JPWO2023037948A1 - - Google Patents
Info
- Publication number
- JPWO2023037948A1 JPWO2023037948A1 JP2023546907A JP2023546907A JPWO2023037948A1 JP WO2023037948 A1 JPWO2023037948 A1 JP WO2023037948A1 JP 2023546907 A JP2023546907 A JP 2023546907A JP 2023546907 A JP2023546907 A JP 2023546907A JP WO2023037948 A1 JPWO2023037948 A1 JP WO2023037948A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J4/00—Feed or outlet devices; Feed or outlet control devices
- B01J4/02—Feed or outlet devices; Feed or outlet control devices for feeding measured, i.e. prescribed quantities of reagents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021147115 | 2021-09-09 | ||
PCT/JP2022/032835 WO2023037948A1 (ja) | 2021-09-09 | 2022-08-31 | 気化器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023037948A1 true JPWO2023037948A1 (ja) | 2023-03-16 |
JPWO2023037948A5 JPWO2023037948A5 (ja) | 2024-06-03 |
Family
ID=85506656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023546907A Pending JPWO2023037948A1 (ja) | 2021-09-09 | 2022-08-31 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2023037948A1 (ja) |
KR (1) | KR20240052767A (ja) |
CN (1) | CN117916864A (ja) |
WO (1) | WO2023037948A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01163400A (ja) | 1987-12-17 | 1989-06-27 | Toshiba Corp | トンネルの換気制御装置 |
JP2538042B2 (ja) | 1989-03-29 | 1996-09-25 | 株式会社エステック | 有機金属化合物の気化供給方法とその装置 |
US5451258A (en) * | 1994-05-11 | 1995-09-19 | Materials Research Corporation | Apparatus and method for improved delivery of vaporized reactant gases to a reaction chamber |
JP3828821B2 (ja) | 2002-03-13 | 2006-10-04 | 株式会社堀場エステック | 液体材料気化供給装置 |
CN101522943B (zh) * | 2006-10-10 | 2013-04-24 | Asm美国公司 | 前体输送系统 |
JP5104151B2 (ja) | 2007-09-18 | 2012-12-19 | 東京エレクトロン株式会社 | 気化装置、成膜装置、成膜方法及び記憶媒体 |
JP2011054789A (ja) * | 2009-09-02 | 2011-03-17 | Hitachi Kokusai Electric Inc | 基板処理装置 |
-
2022
- 2022-08-31 WO PCT/JP2022/032835 patent/WO2023037948A1/ja active Application Filing
- 2022-08-31 KR KR1020247007608A patent/KR20240052767A/ko unknown
- 2022-08-31 CN CN202280060593.3A patent/CN117916864A/zh active Pending
- 2022-08-31 JP JP2023546907A patent/JPWO2023037948A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2023037948A1 (ja) | 2023-03-16 |
CN117916864A (zh) | 2024-04-19 |
KR20240052767A (ko) | 2024-04-23 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A527 Effective date: 20240216 |