JPWO2021230224A1 - - Google Patents

Info

Publication number
JPWO2021230224A1
JPWO2021230224A1 JP2022521921A JP2022521921A JPWO2021230224A1 JP WO2021230224 A1 JPWO2021230224 A1 JP WO2021230224A1 JP 2022521921 A JP2022521921 A JP 2022521921A JP 2022521921 A JP2022521921 A JP 2022521921A JP WO2021230224 A1 JPWO2021230224 A1 JP WO2021230224A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022521921A
Other languages
Japanese (ja)
Other versions
JP7197057B2 (ja
JPWO2021230224A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021230224A1 publication Critical patent/JPWO2021230224A1/ja
Publication of JPWO2021230224A5 publication Critical patent/JPWO2021230224A5/ja
Application granted granted Critical
Publication of JP7197057B2 publication Critical patent/JP7197057B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/026—Coplanar striplines [CPS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
JP2022521921A 2020-05-15 2021-05-11 伝送線路 Active JP7197057B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020085754 2020-05-15
JP2020085754 2020-05-15
PCT/JP2021/017809 WO2021230224A1 (ja) 2020-05-15 2021-05-11 伝送線路

Publications (3)

Publication Number Publication Date
JPWO2021230224A1 true JPWO2021230224A1 (https=) 2021-11-18
JPWO2021230224A5 JPWO2021230224A5 (https=) 2022-12-08
JP7197057B2 JP7197057B2 (ja) 2022-12-27

Family

ID=78525887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022521921A Active JP7197057B2 (ja) 2020-05-15 2021-05-11 伝送線路

Country Status (4)

Country Link
US (1) US12191553B2 (https=)
JP (1) JP7197057B2 (https=)
CN (1) CN218827761U (https=)
WO (1) WO2021230224A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025069696A (ja) * 2023-10-18 2025-05-01 キヤノン株式会社 伝送装置及び伝送システム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184898A (ja) * 2000-10-04 2002-06-28 Murata Mfg Co Ltd 高周波モジュール
JP2007287916A (ja) * 2006-04-17 2007-11-01 Fujitsu Ltd 電子部品パッケージ
WO2014050238A1 (ja) * 2012-09-28 2014-04-03 株式会社村田製作所 信号線路モジュールおよび通信端末装置
WO2019189050A1 (ja) * 2018-03-30 2019-10-03 株式会社村田製作所 アンテナモジュールおよびそれを搭載した通信装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4004048B2 (ja) * 2003-04-11 2007-11-07 Ｔｄｋ株式会社 高周波伝送線路
JP4574322B2 (ja) 2004-10-21 2010-11-04 大日本印刷株式会社 インピーダンスコントロール配線板の製造方法
JP2009004809A (ja) 2008-09-16 2009-01-08 Kyocera Corp 配線基板
JP5730152B2 (ja) 2011-07-26 2015-06-03 京セラサーキットソリューションズ株式会社 配線基板
WO2016163436A1 (ja) 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器
CN207009625U (zh) 2015-09-25 2018-02-13 株式会社村田制作所 天线模块以及电子设备
JP6950747B2 (ja) * 2017-11-16 2021-10-13 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
JP2019106680A (ja) 2017-12-14 2019-06-27 日本電信電話株式会社 高周波伝送線路
CN217062469U (zh) * 2019-10-02 2022-07-26 株式会社村田制作所 传输线路以及电路基板
JP7180788B2 (ja) * 2019-11-15 2022-11-30 株式会社村田製作所 伝送線路及び電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184898A (ja) * 2000-10-04 2002-06-28 Murata Mfg Co Ltd 高周波モジュール
JP2007287916A (ja) * 2006-04-17 2007-11-01 Fujitsu Ltd 電子部品パッケージ
WO2014050238A1 (ja) * 2012-09-28 2014-04-03 株式会社村田製作所 信号線路モジュールおよび通信端末装置
WO2019189050A1 (ja) * 2018-03-30 2019-10-03 株式会社村田製作所 アンテナモジュールおよびそれを搭載した通信装置

Also Published As

Publication number Publication date
US12191553B2 (en) 2025-01-07
JP7197057B2 (ja) 2022-12-27
CN218827761U (zh) 2023-04-07
WO2021230224A1 (ja) 2021-11-18
US20230066411A1 (en) 2023-03-02

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