JPWO2022050372A1 - - Google Patents
Info
- Publication number
- JPWO2022050372A1 JPWO2022050372A1 JP2022546980A JP2022546980A JPWO2022050372A1 JP WO2022050372 A1 JPWO2022050372 A1 JP WO2022050372A1 JP 2022546980 A JP2022546980 A JP 2022546980A JP 2022546980 A JP2022546980 A JP 2022546980A JP WO2022050372 A1 JPWO2022050372 A1 JP WO2022050372A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025201682A JP2026035670A (ja) | 2020-09-04 | 2025-11-21 | 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物および当該硬化物を有する電子部品 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020148967 | 2020-09-04 | ||
| JP2020148967 | 2020-09-04 | ||
| PCT/JP2021/032395 WO2022050372A1 (ja) | 2020-09-04 | 2021-09-03 | 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物および当該硬化物を有する電子部品 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025201682A Division JP2026035670A (ja) | 2020-09-04 | 2025-11-21 | 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物および当該硬化物を有する電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022050372A1 true JPWO2022050372A1 (https=) | 2022-03-10 |
| JP7781759B2 JP7781759B2 (ja) | 2025-12-08 |
Family
ID=80492239
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022546980A Active JP7781759B2 (ja) | 2020-09-04 | 2021-09-03 | 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物および当該硬化物を有する電子部品 |
| JP2025201682A Pending JP2026035670A (ja) | 2020-09-04 | 2025-11-21 | 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物および当該硬化物を有する電子部品 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025201682A Pending JP2026035670A (ja) | 2020-09-04 | 2025-11-21 | 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物および当該硬化物を有する電子部品 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP7781759B2 (https=) |
| KR (2) | KR20260003441A (https=) |
| CN (1) | CN115989456A (https=) |
| WO (1) | WO2022050372A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117820559B (zh) * | 2022-09-29 | 2025-12-30 | 苏州铼赛智能科技有限公司 | 辐射可固化的树脂组合物及其制备方法 |
| CN119717390A (zh) * | 2023-09-28 | 2025-03-28 | 太阳油墨（苏州）有限公司 | 无三聚氰胺碱性显影型树脂组合物、干膜、固化物和具有该固化物的电子部件 |
| CN120161672A (zh) * | 2023-12-15 | 2025-06-17 | 太阳油墨（苏州）有限公司 | 感光性热固性树脂组合物、干膜、固化物和具有该固化物的电子部件 |
| CN118981145B (zh) * | 2024-08-01 | 2025-03-21 | 韶关市远望涂料厂有限公司 | 一种感光性干膜材料及其制备方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004048434A1 (ja) * | 2002-11-28 | 2004-06-10 | Taiyo Ink Manufacturing Co., Ltd. | 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板 |
| JP2008299294A (ja) * | 2007-06-04 | 2008-12-11 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線 |
| JP2011133670A (ja) * | 2009-12-24 | 2011-07-07 | Tamura Seisakusho Co Ltd | スプレー塗装用白色ソルダーレジスト組成物 |
| JP2015059983A (ja) * | 2013-09-17 | 2015-03-30 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| JP2017003967A (ja) * | 2015-06-05 | 2017-01-05 | 太陽インキ製造株式会社 | アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| WO2018123695A1 (ja) * | 2016-12-28 | 2018-07-05 | 太陽インキ製造株式会社 | 硬化性組成物、主剤および硬化剤、ドライフィルム、硬化物、および、プリント配線板 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5688116B2 (ja) | 2013-05-13 | 2015-03-25 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| JP5722418B1 (ja) * | 2013-12-02 | 2015-05-20 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| JP6759323B2 (ja) * | 2018-03-28 | 2020-09-23 | 太陽インキ製造株式会社 | 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板 |
| CN111868628B (zh) * | 2018-03-30 | 2024-09-03 | 太阳控股株式会社 | 碱显影型光固化性热固化性树脂组合物 |
-
2021
- 2021-09-03 KR KR1020257043730A patent/KR20260003441A/ko active Pending
- 2021-09-03 JP JP2022546980A patent/JP7781759B2/ja active Active
- 2021-09-03 KR KR1020237010932A patent/KR102907739B1/ko active Active
- 2021-09-03 CN CN202180052677.8A patent/CN115989456A/zh active Pending
- 2021-09-03 WO PCT/JP2021/032395 patent/WO2022050372A1/ja not_active Ceased
-
2025
- 2025-11-21 JP JP2025201682A patent/JP2026035670A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004048434A1 (ja) * | 2002-11-28 | 2004-06-10 | Taiyo Ink Manufacturing Co., Ltd. | 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板 |
| JP2008299294A (ja) * | 2007-06-04 | 2008-12-11 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線 |
| JP2011133670A (ja) * | 2009-12-24 | 2011-07-07 | Tamura Seisakusho Co Ltd | スプレー塗装用白色ソルダーレジスト組成物 |
| JP2015059983A (ja) * | 2013-09-17 | 2015-03-30 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| JP2017003967A (ja) * | 2015-06-05 | 2017-01-05 | 太陽インキ製造株式会社 | アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| WO2018123695A1 (ja) * | 2016-12-28 | 2018-07-05 | 太陽インキ製造株式会社 | 硬化性組成物、主剤および硬化剤、ドライフィルム、硬化物、および、プリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202219169A (zh) | 2022-05-16 |
| JP2026035670A (ja) | 2026-03-04 |
| CN115989456A (zh) | 2023-04-18 |
| KR20260003441A (ko) | 2026-01-06 |
| KR102907739B1 (ko) | 2026-01-05 |
| KR20230061448A (ko) | 2023-05-08 |
| WO2022050372A1 (ja) | 2022-03-10 |
| JP7781759B2 (ja) | 2025-12-08 |
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