JPWO2022224470A1 - - Google Patents
Info
- Publication number
- JPWO2022224470A1 JPWO2022224470A1 JP2023516025A JP2023516025A JPWO2022224470A1 JP WO2022224470 A1 JPWO2022224470 A1 JP WO2022224470A1 JP 2023516025 A JP2023516025 A JP 2023516025A JP 2023516025 A JP2023516025 A JP 2023516025A JP WO2022224470 A1 JPWO2022224470 A1 JP WO2022224470A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02551—Characteristics of substrate, e.g. cutting angles of quartz substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14544—Transducers of particular shape or position
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021071400 | 2021-04-20 | ||
| JP2021071400 | 2021-04-20 | ||
| PCT/JP2021/039760 WO2022224470A1 (ja) | 2021-04-20 | 2021-10-28 | 共振子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022224470A1 true JPWO2022224470A1 (https=) | 2022-10-27 |
| JPWO2022224470A5 JPWO2022224470A5 (https=) | 2023-09-01 |
| JP7587766B2 JP7587766B2 (ja) | 2024-11-21 |
Family
ID=83722182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023516025A Active JP7587766B2 (ja) | 2021-04-20 | 2021-10-28 | 共振子 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230402991A1 (https=) |
| JP (1) | JP7587766B2 (https=) |
| CN (1) | CN116888891A (https=) |
| DE (1) | DE212021000552U1 (https=) |
| WO (1) | WO2022224470A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12483221B2 (en) | 2021-07-15 | 2025-11-25 | Skyworks Solutions, Inc. | Multilayer piezoelectric substrate device with partially recessed passivation layer |
| US12542524B2 (en) * | 2022-04-08 | 2026-02-03 | Skyworks Solutions, Inc. | Acoustic wave device with trench portions and narrow interdigital transducer tip portions for transverse mode suppression |
| CN118337167A (zh) * | 2024-04-10 | 2024-07-12 | 无锡市好达电子股份有限公司 | 弹性波装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005065160A (ja) * | 2003-08-20 | 2005-03-10 | Seiko Epson Corp | 弾性表面波デバイス及びその製造方法 |
| JP2006191330A (ja) * | 2005-01-06 | 2006-07-20 | Epson Toyocom Corp | 弾性表面波デバイス |
| WO2019138812A1 (ja) * | 2018-01-12 | 2019-07-18 | 株式会社村田製作所 | 弾性波装置、マルチプレクサ、高周波フロントエンド回路、及び通信装置 |
| WO2020121976A1 (ja) * | 2018-12-13 | 2020-06-18 | 株式会社村田製作所 | 弾性波装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006203408A (ja) | 2005-01-19 | 2006-08-03 | Epson Toyocom Corp | 弾性表面波デバイス |
| CN103262410B (zh) | 2010-12-24 | 2016-08-10 | 株式会社村田制作所 | 弹性波装置及其制造方法 |
| JP7080671B2 (ja) | 2018-02-27 | 2022-06-06 | ＮＤＫ ＳＡＷ ｄｅｖｉｃｅｓ株式会社 | 弾性表面波デバイス |
-
2021
- 2021-10-28 CN CN202180094132.3A patent/CN116888891A/zh active Pending
- 2021-10-28 WO PCT/JP2021/039760 patent/WO2022224470A1/ja not_active Ceased
- 2021-10-28 JP JP2023516025A patent/JP7587766B2/ja active Active
- 2021-10-28 DE DE212021000552.7U patent/DE212021000552U1/de active Active
-
2023
- 2023-08-24 US US18/454,954 patent/US20230402991A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005065160A (ja) * | 2003-08-20 | 2005-03-10 | Seiko Epson Corp | 弾性表面波デバイス及びその製造方法 |
| JP2006191330A (ja) * | 2005-01-06 | 2006-07-20 | Epson Toyocom Corp | 弾性表面波デバイス |
| WO2019138812A1 (ja) * | 2018-01-12 | 2019-07-18 | 株式会社村田製作所 | 弾性波装置、マルチプレクサ、高周波フロントエンド回路、及び通信装置 |
| WO2020121976A1 (ja) * | 2018-12-13 | 2020-06-18 | 株式会社村田製作所 | 弾性波装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116888891A (zh) | 2023-10-13 |
| US20230402991A1 (en) | 2023-12-14 |
| WO2022224470A1 (ja) | 2022-10-27 |
| JP7587766B2 (ja) | 2024-11-21 |
| DE212021000552U1 (de) | 2023-11-07 |
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