JPWO2022045157A1 - - Google Patents

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Publication number
JPWO2022045157A1
JPWO2022045157A1 JP2022545649A JP2022545649A JPWO2022045157A1 JP WO2022045157 A1 JPWO2022045157 A1 JP WO2022045157A1 JP 2022545649 A JP2022545649 A JP 2022545649A JP 2022545649 A JP2022545649 A JP 2022545649A JP WO2022045157 A1 JPWO2022045157 A1 JP WO2022045157A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022545649A
Other languages
Japanese (ja)
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JP7716415B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2022045157A1 publication Critical patent/JPWO2022045157A1/ja
Application granted granted Critical
Publication of JP7716415B2 publication Critical patent/JP7716415B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2022545649A 2020-08-27 2021-08-24 接着剤組成物 Active JP7716415B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020143253 2020-08-27
JP2020143253 2020-08-27
PCT/JP2021/031051 WO2022045157A1 (ja) 2020-08-27 2021-08-24 接着剤組成物

Publications (2)

Publication Number Publication Date
JPWO2022045157A1 true JPWO2022045157A1 (https=) 2022-03-03
JP7716415B2 JP7716415B2 (ja) 2025-07-31

Family

ID=80353964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022545649A Active JP7716415B2 (ja) 2020-08-27 2021-08-24 接着剤組成物

Country Status (3)

Country Link
JP (1) JP7716415B2 (https=)
TW (1) TWI858283B (https=)
WO (1) WO2022045157A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7638661B2 (ja) * 2020-10-21 2025-03-04 Ｐｓジャパン株式会社 樹脂組成物、マスターバッチ及びシート
WO2022113963A1 (ja) * 2020-11-24 2022-06-02 富士フイルム株式会社 ポリマーフィルム、及び、積層体
JP7342917B2 (ja) * 2021-07-26 2023-09-12 東洋インキＳｃホールディングス株式会社 接着性樹脂シート、プリント配線板および、電子機器。
JP2023157050A (ja) * 2022-04-14 2023-10-26 アイカ工業株式会社 低誘電率樹脂組成物
KR20260032559A (ko) * 2023-07-06 2026-03-09 가부시끼가이샤 레조낙 경화성 수지 조성물, 경화성 필름, 및 적층 필름

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340593A (ja) * 1998-05-29 1999-12-10 Shin Etsu Polymer Co Ltd プリント配線基板用積層板およびこの製造方法
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP2015040296A (ja) * 2013-08-23 2015-03-02 独立行政法人産業技術総合研究所 誘電体用樹脂組成物および高周波誘電体デバイス
JP2017132858A (ja) * 2016-01-26 2017-08-03 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板及び多層プリント配線板
WO2017154995A1 (ja) * 2016-03-08 2017-09-14 東洋インキＳｃホールディングス株式会社 積層体およびその製造方法、並びに接着層付樹脂フィルム
JP2018150541A (ja) * 2014-07-31 2018-09-27 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP2018170492A (ja) * 2017-11-21 2018-11-01 東洋インキＳｃホールディングス株式会社 電子部品保護シート
WO2019216352A1 (ja) * 2018-05-11 2019-11-14 日立化成株式会社 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム
JP2019199612A (ja) * 2017-02-20 2019-11-21 株式会社有沢製作所 樹脂組成物、接着フィルム、カバーレイフィルム、積層板、樹脂付き銅箔及び樹脂付き銅張り積層板
WO2020071153A1 (ja) * 2018-10-02 2020-04-09 ナミックス株式会社 樹脂組成物、基材付フィルム、金属／樹脂積層体および半導体装置
JP2020180245A (ja) * 2019-04-26 2020-11-05 Ａｇｃ株式会社 パウダー分散液、積層体の製造方法、積層体及びプリント基板の製造方法
WO2021131268A1 (ja) * 2019-12-23 2021-07-01 信越ポリマー株式会社 接着剤組成物
JP6909342B1 (ja) * 2020-07-31 2021-07-28 アイカ工業株式会社 樹脂組成物及びそれを用いた接着シート
WO2022255137A1 (ja) * 2021-06-02 2022-12-08 信越ポリマー株式会社 接着剤組成物

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340593A (ja) * 1998-05-29 1999-12-10 Shin Etsu Polymer Co Ltd プリント配線基板用積層板およびこの製造方法
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP2015040296A (ja) * 2013-08-23 2015-03-02 独立行政法人産業技術総合研究所 誘電体用樹脂組成物および高周波誘電体デバイス
JP2018150541A (ja) * 2014-07-31 2018-09-27 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP2018150542A (ja) * 2014-07-31 2018-09-27 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP2017132858A (ja) * 2016-01-26 2017-08-03 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板及び多層プリント配線板
WO2017154995A1 (ja) * 2016-03-08 2017-09-14 東洋インキＳｃホールディングス株式会社 積層体およびその製造方法、並びに接着層付樹脂フィルム
JP2019199612A (ja) * 2017-02-20 2019-11-21 株式会社有沢製作所 樹脂組成物、接着フィルム、カバーレイフィルム、積層板、樹脂付き銅箔及び樹脂付き銅張り積層板
JP2018170492A (ja) * 2017-11-21 2018-11-01 東洋インキＳｃホールディングス株式会社 電子部品保護シート
WO2019216352A1 (ja) * 2018-05-11 2019-11-14 日立化成株式会社 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム
WO2020071153A1 (ja) * 2018-10-02 2020-04-09 ナミックス株式会社 樹脂組成物、基材付フィルム、金属／樹脂積層体および半導体装置
WO2020071154A1 (ja) * 2018-10-02 2020-04-09 ナミックス株式会社 樹脂組成物、フィルム、積層板および半導体装置
JP2020180245A (ja) * 2019-04-26 2020-11-05 Ａｇｃ株式会社 パウダー分散液、積層体の製造方法、積層体及びプリント基板の製造方法
WO2021131268A1 (ja) * 2019-12-23 2021-07-01 信越ポリマー株式会社 接着剤組成物
JP6909342B1 (ja) * 2020-07-31 2021-07-28 アイカ工業株式会社 樹脂組成物及びそれを用いた接着シート
WO2022255137A1 (ja) * 2021-06-02 2022-12-08 信越ポリマー株式会社 接着剤組成物

Also Published As

Publication number Publication date
WO2022045157A1 (ja) 2022-03-03
TWI858283B (zh) 2024-10-11
JP7716415B2 (ja) 2025-07-31
TW202214808A (zh) 2022-04-16

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