JPWO2023190454A1 - - Google Patents

Info

Publication number
JPWO2023190454A1
JPWO2023190454A1 JP2024512527A JP2024512527A JPWO2023190454A1 JP WO2023190454 A1 JPWO2023190454 A1 JP WO2023190454A1 JP 2024512527 A JP2024512527 A JP 2024512527A JP 2024512527 A JP2024512527 A JP 2024512527A JP WO2023190454 A1 JPWO2023190454 A1 JP WO2023190454A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024512527A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023190454A1 publication Critical patent/JPWO2023190454A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
JP2024512527A 2022-03-29 2023-03-28 Pending JPWO2023190454A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022054426 2022-03-29
PCT/JP2023/012393 WO2023190454A1 (ja) 2022-03-29 2023-03-28 感光性樹脂組成物およびプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
JPWO2023190454A1 true JPWO2023190454A1 (https=) 2023-10-05

Family

ID=88202437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024512527A Pending JPWO2023190454A1 (https=) 2022-03-29 2023-03-28

Country Status (4)

Country Link
JP (1) JPWO2023190454A1 (https=)
KR (1) KR20240155931A (https=)
CN (1) CN118974657A (https=)
WO (1) WO2023190454A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008116813A (ja) * 2006-11-07 2008-05-22 Taiyo Ink Mfg Ltd アルカリ現像可能な感光性樹脂組成物およびそれを用いたプリント配線板
WO2014002294A1 (ja) * 2012-06-29 2014-01-03 太陽油墨（蘇州）有限公司 アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2014235376A (ja) * 2013-06-04 2014-12-15 太陽インキ製造株式会社 光硬化熱硬化性樹脂組成物、硬化物、及びプリント配線板
JP2016027363A (ja) * 2014-06-30 2016-02-18 太陽インキ製造株式会社 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法
JP2016065942A (ja) * 2014-09-24 2016-04-28 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
JP2017003967A (ja) * 2015-06-05 2017-01-05 太陽インキ製造株式会社 アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2019174788A (ja) * 2018-03-28 2019-10-10 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、およびプリント配線板の製造方法
JP2019179201A (ja) * 2018-03-30 2019-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、それらを用いたプリント配線板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3723036B2 (ja) 2000-03-29 2005-12-07 太陽インキ製造株式会社 活性エネルギー線硬化性樹脂及びこれを用いた光硬化性・熱硬化性樹脂組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008116813A (ja) * 2006-11-07 2008-05-22 Taiyo Ink Mfg Ltd アルカリ現像可能な感光性樹脂組成物およびそれを用いたプリント配線板
WO2014002294A1 (ja) * 2012-06-29 2014-01-03 太陽油墨（蘇州）有限公司 アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2014235376A (ja) * 2013-06-04 2014-12-15 太陽インキ製造株式会社 光硬化熱硬化性樹脂組成物、硬化物、及びプリント配線板
JP2016027363A (ja) * 2014-06-30 2016-02-18 太陽インキ製造株式会社 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法
JP2016065942A (ja) * 2014-09-24 2016-04-28 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
JP2017003967A (ja) * 2015-06-05 2017-01-05 太陽インキ製造株式会社 アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2019174788A (ja) * 2018-03-28 2019-10-10 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、およびプリント配線板の製造方法
JP2019179201A (ja) * 2018-03-30 2019-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、それらを用いたプリント配線板

Also Published As

Publication number Publication date
CN118974657A (zh) 2024-11-15
KR20240155931A (ko) 2024-10-29
WO2023190454A1 (ja) 2023-10-05

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