JPWO2023100770A1 - - Google Patents

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Publication number
JPWO2023100770A1
JPWO2023100770A1 JP2023538155A JP2023538155A JPWO2023100770A1 JP WO2023100770 A1 JPWO2023100770 A1 JP WO2023100770A1 JP 2023538155 A JP2023538155 A JP 2023538155A JP 2023538155 A JP2023538155 A JP 2023538155A JP WO2023100770 A1 JPWO2023100770 A1 JP WO2023100770A1
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JP
Japan
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JP2023538155A
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Japanese (ja)
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JP7395072B2 (ja
JPWO2023100770A5 (https=
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
JP2023538155A 2021-11-30 2022-11-25 シラン化合物重合体 Active JP7395072B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021194147 2021-11-30
JP2021194147 2021-11-30
PCT/JP2022/043562 WO2023100770A1 (ja) 2021-11-30 2022-11-25 シラン化合物重合体

Publications (3)

Publication Number Publication Date
JPWO2023100770A1 true JPWO2023100770A1 (https=) 2023-06-08
JPWO2023100770A5 JPWO2023100770A5 (https=) 2023-11-02
JP7395072B2 JP7395072B2 (ja) 2023-12-08

Family

ID=86612129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023538155A Active JP7395072B2 (ja) 2021-11-30 2022-11-25 シラン化合物重合体

Country Status (5)

Country Link
JP (1) JP7395072B2 (https=)
KR (1) KR20240112867A (https=)
CN (1) CN118317994A (https=)
TW (1) TW202328302A (https=)
WO (1) WO2023100770A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000281971A (ja) * 1999-03-29 2000-10-10 Shin Etsu Chem Co Ltd シリコーン樹脂含有エマルジョン塗料組成物及びこの組成物の硬化被膜が形成された物品
JP2014171974A (ja) * 2013-03-08 2014-09-22 Asahi Glass Co Ltd ハードコート被膜付き樹脂基板の製造方法およびハードコート被膜付き樹脂基板
JP2016146434A (ja) * 2015-02-09 2016-08-12 住友化学株式会社 半導体発光装置の製造方法及び半導体発光装置
WO2017122796A1 (ja) * 2016-01-15 2017-07-20 シチズン時計株式会社 縮合反応型のダイボンディング剤、ｌｅｄ発光装置及びその製造方法
WO2017122762A1 (ja) * 2016-01-15 2017-07-20 ペルノックス株式会社 縮合反応型シリコーン組成物及び硬化物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4734832B2 (ja) 2003-05-14 2011-07-27 ナガセケムテックス株式会社 光素子用封止材
JP2005263869A (ja) 2004-03-16 2005-09-29 Nagase Chemtex Corp 光半導体封止用樹脂組成物
JP2006328231A (ja) 2005-05-26 2006-12-07 Nagase Chemtex Corp 光素子用封止樹脂組成物
JP6146856B2 (ja) 2012-03-06 2017-06-14 公立大学法人首都大学東京 ポリシルセスキオキサン液体及びポリシルセスキオキサンガラスならびにその製造方法
JP2016098245A (ja) 2014-11-18 2016-05-30 住友化学株式会社 ポリシルセスキオキサン液体及びその製造方法、ｌｅｄ封止用組成物、ｌｅｄ封止材、及び半導体発光装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000281971A (ja) * 1999-03-29 2000-10-10 Shin Etsu Chem Co Ltd シリコーン樹脂含有エマルジョン塗料組成物及びこの組成物の硬化被膜が形成された物品
JP2014171974A (ja) * 2013-03-08 2014-09-22 Asahi Glass Co Ltd ハードコート被膜付き樹脂基板の製造方法およびハードコート被膜付き樹脂基板
JP2016146434A (ja) * 2015-02-09 2016-08-12 住友化学株式会社 半導体発光装置の製造方法及び半導体発光装置
WO2017122796A1 (ja) * 2016-01-15 2017-07-20 シチズン時計株式会社 縮合反応型のダイボンディング剤、ｌｅｄ発光装置及びその製造方法
WO2017122762A1 (ja) * 2016-01-15 2017-07-20 ペルノックス株式会社 縮合反応型シリコーン組成物及び硬化物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ABE Y., ET AL.: "Preparation and properties of flexible thin films by acid-catalyzed hydrolytic polycondensation of m", JOURNAL OF POLYMER SCIENCE, PART A: POLYMER CHEMISTRY, vol. 33, no. 4, JPN6023004512, 1995, pages 751 - 754, ISSN: 0005134191 *

Also Published As

Publication number Publication date
TW202328302A (zh) 2023-07-16
WO2023100770A1 (ja) 2023-06-08
JP7395072B2 (ja) 2023-12-08
KR20240112867A (ko) 2024-07-19
CN118317994A (zh) 2024-07-09

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