JPWO2021255829A1 - - Google Patents

Info

Publication number
JPWO2021255829A1
JPWO2021255829A1 JP2020553554A JP2020553554A JPWO2021255829A1 JP WO2021255829 A1 JPWO2021255829 A1 JP WO2021255829A1 JP 2020553554 A JP2020553554 A JP 2020553554A JP 2020553554 A JP2020553554 A JP 2020553554A JP WO2021255829 A1 JPWO2021255829 A1 JP WO2021255829A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020553554A
Other versions
JP6852232B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP6852232B1 publication Critical patent/JP6852232B1/ja
Publication of JPWO2021255829A1 publication Critical patent/JPWO2021255829A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2020553554A 2020-06-16 2020-06-16 放熱部材及びこれを用いた放熱基板 Active JP6852232B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/023607 WO2021255829A1 (ja) 2020-06-16 2020-06-16 放熱部材及びこれを用いた放熱基板

Publications (2)

Publication Number Publication Date
JP6852232B1 JP6852232B1 (ja) 2021-03-31
JPWO2021255829A1 true JPWO2021255829A1 (ja) 2021-12-23

Family

ID=75154781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020553554A Active JP6852232B1 (ja) 2020-06-16 2020-06-16 放熱部材及びこれを用いた放熱基板

Country Status (2)

Country Link
JP (1) JP6852232B1 (ja)
WO (1) WO2021255829A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4159861B2 (ja) * 2002-11-26 2008-10-01 新日本無線株式会社 プリント回路基板の放熱構造の製造方法
JP4988609B2 (ja) * 2008-01-11 2012-08-01 株式会社日立国際電気 配線基板
JP5987314B2 (ja) * 2011-12-27 2016-09-07 イビデン株式会社 プリント配線板
JP6321979B2 (ja) * 2014-01-31 2018-05-09 京セラ株式会社 印刷配線板およびその製造方法

Also Published As

Publication number Publication date
JP6852232B1 (ja) 2021-03-31
WO2021255829A1 (ja) 2021-12-23

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