JPWO2022026061A5

JPWO2022026061A5 -

Info

Publication number: JPWO2022026061A5
Application number: JP2023505452A
Authority: JP
Publication date: 2024-06-17

Claims

A deposition source comprising:
An evaporation crucible for evaporating the material,
a vapor distributor comprising a plurality of nozzles for directing the evaporated material towards a substrate;
a vapor conduit extending a length of the conduit from the evaporation crucible to the vapor distributor and providing a fluid connection between the evaporation crucible and the vapor distributor, at least one nozzle of the plurality of nozzles having a nozzle axis extending a length of the conduit or substantially parallel to a length of the conduit; and
1. A vapor deposition source comprising: a first shield leaving a first vapor passageway past the first shield; and a second shield leaving a second vapor passageway past the second shield, the second vapor passageway having a baffle arrangement in the vapor conduit such that the second vapor passageway does not overlap the first vapor passageway along the length of the conduit .

The deposition source of claim 1, wherein the baffle arrangement prevents all linear propagation paths through the vapor conduit from the evaporation crucible to the vapor distributor.

The baffle arrangement comprises:
Reducing heat radiation from the vapor distributor into the evaporation crucible through the vapor conduit; and preventing material splashing from the evaporation crucible into the vapor distributor.
The deposition source of claim 1 configured to perform at least one of the following:

4. The deposition source of claim 1, wherein the first and second shielding plates extend substantially perpendicular to a length of the vapor conduit and are fixedly mounted within the vapor conduit.

4. The deposition source of claim 1, wherein the baffle arrangement comprises polished metal or a polished metal coating configured to reflect radiation from an interior volume of the vapour distributor .

4. The deposition source according to claim 1, wherein the second shielding plate is disposed at a distance of 3 cm or less from the first shielding plate in the longitudinal direction of the conduit.

4. The deposition source according to claim 1, wherein the first shielding plate is an annular plate circumferentially tangent to an inner wall of the vapor conduit and having a round or circular opening, and the second shielding plate is a round or circular plate centrally located in the vapor conduit, downstream or upstream of the opening, and shielding the opening.

The deposition source according to any one of claims 1 to 3, wherein the nozzles are arranged in a plurality of nozzle rows extending in a row direction and arranged adjacent to each other.

the plurality of nozzles are directed toward a rotatable drum;
the row direction being substantially perpendicular to the length of the conduit;
The plurality of nozzle rows are arranged adjacent to each other in a circumferential direction of the rotatable drum.
The deposition source according to claim 8 .

The deposition source of claim 8, wherein the nozzle rows are offset from one another in the row direction by a row offset.

The deposition source according to any one of claims 1 to 3, wherein the evaporation crucible is at least partially disposed below the vapor distributor, and the length of the conduit and the nozzle axis extend vertically or at an angle of 45° or less to the vertical.

The deposition source according to any one of claims 1 to 3, further comprising a first heater for heating the evaporation crucible to a first temperature, a second heater for heating the vapor distributor to a second temperature that is greater than the first temperature, and a heater controller for controlling an evaporation rate by adjusting the first temperature.

1. A vapor deposition apparatus, comprising:
A deposition source according to any one of claims 1 to 3; and a rotatable drum having a curved drum surface for supporting the substrate.
Equipped with
1. A vapor deposition apparatus, comprising: a vapor deposition source configured to move a substrate past the vapor deposition source and onto the curved drum surface; and a vapor deposition apparatus configured to move the substrate past the vapor deposition source and onto the curved drum surface.

The vapor deposition apparatus of claim 13, further comprising an edge exclusion shield extending from the deposition source toward the curved drum surface and including an edge exclusion portion for masking areas of the substrate that should not be coated.

The deposition source of claim 14, wherein the end exclusion portion extends circumferentially along the curved drum surface and follows the curvature of the curved drum surface.

1. A method for coating a substrate in a vacuum chamber, comprising:
Evaporating material in an evaporation crucible;
directing the vaporized material through a vapor conduit extending the length of the conduit and into a vapor distributor comprising a plurality of nozzles;
directing the evaporated material toward the substrate by the plurality of nozzles having nozzle axes extending along or substantially parallel to the length of the conduit; and
a first shielding plate leaving a first vapor passageway after passing through the first shielding plate, and a second shielding plate leaving a second vapor passageway after passing through the second shielding plate, the second vapor passageway not overlapping the first vapor passageway along the length of the conduit; a baffle arrangement disposed within the vapor conduit to reduce heat radiation from the vapor distributor into the evaporation crucible and to prevent splashing from the evaporation crucible into the vapor distributor;
A method comprising:

17. The method of claim 16, further comprising: moving the substrate past the plurality of nozzles onto a curved drum surface of a rotatable drum; and masking areas of the substrate that should not be coated with an edge exclusion shield that follows the curvature of the curved drum surface.

The method of claim 16 or 17, wherein the nozzles are arranged in a plurality of nozzle rows extending in a row direction and arranged adjacent to each other, each nozzle row comprising five or more nozzles having a nozzle axis extending along or substantially parallel to the length of the conduit.

1. A vapor deposition apparatus, comprising:
a rotatable drum having a curved drum surface for supporting a substrate;
At least one deposition source,
An evaporation crucible for evaporating the material,
a steam distributor comprising a plurality of nozzles oriented toward the curved drum surface, the plurality of nozzles being arranged in a plurality of nozzle rows extending in a row direction and arranged adjacent to each other ;
a vapor conduit extending linearly along a length of the conduit from the evaporation crucible to the vapor distributor, the vapor conduit providing a fluid connection between the evaporation crucible and the vapor distributor; and
a baffle arrangement disposed within the steam conduit, the baffle arrangement comprising a first baffle plate leaving a first steam passageway past the first baffle plate and a second baffle plate leaving a second steam passageway past the second baffle plate, the second steam passageway not overlapping the first steam passageway along the length of the conduit;
At least one deposition source having
wherein the nozzle has a nozzle axis extending along or substantially parallel to the length of the conduit.

20. The vapor deposition apparatus of claim 19, comprising at least three deposition sources arranged circumferentially around the rotatable drum, each deposition source defining a coating window on the curved drum surface extending over an angular range of 10° to 45°, the lengths of conduits of adjacent deposition sources each subtending an angle of 10° to 45°.