JPWO2023170895A1 - - Google Patents
Info
- Publication number
- JPWO2023170895A1 JPWO2023170895A1 JP2022554448A JP2022554448A JPWO2023170895A1 JP WO2023170895 A1 JPWO2023170895 A1 JP WO2023170895A1 JP 2022554448 A JP2022554448 A JP 2022554448A JP 2022554448 A JP2022554448 A JP 2022554448A JP WO2023170895 A1 JPWO2023170895 A1 JP WO2023170895A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P9/00—Delay lines of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P9/00—Delay lines of the waveguide type
- H01P9/02—Helical lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/010751 WO2023170895A1 (ja) | 2022-03-11 | 2022-03-11 | 配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7274056B1 JP7274056B1 (ja) | 2023-05-15 |
| JPWO2023170895A1 true JPWO2023170895A1 (https=) | 2023-09-14 |
| JPWO2023170895A5 JPWO2023170895A5 (https=) | 2024-02-14 |
Family
ID=86321970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022554448A Active JP7274056B1 (ja) | 2022-03-11 | 2022-03-11 | 配線板 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240397611A1 (https=) |
| JP (1) | JP7274056B1 (https=) |
| KR (1) | KR102730729B1 (https=) |
| CN (1) | CN118830334A (https=) |
| DE (1) | DE112022006365T5 (https=) |
| WO (1) | WO2023170895A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4899436U (https=) * | 1972-02-25 | 1973-11-24 | ||
| JP3308734B2 (ja) * | 1994-10-13 | 2002-07-29 | 本田技研工業株式会社 | レーダーモジュール |
| US6828876B1 (en) * | 2001-11-02 | 2004-12-07 | Thin Film Technology Corp. | Tapered delay line |
| JP2004063698A (ja) * | 2002-07-26 | 2004-02-26 | Murata Mfg Co Ltd | 積層インダクタ及びその外部電極端子形成方法 |
| JP2006173401A (ja) | 2004-12-16 | 2006-06-29 | Canon Inc | プリント配線板 |
| JP2007335811A (ja) * | 2006-06-19 | 2007-12-27 | Matsushita Electric Ind Co Ltd | プリント配線板及び電子機器 |
| TW201012102A (en) * | 2008-09-05 | 2010-03-16 | Asustek Comp Inc | Delay line for printed circuit broad |
| CN204668075U (zh) * | 2013-02-19 | 2015-09-23 | 株式会社村田制作所 | 电感电桥及电子设备 |
| JP6620565B2 (ja) * | 2016-01-20 | 2019-12-18 | セイコーエプソン株式会社 | プリント配線板、情報通信装置、および表示システム |
| JP2018078495A (ja) * | 2016-11-10 | 2018-05-17 | 住友電気工業株式会社 | 増幅回路および光送信装置 |
-
2022
- 2022-03-11 KR KR1020247029213A patent/KR102730729B1/ko active Active
- 2022-03-11 WO PCT/JP2022/010751 patent/WO2023170895A1/ja not_active Ceased
- 2022-03-11 JP JP2022554448A patent/JP7274056B1/ja active Active
- 2022-03-11 CN CN202280093230.XA patent/CN118830334A/zh active Pending
- 2022-03-11 DE DE112022006365.3T patent/DE112022006365T5/de active Pending
-
2024
- 2024-07-31 US US18/790,135 patent/US20240397611A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN118830334A (zh) | 2024-10-22 |
| DE112022006365T5 (de) | 2024-10-31 |
| WO2023170895A1 (ja) | 2023-09-14 |
| KR20240138118A (ko) | 2024-09-20 |
| US20240397611A1 (en) | 2024-11-28 |
| JP7274056B1 (ja) | 2023-05-15 |
| KR102730729B1 (ko) | 2024-11-14 |
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