JPWO2023158491A5 - - Google Patents
Info
- Publication number
- JPWO2023158491A5 JPWO2023158491A5 JP2024547659A JP2024547659A JPWO2023158491A5 JP WO2023158491 A5 JPWO2023158491 A5 JP WO2023158491A5 JP 2024547659 A JP2024547659 A JP 2024547659A JP 2024547659 A JP2024547659 A JP 2024547659A JP WO2023158491 A5 JPWO2023158491 A5 JP WO2023158491A5
- Authority
- JP
- Japan
- Prior art keywords
- signal
- states
- power level
- transition
- generator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263311226P | 2022-02-17 | 2022-02-17 | |
| US63/311,226 | 2022-02-17 | ||
| PCT/US2022/053888 WO2023158491A1 (en) | 2022-02-17 | 2022-12-22 | Systems and methods for reducing variability in features of a substrate |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2025507374A JP2025507374A (ja) | 2025-03-18 |
| JP2025507374A5 JP2025507374A5 (https=) | 2025-12-22 |
| JPWO2023158491A5 true JPWO2023158491A5 (https=) | 2025-12-22 |
Family
ID=87578948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024547659A Pending JP2025507374A (ja) | 2022-02-17 | 2022-12-22 | 基板の特徴における変動性を低減するためのシステムおよび方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250166967A1 (https=) |
| JP (1) | JP2025507374A (https=) |
| KR (1) | KR20240144432A (https=) |
| CN (1) | CN118715590A (https=) |
| WO (1) | WO2023158491A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9123509B2 (en) * | 2007-06-29 | 2015-09-01 | Varian Semiconductor Equipment Associates, Inc. | Techniques for plasma processing a substrate |
| US9788405B2 (en) * | 2015-10-03 | 2017-10-10 | Applied Materials, Inc. | RF power delivery with approximated saw tooth wave pulsing |
| US10504744B1 (en) * | 2018-07-19 | 2019-12-10 | Lam Research Corporation | Three or more states for achieving high aspect ratio dielectric etch |
| JP2023519960A (ja) * | 2020-04-06 | 2023-05-15 | ラム リサーチ コーポレーション | プラズマシース安定化のための無線周波数パルス開始電力スパイクを制御するための方法およびシステム |
| JP7588516B2 (ja) * | 2020-05-14 | 2024-11-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
-
2022
- 2022-12-22 CN CN202280091964.4A patent/CN118715590A/zh active Pending
- 2022-12-22 WO PCT/US2022/053888 patent/WO2023158491A1/en not_active Ceased
- 2022-12-22 JP JP2024547659A patent/JP2025507374A/ja active Pending
- 2022-12-22 US US18/836,734 patent/US20250166967A1/en active Pending
- 2022-12-22 KR KR1020247030805A patent/KR20240144432A/ko active Pending
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