JPWO2021200719A1 - - Google Patents

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Publication number
JPWO2021200719A1
JPWO2021200719A1 JP2022512147A JP2022512147A JPWO2021200719A1 JP WO2021200719 A1 JPWO2021200719 A1 JP WO2021200719A1 JP 2022512147 A JP2022512147 A JP 2022512147A JP 2022512147 A JP2022512147 A JP 2022512147A JP WO2021200719 A1 JPWO2021200719 A1 JP WO2021200719A1
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Japan
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JP2022512147A
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Japanese (ja)
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JPWO2021200719A5 (https=
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    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022512147A 2020-03-31 2021-03-26 Pending JPWO2021200719A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020064844 2020-03-31
PCT/JP2021/013048 WO2021200719A1 (ja) 2020-03-31 2021-03-26 窒化ホウ素焼結体、複合体及びこれらの製造方法、並びに放熱部材

Publications (2)

Publication Number Publication Date
JPWO2021200719A1 true JPWO2021200719A1 (https=) 2021-10-07
JPWO2021200719A5 JPWO2021200719A5 (https=) 2022-12-13

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JP2022512147A Pending JPWO2021200719A1 (https=) 2020-03-31 2021-03-26

Country Status (5)

Country Link
US (1) US20230085806A1 (https=)
EP (1) EP4082993A4 (https=)
JP (1) JPWO2021200719A1 (https=)
CN (1) CN115066406A (https=)
WO (1) WO2021200719A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05159624A (ja) * 1991-12-04 1993-06-25 Denki Kagaku Kogyo Kk 絶縁放熱板
JPH10251069A (ja) * 1997-03-14 1998-09-22 Toshiba Corp 窒化珪素回路基板及び半導体装置
JP2002114575A (ja) * 2000-10-04 2002-04-16 Denki Kagaku Kogyo Kk 六方晶窒化ホウ素板及びその製造方法、用途
JP2003037382A (ja) * 2001-07-25 2003-02-07 Mitsubishi Gas Chem Co Inc 熱伝導性接着シート
WO2017155110A1 (ja) * 2016-03-10 2017-09-14 デンカ株式会社 セラミックス樹脂複合体
JP2019145744A (ja) * 2018-02-23 2019-08-29 イビデン株式会社 伝熱基板
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