JPWO2022255141A1 - - Google Patents

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Publication number
JPWO2022255141A1
JPWO2022255141A1 JP2023525736A JP2023525736A JPWO2022255141A1 JP WO2022255141 A1 JPWO2022255141 A1 JP WO2022255141A1 JP 2023525736 A JP2023525736 A JP 2023525736A JP 2023525736 A JP2023525736 A JP 2023525736A JP WO2022255141 A1 JPWO2022255141 A1 JP WO2022255141A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023525736A
Other languages
Japanese (ja)
Other versions
JP7812373B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022255141A1 publication Critical patent/JPWO2022255141A1/ja
Application granted granted Critical
Publication of JP7812373B2 publication Critical patent/JP7812373B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023525736A 2021-06-02 2022-05-23 接着剤組成物 Active JP7812373B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021092772 2021-06-02
JP2021092772 2021-06-02
PCT/JP2022/021075 WO2022255141A1 (ja) 2021-06-02 2022-05-23 接着剤組成物

Publications (2)

Publication Number Publication Date
JPWO2022255141A1 true JPWO2022255141A1 (https=) 2022-12-08
JP7812373B2 JP7812373B2 (ja) 2026-02-09

Family

ID=84323324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023525736A Active JP7812373B2 (ja) 2021-06-02 2022-05-23 接着剤組成物

Country Status (2)

Country Link
JP (1) JP7812373B2 (https=)
WO (1) WO2022255141A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7708694B2 (ja) * 2021-07-05 2025-07-15 信越ポリマー株式会社 積層板及びその製造方法
JPWO2024143120A1 (https=) * 2022-12-27 2024-07-04
WO2025079399A1 (ja) * 2023-10-13 2025-04-17 コニカミノルタ株式会社 組成物、熱硬化性接着剤、積層体、積層体の製造方法、フレキシブル回路基板及び半導体装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007051226A (ja) * 2005-08-18 2007-03-01 Ajinomoto Co Inc 低誘電率樹脂組成物
JP2009161725A (ja) * 2007-05-31 2009-07-23 Mitsubishi Gas Chem Co Inc 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
WO2018097010A1 (ja) * 2016-11-24 2018-05-31 ナミックス株式会社 樹脂組成物、それを用いた熱硬化性フィルム、樹脂硬化物、積層板、プリント配線板、および半導体装置
JP2019099712A (ja) * 2017-12-05 2019-06-24 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
WO2020090634A1 (ja) * 2018-10-31 2020-05-07 三井化学株式会社 ベンダブル配線基板、伸縮できる配線基板およびそれらによる電子デバイス
WO2020130008A1 (ja) * 2018-12-18 2020-06-25 日立化成株式会社 複合材及びその製造方法、プリプレグ、積層板、プリント配線板並びに半導体パッケージ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6493745B2 (ja) * 2015-03-31 2019-04-03 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板及びプリント配線板及び半導体パッケージ
JP6863126B2 (ja) * 2017-06-22 2021-04-21 昭和電工マテリアルズ株式会社 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
WO2019230945A1 (ja) * 2018-06-01 2019-12-05 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007051226A (ja) * 2005-08-18 2007-03-01 Ajinomoto Co Inc 低誘電率樹脂組成物
JP2009161725A (ja) * 2007-05-31 2009-07-23 Mitsubishi Gas Chem Co Inc 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
WO2018097010A1 (ja) * 2016-11-24 2018-05-31 ナミックス株式会社 樹脂組成物、それを用いた熱硬化性フィルム、樹脂硬化物、積層板、プリント配線板、および半導体装置
JP2019099712A (ja) * 2017-12-05 2019-06-24 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
WO2020090634A1 (ja) * 2018-10-31 2020-05-07 三井化学株式会社 ベンダブル配線基板、伸縮できる配線基板およびそれらによる電子デバイス
WO2020130008A1 (ja) * 2018-12-18 2020-06-25 日立化成株式会社 複合材及びその製造方法、プリプレグ、積層板、プリント配線板並びに半導体パッケージ

Also Published As

Publication number Publication date
WO2022255141A1 (ja) 2022-12-08
JP7812373B2 (ja) 2026-02-09

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