JPWO2023079726A1 - - Google Patents
Info
- Publication number
- JPWO2023079726A1 JPWO2023079726A1 JP2022502068A JP2022502068A JPWO2023079726A1 JP WO2023079726 A1 JPWO2023079726 A1 JP WO2023079726A1 JP 2022502068 A JP2022502068 A JP 2022502068A JP 2022502068 A JP2022502068 A JP 2022502068A JP WO2023079726 A1 JPWO2023079726 A1 JP WO2023079726A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/176—Specific passivation layers on surfaces other than the emission facet
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/040924 WO2023079726A1 (ja) | 2021-11-08 | 2021-11-08 | 光半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7046294B1 JP7046294B1 (ja) | 2022-04-01 |
| JPWO2023079726A1 true JPWO2023079726A1 (https=) | 2023-05-11 |
| JPWO2023079726A5 JPWO2023079726A5 (https=) | 2023-10-03 |
Family
ID=81255864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022502068A Active JP7046294B1 (ja) | 2021-11-08 | 2021-11-08 | 光半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250038474A1 (https=) |
| JP (1) | JP7046294B1 (https=) |
| CN (1) | CN118120121A (https=) |
| WO (1) | WO2023079726A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11317565A (ja) * | 1998-05-07 | 1999-11-16 | Toshiba Corp | 半導体表面処理用治具 |
| JP4288620B2 (ja) * | 2006-11-10 | 2009-07-01 | ソニー株式会社 | 半導体発光素子およびその製造方法 |
| JP4930322B2 (ja) * | 2006-11-10 | 2012-05-16 | ソニー株式会社 | 半導体発光素子、光ピックアップ装置および情報記録再生装置 |
| EP3125008A1 (en) * | 2015-07-29 | 2017-02-01 | CCS Technology Inc. | Method to manufacture optoelectronic modules |
| JP7241572B2 (ja) * | 2019-03-08 | 2023-03-17 | 日本ルメンタム株式会社 | 半導体光素子、光モジュール、及び半導体光素子の製造方法 |
-
2021
- 2021-11-08 CN CN202180103423.4A patent/CN118120121A/zh active Pending
- 2021-11-08 WO PCT/JP2021/040924 patent/WO2023079726A1/ja not_active Ceased
- 2021-11-08 US US18/688,165 patent/US20250038474A1/en active Pending
- 2021-11-08 JP JP2022502068A patent/JP7046294B1/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7046294B1 (ja) | 2022-04-01 |
| WO2023079726A1 (ja) | 2023-05-11 |
| CN118120121A (zh) | 2024-05-31 |
| US20250038474A1 (en) | 2025-01-30 |
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