JPWO2023210471A1 - - Google Patents
Info
- Publication number
- JPWO2023210471A1 JPWO2023210471A1 JP2024517244A JP2024517244A JPWO2023210471A1 JP WO2023210471 A1 JPWO2023210471 A1 JP WO2023210471A1 JP 2024517244 A JP2024517244 A JP 2024517244A JP 2024517244 A JP2024517244 A JP 2024517244A JP WO2023210471 A1 JPWO2023210471 A1 JP WO2023210471A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
- C09K19/3804—Polymers with mesogenic groups in the main chain
- C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022075201 | 2022-04-28 | ||
| PCT/JP2023/015684 WO2023210471A1 (ja) | 2022-04-28 | 2023-04-19 | フィルム及び積層体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023210471A1 true JPWO2023210471A1 (https=) | 2023-11-02 |
Family
ID=88518602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024517244A Pending JPWO2023210471A1 (https=) | 2022-04-28 | 2023-04-19 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250034453A1 (https=) |
| JP (1) | JPWO2023210471A1 (https=) |
| WO (1) | WO2023210471A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001060938A1 (fr) * | 2000-02-15 | 2001-08-23 | Hitachi Chemical Co., Ltd. | Composition adhesive, procede de production de ladite resine, film adhesif fabrique a partir de ladite resine, substrat pour montage de semi-conducteur et dispositif semi-conducteur |
| JP4129627B2 (ja) * | 2002-12-18 | 2008-08-06 | 旭硝子株式会社 | ビルドアップ配線板用積層フィルム及びビルドアップ配線板 |
| JP2013064078A (ja) * | 2011-09-20 | 2013-04-11 | Fujimori Kogyo Co Ltd | 接着シート |
| CN114174062A (zh) * | 2019-08-06 | 2022-03-11 | 株式会社村田制作所 | 树脂片及树脂多层基板 |
| TWI884272B (zh) * | 2020-05-21 | 2025-05-21 | 日商住友化學股份有限公司 | 液晶聚酯液狀組成物、液晶聚酯薄膜、層合體及液晶聚酯薄膜的製造方法 |
| JP7185156B2 (ja) * | 2020-08-07 | 2022-12-07 | ダイキン工業株式会社 | フィルム、ラッピング電線被覆材料、可撓性印刷回路基板用フィルム、及び、積層体 |
| JP2022041942A (ja) * | 2020-08-31 | 2022-03-11 | 住友化学株式会社 | フィルム |
| WO2022202789A1 (ja) * | 2021-03-22 | 2022-09-29 | 富士フイルム株式会社 | ポリマーフィルム及び積層体 |
| WO2023127433A1 (ja) * | 2021-12-27 | 2023-07-06 | 富士フイルム株式会社 | フィルム及びフィルムの製造方法、並びに、積層体 |
-
2023
- 2023-04-19 JP JP2024517244A patent/JPWO2023210471A1/ja active Pending
- 2023-04-19 WO PCT/JP2023/015684 patent/WO2023210471A1/ja not_active Ceased
-
2024
- 2024-10-14 US US18/915,299 patent/US20250034453A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023210471A1 (ja) | 2023-11-02 |
| US20250034453A1 (en) | 2025-01-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260304 |