JPWO2022070910A1 - - Google Patents

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Publication number
JPWO2022070910A1
JPWO2022070910A1 JP2022553794A JP2022553794A JPWO2022070910A1 JP WO2022070910 A1 JPWO2022070910 A1 JP WO2022070910A1 JP 2022553794 A JP2022553794 A JP 2022553794A JP 2022553794 A JP2022553794 A JP 2022553794A JP WO2022070910 A1 JPWO2022070910 A1 JP WO2022070910A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022553794A
Other languages
Japanese (ja)
Other versions
JP7576805B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022070910A1 publication Critical patent/JPWO2022070910A1/ja
Priority to JP2024091175A priority Critical patent/JP7770637B2/ja
Application granted granted Critical
Publication of JP7576805B2 publication Critical patent/JP7576805B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
JP2022553794A 2020-10-01 2021-09-15 低温半田、低温半田の製造方法、および低温半田被覆リード線 Active JP7576805B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024091175A JP7770637B2 (ja) 2020-10-01 2024-06-05 低温半田、低温半田の製造方法、および低温半田被覆リード線

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020166977 2020-10-01
JP2020166977 2020-10-01
JP2020219193 2020-12-28
JP2020219193 2020-12-28
PCT/JP2021/033865 WO2022070910A1 (ja) 2020-10-01 2021-09-15 低温半田、低温半田の製造方法、および低温半田被覆リード線

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024091175A Division JP7770637B2 (ja) 2020-10-01 2024-06-05 低温半田、低温半田の製造方法、および低温半田被覆リード線

Publications (2)

Publication Number Publication Date
JPWO2022070910A1 true JPWO2022070910A1 (https=) 2022-04-07
JP7576805B2 JP7576805B2 (ja) 2024-11-01

Family

ID=80951440

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022553794A Active JP7576805B2 (ja) 2020-10-01 2021-09-15 低温半田、低温半田の製造方法、および低温半田被覆リード線
JP2024091175A Active JP7770637B2 (ja) 2020-10-01 2024-06-05 低温半田、低温半田の製造方法、および低温半田被覆リード線

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024091175A Active JP7770637B2 (ja) 2020-10-01 2024-06-05 低温半田、低温半田の製造方法、および低温半田被覆リード線

Country Status (5)

Country Link
JP (2) JP7576805B2 (https=)
KR (1) KR102877569B1 (https=)
CN (1) CN116324001A (https=)
TW (2) TW202344326A (https=)
WO (1) WO2022070910A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116324001A (zh) * 2020-10-01 2023-06-23 亚特比目有限会社 低温焊料、低温焊料的制造方法及低温焊料包覆导线
US11832386B2 (en) * 2021-12-16 2023-11-28 Dell Products L.P. Solder composition for use in solder joints of printed circuit boards

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141079A (ja) * 1998-09-04 2000-05-23 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
JP2005296983A (ja) * 2004-04-09 2005-10-27 Hitachi Metals Ltd はんだ合金およびはんだボール
JP2010167472A (ja) * 2009-01-26 2010-08-05 Fujitsu Ltd はんだ、はんだ付け方法及び半導体装置
JP2013248664A (ja) * 2012-06-04 2013-12-12 Nippon Genma:Kk 鉛フリーはんだ合金およびはんだペースト
WO2015019966A1 (ja) * 2013-08-05 2015-02-12 千住金属工業株式会社 鉛フリーはんだ合金
JP2016026884A (ja) * 2014-07-02 2016-02-18 住友金属鉱山株式会社 中低温用のＢｉ−Ｓｎ−Ａｌ系はんだ合金及びはんだペースト
JP2019527145A (ja) * 2016-08-11 2019-09-26 ベイジン コンポー アドバンスト テクノロジー カンパニー リミテッドＢｅｉｊｉｎｇ Ｃｏｍｐｏ Ａｄｖａｎｃｅｄ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． ＳｎＢｉＳｂ系低温鉛フリーはんだ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JP2007292901A (ja) 2006-04-24 2007-11-08 Optrex Corp 表示モジュール
US9279176B2 (en) 2008-11-27 2016-03-08 Hitachi Metals, Ltd. Lead wire for solar cell, manufacturing method and storage method thereof, and solar cell
TWI714127B (zh) * 2018-06-26 2020-12-21 日商亞特比目有限公司 太陽能電池及太陽能電池的製造方法
CN108971793B (zh) * 2018-08-24 2021-04-23 云南科威液态金属谷研发有限公司 一种低温无铅焊料
TW202206614A (zh) 2019-07-12 2022-02-16 日商亞特比目有限公司 ＳｎＺｎ焊料及其製造方法
CN116324001A (zh) 2020-10-01 2023-06-23 亚特比目有限会社 低温焊料、低温焊料的制造方法及低温焊料包覆导线

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141079A (ja) * 1998-09-04 2000-05-23 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
JP2005296983A (ja) * 2004-04-09 2005-10-27 Hitachi Metals Ltd はんだ合金およびはんだボール
JP2010167472A (ja) * 2009-01-26 2010-08-05 Fujitsu Ltd はんだ、はんだ付け方法及び半導体装置
JP2013248664A (ja) * 2012-06-04 2013-12-12 Nippon Genma:Kk 鉛フリーはんだ合金およびはんだペースト
WO2015019966A1 (ja) * 2013-08-05 2015-02-12 千住金属工業株式会社 鉛フリーはんだ合金
JP2016026884A (ja) * 2014-07-02 2016-02-18 住友金属鉱山株式会社 中低温用のＢｉ−Ｓｎ−Ａｌ系はんだ合金及びはんだペースト
JP2019527145A (ja) * 2016-08-11 2019-09-26 ベイジン コンポー アドバンスト テクノロジー カンパニー リミテッドＢｅｉｊｉｎｇ Ｃｏｍｐｏ Ａｄｖａｎｃｅｄ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． ＳｎＢｉＳｂ系低温鉛フリーはんだ

Also Published As

Publication number Publication date
CN116324001A (zh) 2023-06-23
JP7576805B2 (ja) 2024-11-01
KR102877569B1 (ko) 2025-10-27
KR20230075504A (ko) 2023-05-31
JP2024113075A (ja) 2024-08-21
WO2022070910A1 (ja) 2022-04-07
TW202219286A (zh) 2022-05-16
TW202344326A (zh) 2023-11-16
JP7770637B2 (ja) 2025-11-17

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