JPWO2023233591A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023233591A5 JPWO2023233591A5 JP2022556093A JP2022556093A JPWO2023233591A5 JP WO2023233591 A5 JPWO2023233591 A5 JP WO2023233591A5 JP 2022556093 A JP2022556093 A JP 2022556093A JP 2022556093 A JP2022556093 A JP 2022556093A JP WO2023233591 A5 JPWO2023233591 A5 JP WO2023233591A5
- Authority
- JP
- Japan
- Prior art keywords
- opening
- semiconductor chip
- conductor layer
- circuit board
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 17
- 238000005245 sintering Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/022338 WO2023233591A1 (ja) | 2022-06-01 | 2022-06-01 | 半導体装置および半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7184230B1 JP7184230B1 (ja) | 2022-12-06 |
| JPWO2023233591A1 JPWO2023233591A1 (https=) | 2023-12-07 |
| JPWO2023233591A5 true JPWO2023233591A5 (https=) | 2024-05-13 |
Family
ID=84327887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022556093A Active JP7184230B1 (ja) | 2022-06-01 | 2022-06-01 | 半導体装置および半導体装置の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250105197A1 (https=) |
| JP (1) | JP7184230B1 (https=) |
| WO (1) | WO2023233591A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5346272B2 (ja) * | 2009-12-01 | 2013-11-20 | 三ツ星ベルト株式会社 | 素子搭載基板及び発光装置 |
| JP2015176971A (ja) * | 2014-03-14 | 2015-10-05 | 三菱電機株式会社 | 半導体パッケージ、およびその製造方法 |
| US10104759B2 (en) * | 2016-11-29 | 2018-10-16 | Nxp Usa, Inc. | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof |
| DE112019008007T5 (de) * | 2019-12-26 | 2022-10-27 | Mitsubishi Electric Corporation | Leistungsmodul und leistungswandlereinheit |
-
2022
- 2022-06-01 US US18/729,395 patent/US20250105197A1/en active Pending
- 2022-06-01 JP JP2022556093A patent/JP7184230B1/ja active Active
- 2022-06-01 WO PCT/JP2022/022338 patent/WO2023233591A1/ja not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105244347B (zh) | 一种嵌入式封装及封装方法 | |
| CN102842557B (zh) | 一种封装结构及其制造方法 | |
| CN111312669A (zh) | 封装电子装置和封装电子装置结构 | |
| TWI485819B (zh) | 封裝結構及其製造方法 | |
| TWI239583B (en) | Semiconductor package and method for fabricating the same | |
| CN216624256U (zh) | 半导体封装和电子设备 | |
| JP4284782B2 (ja) | 多層セラミック基板およびその製造方法 | |
| KR20140045461A (ko) | 집적회로 패키지 | |
| JPWO2023233591A5 (https=) | ||
| CN111739849B (zh) | 芯片封装结构、其制作方法和电子设备 | |
| CN105097568A (zh) | 半导体叠层封装方法 | |
| JP4845090B2 (ja) | 回路装置の製造方法 | |
| CN209087825U (zh) | 器件和半导体器件 | |
| CN105977233A (zh) | 芯片封装结构及其制造方法 | |
| JPWO2019094598A5 (https=) | ||
| CN212209546U (zh) | 器件线路板、发光器件、阵列线路板、器件阵列及显示屏 | |
| KR101432486B1 (ko) | 집적회로 패키지 제조방법 | |
| CN106298749B (zh) | 发光二极管、电子器件及其制作方法 | |
| CN115274464A (zh) | 一种线路板制备方法以及线路板 | |
| US20140085845A1 (en) | Thick-film hybrid circuit structure and method of manufacture the same | |
| JP6313235B2 (ja) | 電子部品収納用パッケージ、電子装置および電子部品収納用パッケージの製造方法 | |
| TWI231020B (en) | Substrate with embedded passive components and method for fabricating the same | |
| CN106158782B (zh) | 电子封装件及其制法 | |
| JP4610426B2 (ja) | 回路装置の製造方法 | |
| TW201603201A (zh) | 嵌入式封裝及封裝方法 |