JPWO2021200719A5 - - Google Patents

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Publication number
JPWO2021200719A5
JPWO2021200719A5 JP2022512147A JP2022512147A JPWO2021200719A5 JP WO2021200719 A5 JPWO2021200719 A5 JP WO2021200719A5 JP 2022512147 A JP2022512147 A JP 2022512147A JP 2022512147 A JP2022512147 A JP 2022512147A JP WO2021200719 A5 JPWO2021200719 A5 JP WO2021200719A5
Authority
JP
Japan
Prior art keywords
boron nitride
sintered body
nitride sintered
thermal conductivity
boron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022512147A
Other languages
English (en)
Japanese (ja)
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JPWO2021200719A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2021/013048 external-priority patent/WO2021200719A1/ja
Publication of JPWO2021200719A1 publication Critical patent/JPWO2021200719A1/ja
Publication of JPWO2021200719A5 publication Critical patent/JPWO2021200719A5/ja
Pending legal-status Critical Current

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JP2022512147A 2020-03-31 2021-03-26 Pending JPWO2021200719A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020064844 2020-03-31
PCT/JP2021/013048 WO2021200719A1 (ja) 2020-03-31 2021-03-26 窒化ホウ素焼結体、複合体及びこれらの製造方法、並びに放熱部材

Publications (2)

Publication Number Publication Date
JPWO2021200719A1 JPWO2021200719A1 (https=) 2021-10-07
JPWO2021200719A5 true JPWO2021200719A5 (https=) 2022-12-13

Family

ID=77928474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022512147A Pending JPWO2021200719A1 (https=) 2020-03-31 2021-03-26

Country Status (5)

Country Link
US (1) US20230085806A1 (https=)
EP (1) EP4082993A4 (https=)
JP (1) JPWO2021200719A1 (https=)
CN (1) CN115066406A (https=)
WO (1) WO2021200719A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05159624A (ja) * 1991-12-04 1993-06-25 Denki Kagaku Kogyo Kk 絶縁放熱板
JPH10251069A (ja) * 1997-03-14 1998-09-22 Toshiba Corp 窒化珪素回路基板及び半導体装置
JP2002114575A (ja) * 2000-10-04 2002-04-16 Denki Kagaku Kogyo Kk 六方晶窒化ホウ素板及びその製造方法、用途
JP2003037382A (ja) * 2001-07-25 2003-02-07 Mitsubishi Gas Chem Co Inc 熱伝導性接着シート
JP6125273B2 (ja) 2013-02-27 2017-05-10 デンカ株式会社 窒化ホウ素成形体、その製造方法及び用途
WO2014196496A1 (ja) * 2013-06-03 2014-12-11 電気化学工業株式会社 樹脂含浸窒化ホウ素焼結体およびその用途
EP3035778B1 (en) * 2013-08-14 2018-10-03 Denka Company Limited Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
KR102560615B1 (ko) * 2015-08-26 2023-07-27 덴카 주식회사 열전도성 수지 조성물
US10487013B2 (en) * 2016-03-10 2019-11-26 Denka Company Limited Ceramic resin composite body
CN109790025B (zh) * 2016-10-07 2023-05-30 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
JP2019145744A (ja) * 2018-02-23 2019-08-29 イビデン株式会社 伝熱基板
JP7069314B2 (ja) * 2018-06-29 2022-05-17 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材

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