1 (ja) |
TW (1) | TW202400344A (ja) |
WO (1) | WO2024003973A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7493294B1 (ja) | 2023-09-04 | 2024-05-31 | 西進商事株式会社 | アブレーションユニットおよび分析機 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10328871A (ja) * | 1997-06-02 | 1998-12-15 | Matsushita Electric Ind Co Ltd | レーザ加工装置の照射位置補正方法 |
JP4091494B2 (ja) * | 2003-07-24 | 2008-05-28 | 三菱電機株式会社 | レーザ加工装置およびその加工位置ずれ補正方法 |
JP4664761B2 (ja) * | 2005-07-12 | 2011-04-06 | 三菱電機株式会社 | レーザ加工装置 |
JP2018161676A (ja) * | 2017-03-27 | 2018-10-18 | パナソニックIpマネジメント株式会社 | レーザ加工装置 |
JP6975190B2 (ja) * | 2019-02-26 | 2021-12-01 | ファナック株式会社 | 機械学習装置、レーザ加工装置及びレーザ加工システム |
-
2022
- 2022-06-27 WO PCT/JP2022/025471 patent/WO2024003973A1/ja unknown
- 2022-06-27 JP JP2022552649A patent/JP7205006B1/ja active Active
-
2023
- 2023-06-21 TW TW112123386A patent/TW202400344A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202400344A (zh) | 2024-01-01 |
JP7205006B1 (ja) | 2023-01-16 |
WO2024003973A1 (ja) | 2024-01-04 |
Similar Documents
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