JPWO2022244194A1 - - Google Patents
Info
- Publication number
- JPWO2022244194A1 JPWO2022244194A1 JP2023522124A JP2023522124A JPWO2022244194A1 JP WO2022244194 A1 JPWO2022244194 A1 JP WO2022244194A1 JP 2023522124 A JP2023522124 A JP 2023522124A JP 2023522124 A JP2023522124 A JP 2023522124A JP WO2022244194 A1 JPWO2022244194 A1 JP WO2022244194A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
- H01R13/2478—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point spherical
Landscapes
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/019177 WO2022244194A1 (ja) | 2021-05-20 | 2021-05-20 | 電極端子、半導体装置および半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022244194A1 true JPWO2022244194A1 (https=) | 2022-11-24 |
| JPWO2022244194A5 JPWO2022244194A5 (https=) | 2024-01-04 |
| JP7515715B2 JP7515715B2 (ja) | 2024-07-12 |
Family
ID=84141552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023522124A Active JP7515715B2 (ja) | 2021-05-20 | 2021-05-20 | 電極端子、半導体装置および半導体装置の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7515715B2 (https=) |
| DE (1) | DE112021007682T5 (https=) |
| WO (1) | WO2022244194A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316075U (https=) * | 1989-06-29 | 1991-02-18 | ||
| JP2000331141A (ja) * | 1999-05-17 | 2000-11-30 | Sony Corp | 情報記録媒体および情報記録媒体を備える電子機器 |
| JP2013051052A (ja) * | 2011-08-30 | 2013-03-14 | Denso Corp | 脱着接続構造 |
-
2021
- 2021-05-20 DE DE112021007682.5T patent/DE112021007682T5/de active Pending
- 2021-05-20 JP JP2023522124A patent/JP7515715B2/ja active Active
- 2021-05-20 WO PCT/JP2021/019177 patent/WO2022244194A1/ja not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316075U (https=) * | 1989-06-29 | 1991-02-18 | ||
| JP2000331141A (ja) * | 1999-05-17 | 2000-11-30 | Sony Corp | 情報記録媒体および情報記録媒体を備える電子機器 |
| JP2013051052A (ja) * | 2011-08-30 | 2013-03-14 | Denso Corp | 脱着接続構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112021007682T5 (de) | 2024-02-29 |
| JP7515715B2 (ja) | 2024-07-12 |
| WO2022244194A1 (ja) | 2022-11-24 |
Similar Documents
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