JPWO2022145170A1 - - Google Patents
Info
- Publication number
- JPWO2022145170A1 JPWO2022145170A1 JP2022572947A JP2022572947A JPWO2022145170A1 JP WO2022145170 A1 JPWO2022145170 A1 JP WO2022145170A1 JP 2022572947 A JP2022572947 A JP 2022572947A JP 2022572947 A JP2022572947 A JP 2022572947A JP WO2022145170 A1 JPWO2022145170 A1 JP WO2022145170A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/18—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/20—Electroplating: Baths therefor from solutions of iron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/67—Electroplating to repair workpiece
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0642—Anodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020219501 | 2020-12-28 | ||
| PCT/JP2021/044238 WO2022145170A1 (ja) | 2020-12-28 | 2021-12-02 | 金属で物品を電気めっきする方法及びシステム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022145170A1 true JPWO2022145170A1 (enrdf_load_stackoverflow) | 2022-07-07 |
Family
ID=82260376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022572947A Pending JPWO2022145170A1 (enrdf_load_stackoverflow) | 2020-12-28 | 2021-12-02 |
Country Status (6)
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5155781A (en) * | 1974-11-12 | 1976-05-17 | Tdk Electronics Co Ltd | Kinzokusankabutsuhifukudenkyoku |
| JPS5329752U (enrdf_load_stackoverflow) * | 1976-08-20 | 1978-03-14 | ||
| JPS5974291A (ja) * | 1982-10-21 | 1984-04-26 | インステイチユ−ツ・ポ・フイジコチミア | 光沢ニツケル−鉄合金電析用浴 |
| JP6582353B1 (ja) * | 2019-02-15 | 2019-10-02 | ディップソール株式会社 | 亜鉛又は亜鉛合金電気めっき方法及びシステム |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8377283B2 (en) * | 2002-11-25 | 2013-02-19 | Coventya, Inc. | Zinc and zinc-alloy electroplating |
| JP6222121B2 (ja) | 2015-01-21 | 2017-11-01 | 株式会社豊田中央研究所 | 不溶性電極の製造方法 |
| RU2613826C1 (ru) | 2015-07-22 | 2017-03-21 | Дипсол Кемикалз Ко., Лтд. | Способ гальваностегии цинковым сплавом |
| CN106550606B (zh) | 2015-07-22 | 2019-04-26 | 迪普索股份公司 | 锌合金镀敷方法 |
| JP6724976B2 (ja) | 2016-02-25 | 2020-07-15 | 株式会社豊田中央研究所 | 金属酸化物膜およびその製造方法 |
| EP3358045A1 (de) | 2017-02-07 | 2018-08-08 | Dr.Ing. Max Schlötter GmbH & Co. KG | Verfahren zur galvanischen abscheidung von zink- und zinklegierungsüberzügen aus einem alkalischen beschichtungsbad mit reduziertem abbau von organischen badzusätzen |
-
2021
- 2021-12-02 US US18/259,579 patent/US20240392461A1/en active Pending
- 2021-12-02 EP EP21915031.5A patent/EP4269663A4/en active Pending
- 2021-12-02 WO PCT/JP2021/044238 patent/WO2022145170A1/ja not_active Ceased
- 2021-12-02 CN CN202180087593.8A patent/CN116670334A/zh active Pending
- 2021-12-02 JP JP2022572947A patent/JPWO2022145170A1/ja active Pending
- 2021-12-21 TW TW110147947A patent/TW202233528A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5155781A (en) * | 1974-11-12 | 1976-05-17 | Tdk Electronics Co Ltd | Kinzokusankabutsuhifukudenkyoku |
| JPS5329752U (enrdf_load_stackoverflow) * | 1976-08-20 | 1978-03-14 | ||
| JPS5974291A (ja) * | 1982-10-21 | 1984-04-26 | インステイチユ−ツ・ポ・フイジコチミア | 光沢ニツケル−鉄合金電析用浴 |
| JP6582353B1 (ja) * | 2019-02-15 | 2019-10-02 | ディップソール株式会社 | 亜鉛又は亜鉛合金電気めっき方法及びシステム |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4269663A1 (en) | 2023-11-01 |
| WO2022145170A1 (ja) | 2022-07-07 |
| CN116670334A (zh) | 2023-08-29 |
| TW202233528A (zh) | 2022-09-01 |
| EP4269663A4 (en) | 2024-09-18 |
| US20240392461A1 (en) | 2024-11-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240905 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250818 |