JPWO2022074952A1 - - Google Patents
Info
- Publication number
- JPWO2022074952A1 JPWO2022074952A1 JP2022555295A JP2022555295A JPWO2022074952A1 JP WO2022074952 A1 JPWO2022074952 A1 JP WO2022074952A1 JP 2022555295 A JP2022555295 A JP 2022555295A JP 2022555295 A JP2022555295 A JP 2022555295A JP WO2022074952 A1 JPWO2022074952 A1 JP WO2022074952A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020168349 | 2020-10-05 | ||
| JP2020168349 | 2020-10-05 | ||
| PCT/JP2021/031177 WO2022074952A1 (ja) | 2020-10-05 | 2021-08-25 | 半導体試験装置および半導体試験方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022074952A1 true JPWO2022074952A1 (https=) | 2022-04-14 |
| JP7479498B2 JP7479498B2 (ja) | 2024-05-08 |
Family
ID=81125779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022555295A Active JP7479498B2 (ja) | 2020-10-05 | 2021-08-25 | 半導体試験装置および半導体試験方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7479498B2 (https=) |
| CN (1) | CN116325104A (https=) |
| WO (1) | WO2022074952A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120188268A (zh) * | 2022-11-17 | 2025-06-20 | 三菱电机株式会社 | 半导体试验装置、半导体试验方法以及半导体装置的制造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233437U (https=) * | 1988-08-26 | 1990-03-02 | ||
| JP2006071467A (ja) * | 2004-09-02 | 2006-03-16 | Toyota Industries Corp | 半導体チップの電気特性測定方法及び装置 |
| JP2011138865A (ja) * | 2009-12-28 | 2011-07-14 | Micronics Japan Co Ltd | 半導体デバイスの検査装置 |
| JP2012151323A (ja) * | 2011-01-20 | 2012-08-09 | Toshiba Corp | 半導体装置およびその製造方法 |
| JP2014036105A (ja) * | 2012-08-08 | 2014-02-24 | Mitsubishi Electric Corp | 半導体装置の測定方法、測定器 |
| JP2018179618A (ja) * | 2017-04-06 | 2018-11-15 | トヨタ自動車株式会社 | 半導体素子の検査装置 |
| JP2019125642A (ja) * | 2018-01-15 | 2019-07-25 | 信越半導体株式会社 | 半導体装置の評価装置 |
-
2021
- 2021-08-25 CN CN202180066270.0A patent/CN116325104A/zh active Pending
- 2021-08-25 WO PCT/JP2021/031177 patent/WO2022074952A1/ja not_active Ceased
- 2021-08-25 JP JP2022555295A patent/JP7479498B2/ja active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233437U (https=) * | 1988-08-26 | 1990-03-02 | ||
| JP2006071467A (ja) * | 2004-09-02 | 2006-03-16 | Toyota Industries Corp | 半導体チップの電気特性測定方法及び装置 |
| JP2011138865A (ja) * | 2009-12-28 | 2011-07-14 | Micronics Japan Co Ltd | 半導体デバイスの検査装置 |
| JP2012151323A (ja) * | 2011-01-20 | 2012-08-09 | Toshiba Corp | 半導体装置およびその製造方法 |
| JP2014036105A (ja) * | 2012-08-08 | 2014-02-24 | Mitsubishi Electric Corp | 半導体装置の測定方法、測定器 |
| JP2018179618A (ja) * | 2017-04-06 | 2018-11-15 | トヨタ自動車株式会社 | 半導体素子の検査装置 |
| JP2019125642A (ja) * | 2018-01-15 | 2019-07-25 | 信越半導体株式会社 | 半導体装置の評価装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7479498B2 (ja) | 2024-05-08 |
| CN116325104A (zh) | 2023-06-23 |
| WO2022074952A1 (ja) | 2022-04-14 |
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