JPWO2022259503A1 - - Google Patents
Info
- Publication number
- JPWO2022259503A1 JPWO2022259503A1 JP2023526791A JP2023526791A JPWO2022259503A1 JP WO2022259503 A1 JPWO2022259503 A1 JP WO2022259503A1 JP 2023526791 A JP2023526791 A JP 2023526791A JP 2023526791 A JP2023526791 A JP 2023526791A JP WO2022259503 A1 JPWO2022259503 A1 JP WO2022259503A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/022239 WO2022259503A1 (ja) | 2021-06-11 | 2021-06-11 | 圧接型半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022259503A1 true JPWO2022259503A1 (https=) | 2022-12-15 |
| JPWO2022259503A5 JPWO2022259503A5 (https=) | 2024-03-08 |
| JP7580601B2 JP7580601B2 (ja) | 2024-11-11 |
Family
ID=84425101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023526791A Active JP7580601B2 (ja) | 2021-06-11 | 2021-06-11 | 圧接型半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7580601B2 (https=) |
| DE (1) | DE112021007808B4 (https=) |
| WO (1) | WO2022259503A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01152668A (ja) * | 1987-12-09 | 1989-06-15 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
| JP2002057260A (ja) * | 2000-08-09 | 2002-02-22 | Fuji Electric Co Ltd | 平型半導体装置 |
| JP2002151646A (ja) * | 2000-11-10 | 2002-05-24 | Toshiba Corp | 圧接型半導体装置 |
| US20020145188A1 (en) * | 1999-09-07 | 2002-10-10 | Hironori Kodama | Flat semiconductor device and power converter employing the same |
| JP2017084850A (ja) * | 2015-10-22 | 2017-05-18 | 日本発條株式会社 | 電力用半導体装置 |
| WO2019116736A1 (ja) * | 2017-12-12 | 2019-06-20 | 三菱電機株式会社 | 圧接型半導体装置及び圧接型半導体装置の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3256636B2 (ja) | 1994-09-15 | 2002-02-12 | 株式会社東芝 | 圧接型半導体装置 |
| US5726466A (en) * | 1995-09-11 | 1998-03-10 | Kabushiki Kaisha Toshiba | Press pack power semiconductor device incorporating a plurality of semiconductor elements |
| JP3684834B2 (ja) * | 1998-04-21 | 2005-08-17 | 三菱電機株式会社 | 圧接型半導体装置 |
-
2021
- 2021-06-11 DE DE112021007808.9T patent/DE112021007808B4/de active Active
- 2021-06-11 WO PCT/JP2021/022239 patent/WO2022259503A1/ja not_active Ceased
- 2021-06-11 JP JP2023526791A patent/JP7580601B2/ja active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01152668A (ja) * | 1987-12-09 | 1989-06-15 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
| US20020145188A1 (en) * | 1999-09-07 | 2002-10-10 | Hironori Kodama | Flat semiconductor device and power converter employing the same |
| JP2002057260A (ja) * | 2000-08-09 | 2002-02-22 | Fuji Electric Co Ltd | 平型半導体装置 |
| JP2002151646A (ja) * | 2000-11-10 | 2002-05-24 | Toshiba Corp | 圧接型半導体装置 |
| JP2017084850A (ja) * | 2015-10-22 | 2017-05-18 | 日本発條株式会社 | 電力用半導体装置 |
| WO2019116736A1 (ja) * | 2017-12-12 | 2019-06-20 | 三菱電機株式会社 | 圧接型半導体装置及び圧接型半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112021007808T5 (de) | 2024-03-21 |
| DE112021007808B4 (de) | 2025-11-13 |
| JP7580601B2 (ja) | 2024-11-11 |
| WO2022259503A1 (ja) | 2022-12-15 |
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