JPWO2022208603A1 - - Google Patents
Info
- Publication number
- JPWO2022208603A1 JPWO2022208603A1 JP2023509917A JP2023509917A JPWO2022208603A1 JP WO2022208603 A1 JPWO2022208603 A1 JP WO2022208603A1 JP 2023509917 A JP2023509917 A JP 2023509917A JP 2023509917 A JP2023509917 A JP 2023509917A JP WO2022208603 A1 JPWO2022208603 A1 JP WO2022208603A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/013259 WO2022208603A1 (ja) | 2021-03-29 | 2021-03-29 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022208603A1 true JPWO2022208603A1 (https=) | 2022-10-06 |
| JP7438454B2 JP7438454B2 (ja) | 2024-02-26 |
Family
ID=83455713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023509917A Active JP7438454B2 (ja) | 2021-03-29 | 2021-03-29 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240071868A1 (https=) |
| JP (1) | JP7438454B2 (https=) |
| CN (1) | CN117043939A (https=) |
| DE (1) | DE112021007408T5 (https=) |
| WO (1) | WO2022208603A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0277870U (https=) * | 1988-12-02 | 1990-06-14 | ||
| JPH05144986A (ja) * | 1991-11-25 | 1993-06-11 | Fuji Electric Co Ltd | トランジスタモジユール |
| JPH09121019A (ja) * | 1995-10-25 | 1997-05-06 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0277870A (ja) * | 1988-06-30 | 1990-03-16 | Mitsubishi Electric Corp | 並列計算機システム |
| DE102008005547B4 (de) * | 2008-01-23 | 2013-08-29 | Infineon Technologies Ag | Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul |
| CN105981167B (zh) * | 2014-08-12 | 2019-05-28 | 富士电机株式会社 | 半导体装置 |
| BE1028071B1 (de) * | 2020-02-19 | 2021-09-13 | Phoenix Contact Gmbh & Co | Elektrisches Kontaktelement |
-
2021
- 2021-03-29 JP JP2023509917A patent/JP7438454B2/ja active Active
- 2021-03-29 CN CN202180096198.6A patent/CN117043939A/zh active Pending
- 2021-03-29 WO PCT/JP2021/013259 patent/WO2022208603A1/ja not_active Ceased
- 2021-03-29 US US18/260,592 patent/US20240071868A1/en active Pending
- 2021-03-29 DE DE112021007408.3T patent/DE112021007408T5/de active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0277870U (https=) * | 1988-12-02 | 1990-06-14 | ||
| JPH05144986A (ja) * | 1991-11-25 | 1993-06-11 | Fuji Electric Co Ltd | トランジスタモジユール |
| JPH09121019A (ja) * | 1995-10-25 | 1997-05-06 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112021007408T5 (de) | 2024-01-18 |
| JP7438454B2 (ja) | 2024-02-26 |
| US20240071868A1 (en) | 2024-02-29 |
| WO2022208603A1 (ja) | 2022-10-06 |
| CN117043939A (zh) | 2023-11-10 |
Similar Documents
Legal Events
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