JPWO2023079726A5 - - Google Patents

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Publication number
JPWO2023079726A5
JPWO2023079726A5 JP2022502068A JP2022502068A JPWO2023079726A5 JP WO2023079726 A5 JPWO2023079726 A5 JP WO2023079726A5 JP 2022502068 A JP2022502068 A JP 2022502068A JP 2022502068 A JP2022502068 A JP 2022502068A JP WO2023079726 A5 JPWO2023079726 A5 JP WO2023079726A5
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JP
Japan
Prior art keywords
semiconductor layer
mounting surface
bonding
bonding surface
stacking direction
Prior art date
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JP2022502068A
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English (en)
Japanese (ja)
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JP7046294B1 (ja
JPWO2023079726A1 (https=
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Priority claimed from PCT/JP2021/040924 external-priority patent/WO2023079726A1/ja
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Publication of JP7046294B1 publication Critical patent/JP7046294B1/ja
Publication of JPWO2023079726A1 publication Critical patent/JPWO2023079726A1/ja
Publication of JPWO2023079726A5 publication Critical patent/JPWO2023079726A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022502068A 2021-11-08 2021-11-08 光半導体装置 Active JP7046294B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/040924 WO2023079726A1 (ja) 2021-11-08 2021-11-08 光半導体装置

Publications (3)

Publication Number Publication Date
JP7046294B1 JP7046294B1 (ja) 2022-04-01
JPWO2023079726A1 JPWO2023079726A1 (https=) 2023-05-11
JPWO2023079726A5 true JPWO2023079726A5 (https=) 2023-10-03

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ID=81255864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022502068A Active JP7046294B1 (ja) 2021-11-08 2021-11-08 光半導体装置

Country Status (4)

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US (1) US20250038474A1 (https=)
JP (1) JP7046294B1 (https=)
CN (1) CN118120121A (https=)
WO (1) WO2023079726A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11317565A (ja) * 1998-05-07 1999-11-16 Toshiba Corp 半導体表面処理用治具
JP4288620B2 (ja) * 2006-11-10 2009-07-01 ソニー株式会社 半導体発光素子およびその製造方法
JP4930322B2 (ja) * 2006-11-10 2012-05-16 ソニー株式会社 半導体発光素子、光ピックアップ装置および情報記録再生装置
EP3125008A1 (en) * 2015-07-29 2017-02-01 CCS Technology Inc. Method to manufacture optoelectronic modules
JP7241572B2 (ja) * 2019-03-08 2023-03-17 日本ルメンタム株式会社 半導体光素子、光モジュール、及び半導体光素子の製造方法

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