JPWO2022113961A1 - - Google Patents

Info

Publication number
JPWO2022113961A1
JPWO2022113961A1 JP2022565344A JP2022565344A JPWO2022113961A1 JP WO2022113961 A1 JPWO2022113961 A1 JP WO2022113961A1 JP 2022565344 A JP2022565344 A JP 2022565344A JP 2022565344 A JP2022565344 A JP 2022565344A JP WO2022113961 A1 JPWO2022113961 A1 JP WO2022113961A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022565344A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022113961A1 publication Critical patent/JPWO2022113961A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/60—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds
    • C08G63/605—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds the hydroxy and carboxylic groups being bound to aromatic rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/12—Polymer mixtures characterised by other features containing additives being liquid crystalline or anisotropic in the melt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Laminated Bodies (AREA)
JP2022565344A 2020-11-24 2021-11-24 Pending JPWO2022113961A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020194655 2020-11-24
JP2021188867 2021-11-19
PCT/JP2021/042876 WO2022113961A1 (ja) 2020-11-24 2021-11-24 液晶ポリマーフィルム、ポリマーフィルム、及び、積層体

Publications (1)

Publication Number Publication Date
JPWO2022113961A1 true JPWO2022113961A1 (https=) 2022-06-02

Family

ID=81754616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022565344A Pending JPWO2022113961A1 (https=) 2020-11-24 2021-11-24

Country Status (3)

Country Link
US (1) US12532414B2 (https=)
JP (1) JPWO2022113961A1 (https=)
WO (1) WO2022113961A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023191012A1 (https=) * 2022-03-31 2023-10-05
WO2024122276A1 (ja) * 2022-12-09 2024-06-13 富士フイルム株式会社 ポリマーフィルム、積層体及び金属付き積層体
WO2025057987A1 (ja) * 2023-09-15 2025-03-20 富士フイルム株式会社 積層体、アンテナ基板、及びアンテナモジュール
TW202536073A (zh) * 2023-12-12 2025-09-16 日商東洋鋼鈑股份有限公司 液晶聚合物薄膜層積體、液晶聚合物薄膜層積體的製造方法、液晶聚合物薄膜的製造方法，及液晶聚合物薄膜

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004083681A (ja) * 2002-08-26 2004-03-18 Hitachi Ltd 低誘電正接樹脂組成物と液晶ポリマーの複合フィルムおよびそれを用いたフレキシブル配線基板
WO2004060656A1 (ja) * 2003-01-06 2004-07-22 Toray Industries, Inc. 積層フィルムおよびその製造方法
JP2005105165A (ja) * 2003-09-30 2005-04-21 Kuraray Co Ltd 低温積層可能な熱可塑性液晶ポリマーフィルム
JP2015074157A (ja) * 2013-10-08 2015-04-20 東レ・デュポン株式会社 ポリイミド樹脂−液晶ポリマー複合フィルム及びその製造方法
JP2016062954A (ja) * 2014-09-16 2016-04-25 株式会社プライマテック 電子回路基板用積層体および電子回路基板
JP2016117281A (ja) * 2014-12-18 2016-06-30 住友化学株式会社 三層フィルム、三層フィルムの製造方法、積層板及びプリント回路基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719354A (en) * 1994-09-16 1998-02-17 Hoechst Celanese Corp. Monolithic LCP polymer microelectronic wiring modules
US5962122A (en) * 1995-11-28 1999-10-05 Hoechst Celanese Corporation Liquid crystalline polymer composites having high dielectric constant
US6605324B1 (en) * 1999-10-07 2003-08-12 Toray Industries, Inc. Liquid crystal resin laminated film, method for manufacturing the same, and circuit board comprising liquid crystal resin laminated film
WO2002049404A2 (en) * 2000-12-14 2002-06-20 World Properties Inc. Liquid crystalline polymer bond plies and circuits formed therefrom
JP5355957B2 (ja) * 2008-07-31 2013-11-27 住友化学株式会社 積層体及びその製造方法並びに回路基板用部材
JP5879157B2 (ja) 2011-03-07 2016-03-08 富士フイルム株式会社 光学フィルム、積層体、位相差フィルム、偏光板及び光学フィルムの製造方法
JP6205877B2 (ja) * 2013-06-07 2017-10-04 株式会社村田製作所 高耐熱性液晶ポリマーフィルムとその製造方法
TWI650358B (zh) 2017-09-14 2019-02-11 佳勝科技股份有限公司 液晶高分子組成物及高頻複合基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004083681A (ja) * 2002-08-26 2004-03-18 Hitachi Ltd 低誘電正接樹脂組成物と液晶ポリマーの複合フィルムおよびそれを用いたフレキシブル配線基板
WO2004060656A1 (ja) * 2003-01-06 2004-07-22 Toray Industries, Inc. 積層フィルムおよびその製造方法
JP2005105165A (ja) * 2003-09-30 2005-04-21 Kuraray Co Ltd 低温積層可能な熱可塑性液晶ポリマーフィルム
JP2015074157A (ja) * 2013-10-08 2015-04-20 東レ・デュポン株式会社 ポリイミド樹脂−液晶ポリマー複合フィルム及びその製造方法
JP2016062954A (ja) * 2014-09-16 2016-04-25 株式会社プライマテック 電子回路基板用積層体および電子回路基板
JP2016117281A (ja) * 2014-12-18 2016-06-30 住友化学株式会社 三層フィルム、三層フィルムの製造方法、積層板及びプリント回路基板

Also Published As

Publication number Publication date
WO2022113961A1 (ja) 2022-06-02
US20230292434A1 (en) 2023-09-14
US12532414B2 (en) 2026-01-20

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