JPWO2022224886A1 - - Google Patents
Info
- Publication number
- JPWO2022224886A1 JPWO2022224886A1 JP2023515431A JP2023515431A JPWO2022224886A1 JP WO2022224886 A1 JPWO2022224886 A1 JP WO2022224886A1 JP 2023515431 A JP2023515431 A JP 2023515431A JP 2023515431 A JP2023515431 A JP 2023515431A JP WO2022224886 A1 JPWO2022224886 A1 JP WO2022224886A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021072460 | 2021-04-22 | ||
| PCT/JP2022/017679 WO2022224886A1 (ja) | 2021-04-22 | 2022-04-13 | 湿式処理装置およびフレキシブルプリント基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022224886A1 true JPWO2022224886A1 (https=) | 2022-10-27 |
| JPWO2022224886A5 JPWO2022224886A5 (https=) | 2024-02-09 |
Family
ID=83722954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023515431A Pending JPWO2022224886A1 (https=) | 2021-04-22 | 2022-04-13 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12460312B2 (https=) |
| JP (1) | JPWO2022224886A1 (https=) |
| CN (1) | CN117178082A (https=) |
| WO (1) | WO2022224886A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181870U (ja) * | 1983-05-18 | 1984-12-04 | 三菱電機株式会社 | 条材の連続電気メツキ装置の回収槽 |
| JP2003147582A (ja) * | 2001-11-09 | 2003-05-21 | Nichiyo Engineering Kk | 連続湿式処理方法及び装置並びに液シール方法及び装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008072403A1 (ja) * | 2006-12-14 | 2008-06-19 | Nichiyo Engineering Corporation | 非接触液シール装置及び方法 |
| JP6448494B2 (ja) | 2015-07-29 | 2019-01-09 | 株式会社エリアデザイン | サクションめっき装置 |
-
2022
- 2022-04-13 US US18/286,999 patent/US12460312B2/en active Active
- 2022-04-13 WO PCT/JP2022/017679 patent/WO2022224886A1/ja not_active Ceased
- 2022-04-13 JP JP2023515431A patent/JPWO2022224886A1/ja active Pending
- 2022-04-13 CN CN202280029725.6A patent/CN117178082A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181870U (ja) * | 1983-05-18 | 1984-12-04 | 三菱電機株式会社 | 条材の連続電気メツキ装置の回収槽 |
| JP2003147582A (ja) * | 2001-11-09 | 2003-05-21 | Nichiyo Engineering Kk | 連続湿式処理方法及び装置並びに液シール方法及び装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240200220A1 (en) | 2024-06-20 |
| WO2022224886A1 (ja) | 2022-10-27 |
| CN117178082A (zh) | 2023-12-05 |
| US12460312B2 (en) | 2025-11-04 |
Similar Documents
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