JPWO2023148967A1 - - Google Patents

Info

Publication number
JPWO2023148967A1
JPWO2023148967A1 JP2023500380A JP2023500380A JPWO2023148967A1 JP WO2023148967 A1 JPWO2023148967 A1 JP WO2023148967A1 JP 2023500380 A JP2023500380 A JP 2023500380A JP 2023500380 A JP2023500380 A JP 2023500380A JP WO2023148967 A1 JPWO2023148967 A1 JP WO2023148967A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023500380A
Other languages
Japanese (ja)
Other versions
JP7442013B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023148967A1 publication Critical patent/JPWO2023148967A1/ja
Application granted granted Critical
Publication of JP7442013B2 publication Critical patent/JP7442013B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • Testing And Monitoring For Control Systems (AREA)
JP2023500380A 2022-02-07 2022-02-07 診断装置、診断方法、半導体製造装置システム及び半導体装置製造システム Active JP7442013B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/004679 WO2023148967A1 (ja) 2022-02-07 2022-02-07 診断装置、診断方法、半導体製造装置システム及び半導体装置製造システム

Publications (2)

Publication Number Publication Date
JPWO2023148967A1 true JPWO2023148967A1 (https=) 2023-08-10
JP7442013B2 JP7442013B2 (ja) 2024-03-01

Family

ID=87552003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023500380A Active JP7442013B2 (ja) 2022-02-07 2022-02-07 診断装置、診断方法、半導体製造装置システム及び半導体装置製造システム

Country Status (6)

Country Link
US (1) US20240395518A1 (https=)
JP (1) JP7442013B2 (https=)
KR (1) KR102863239B1 (https=)
CN (1) CN116897411A (https=)
TW (1) TWI854452B (https=)
WO (1) WO2023148967A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250040892A (ko) * 2023-09-15 2025-03-25 주식회사 히타치하이테크 프로세스 처리 장치의 진단 장치, 진단 시스템, 및 진단 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283000A (ja) * 2009-06-02 2010-12-16 Renesas Electronics Corp 半導体製造における装置異常の予兆検知方法
JP2012009064A (ja) * 2011-09-05 2012-01-12 Toshiba Corp 学習型プロセス異常診断装置、およびオペレータ判断推測結果収集装置
WO2018061842A1 (ja) * 2016-09-27 2018-04-05 東京エレクトロン株式会社 異常検知プログラム、異常検知方法および異常検知装置
WO2020152889A1 (ja) * 2019-07-30 2020-07-30 株式会社日立ハイテク 装置診断装置、プラズマ処理装置及び装置診断方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6421457B1 (en) * 1999-02-12 2002-07-16 Applied Materials, Inc. Process inspection using full and segment waveform matching
US7413672B1 (en) * 2006-04-04 2008-08-19 Lam Research Corporation Controlling plasma processing using parameters derived through the use of a planar ion flux probing arrangement
EP2254112B1 (en) * 2008-03-21 2017-12-20 Tokyo University Of Science Educational Foundation Administrative Organization Noise suppression devices and noise suppression methods
US20100076729A1 (en) * 2008-09-19 2010-03-25 Applied Materials, Inc. Self-diagnostic semiconductor equipment
WO2011002811A2 (en) * 2009-06-30 2011-01-06 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US9200950B2 (en) * 2014-02-25 2015-12-01 Applied Materials, Inc. Pulsed plasma monitoring using optical sensor and a signal analyzer forming a mean waveform
EP3796362A1 (en) * 2019-09-23 2021-03-24 TRUMPF Huettinger Sp. Z o. o. Method of plasma processing a substrate in a plasma chamber and plasma processing system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283000A (ja) * 2009-06-02 2010-12-16 Renesas Electronics Corp 半導体製造における装置異常の予兆検知方法
JP2012009064A (ja) * 2011-09-05 2012-01-12 Toshiba Corp 学習型プロセス異常診断装置、およびオペレータ判断推測結果収集装置
WO2018061842A1 (ja) * 2016-09-27 2018-04-05 東京エレクトロン株式会社 異常検知プログラム、異常検知方法および異常検知装置
WO2020152889A1 (ja) * 2019-07-30 2020-07-30 株式会社日立ハイテク 装置診断装置、プラズマ処理装置及び装置診断方法

Also Published As

Publication number Publication date
US20240395518A1 (en) 2024-11-28
KR20230120121A (ko) 2023-08-16
TW202333073A (zh) 2023-08-16
TWI854452B (zh) 2024-09-01
CN116897411A (zh) 2023-10-17
WO2023148967A1 (ja) 2023-08-10
JP7442013B2 (ja) 2024-03-01
KR102863239B1 (ko) 2025-09-22

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