JPWO2023007739A1 - - Google Patents
Info
- Publication number
- JPWO2023007739A1 JPWO2023007739A1 JP2023538196A JP2023538196A JPWO2023007739A1 JP WO2023007739 A1 JPWO2023007739 A1 JP WO2023007739A1 JP 2023538196 A JP2023538196 A JP 2023538196A JP 2023538196 A JP2023538196 A JP 2023538196A JP WO2023007739 A1 JPWO2023007739 A1 JP WO2023007739A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/028476 WO2023007739A1 (ja) | 2021-07-30 | 2021-07-30 | 搬送ロボットおよび部品実装システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023007739A1 true JPWO2023007739A1 (zh) | 2023-02-02 |
JP7518979B2 JP7518979B2 (ja) | 2024-07-18 |
Family
ID=85086624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023538196A Active JP7518979B2 (ja) | 2021-07-30 | 2021-07-30 | 搬送ロボットおよび部品実装システム |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7518979B2 (zh) |
CN (1) | CN117546621A (zh) |
DE (1) | DE112021007692T5 (zh) |
WO (1) | WO2023007739A1 (zh) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014010084A1 (ja) | 2012-07-13 | 2014-01-16 | 富士機械製造株式会社 | 部品実装システム |
JP6561317B2 (ja) * | 2016-06-01 | 2019-08-21 | パナソニックIpマネジメント株式会社 | 部品実装システム |
-
2021
- 2021-07-30 DE DE112021007692.2T patent/DE112021007692T5/de active Pending
- 2021-07-30 CN CN202180099694.7A patent/CN117546621A/zh active Pending
- 2021-07-30 WO PCT/JP2021/028476 patent/WO2023007739A1/ja active Application Filing
- 2021-07-30 JP JP2023538196A patent/JP7518979B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
DE112021007692T5 (de) | 2024-03-07 |
CN117546621A (zh) | 2024-02-09 |
WO2023007739A1 (ja) | 2023-02-02 |
JP7518979B2 (ja) | 2024-07-18 |
Similar Documents
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