JPWO2021200336A1 - - Google Patents
Info
- Publication number
- JPWO2021200336A1 JPWO2021200336A1 JP2022511955A JP2022511955A JPWO2021200336A1 JP WO2021200336 A1 JPWO2021200336 A1 JP WO2021200336A1 JP 2022511955 A JP2022511955 A JP 2022511955A JP 2022511955 A JP2022511955 A JP 2022511955A JP WO2021200336 A1 JPWO2021200336 A1 JP WO2021200336A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/778—Auxiliary members characterised by their shape in encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/468—Circuit boards
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/461—Leadframes specially adapted for cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020065762 | 2020-04-01 | ||
| JP2020065762 | 2020-04-01 | ||
| PCT/JP2021/011701 WO2021200336A1 (ja) | 2020-04-01 | 2021-03-22 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021200336A1 true JPWO2021200336A1 (https=) | 2021-10-07 |
| JP7607640B2 JP7607640B2 (ja) | 2024-12-27 |
Family
ID=77929554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022511955A Active JP7607640B2 (ja) | 2020-04-01 | 2021-03-22 | 電子装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12599006B2 (https=) |
| JP (1) | JP7607640B2 (https=) |
| CN (1) | CN115335986A (https=) |
| DE (2) | DE112021000700T5 (https=) |
| WO (1) | WO2021200336A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7716402B2 (ja) * | 2020-06-08 | 2025-07-31 | ローム株式会社 | 半導体装置 |
| USD1021830S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1022932S1 (en) * | 2021-03-16 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
| USD1021829S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| JP7779690B2 (ja) * | 2021-09-24 | 2025-12-03 | ローム株式会社 | 半導体装置、及び半導体モジュール |
| WO2026048723A1 (ja) * | 2024-08-29 | 2026-03-05 | ローム株式会社 | 半導体装置および車両 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017112153A (ja) * | 2015-12-14 | 2017-06-22 | 株式会社村田製作所 | パワー半導体モジュール |
| JP2019186321A (ja) * | 2018-04-05 | 2019-10-24 | ローム株式会社 | 半導体装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2938344B2 (ja) * | 1994-05-15 | 1999-08-23 | 株式会社東芝 | 半導体装置 |
| US6585905B1 (en) * | 1998-06-10 | 2003-07-01 | Asat Ltd. | Leadless plastic chip carrier with partial etch die attach pad |
| JPWO2007026944A1 (ja) * | 2005-08-31 | 2009-03-12 | 三洋電機株式会社 | 回路装置およびその製造方法 |
| KR101221807B1 (ko) | 2006-12-29 | 2013-01-14 | 페어차일드코리아반도체 주식회사 | 전력 소자 패키지 |
| JP6070955B2 (ja) * | 2011-09-30 | 2017-02-01 | ローム株式会社 | 半導体装置 |
| JP2015220429A (ja) * | 2014-05-21 | 2015-12-07 | ローム株式会社 | 半導体装置 |
| WO2016125363A1 (ja) | 2015-02-06 | 2016-08-11 | 株式会社 村田製作所 | パワー半導体モジュール |
| JP6633861B2 (ja) * | 2015-07-31 | 2020-01-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| EP3226014B1 (en) * | 2016-03-30 | 2024-01-10 | Mitsubishi Electric R&D Centre Europe B.V. | Method for estimating a level of damage or a lifetime expectation of a power semiconductor module comprising at least one die |
| US10580754B2 (en) * | 2016-04-01 | 2020-03-03 | Mitsubishi Electric Corporation | Semiconductor module with temperature detecting element |
| US10529672B2 (en) * | 2017-08-31 | 2020-01-07 | Stmicroelectronics, Inc. | Package with interlocking leads and manufacturing the same |
| JP7199167B2 (ja) | 2018-06-29 | 2023-01-05 | 三菱電機株式会社 | パワー半導体モジュール、電力変換装置、およびパワー半導体モジュールの製造方法 |
-
2021
- 2021-03-22 US US17/914,088 patent/US12599006B2/en active Active
- 2021-03-22 CN CN202180024866.4A patent/CN115335986A/zh active Pending
- 2021-03-22 WO PCT/JP2021/011701 patent/WO2021200336A1/ja not_active Ceased
- 2021-03-22 DE DE112021000700.9T patent/DE112021000700T5/de active Pending
- 2021-03-22 JP JP2022511955A patent/JP7607640B2/ja active Active
- 2021-03-22 DE DE212021000242.0U patent/DE212021000242U1/de active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017112153A (ja) * | 2015-12-14 | 2017-06-22 | 株式会社村田製作所 | パワー半導体モジュール |
| JP2019186321A (ja) * | 2018-04-05 | 2019-10-24 | ローム株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112021000700T5 (de) | 2022-11-17 |
| DE212021000242U1 (de) | 2022-05-19 |
| US20230121777A1 (en) | 2023-04-20 |
| US12599006B2 (en) | 2026-04-07 |
| JP7607640B2 (ja) | 2024-12-27 |
| WO2021200336A1 (ja) | 2021-10-07 |
| CN115335986A (zh) | 2022-11-11 |
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