JPWO2021125248A1 - - Google Patents

Info

Publication number
JPWO2021125248A1
JPWO2021125248A1 JP2021565634A JP2021565634A JPWO2021125248A1 JP WO2021125248 A1 JPWO2021125248 A1 JP WO2021125248A1 JP 2021565634 A JP2021565634 A JP 2021565634A JP 2021565634 A JP2021565634 A JP 2021565634A JP WO2021125248 A1 JPWO2021125248 A1 JP WO2021125248A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021565634A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021125248A1 publication Critical patent/JPWO2021125248A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021565634A 2019-12-17 2020-12-16 Pending JPWO2021125248A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019227734 2019-12-17
PCT/JP2020/047066 WO2021125248A1 (ja) 2019-12-17 2020-12-16 チップ抵抗器保護膜用放熱樹脂組成物、チップ抵抗器保護膜、及び電子部品

Publications (1)

Publication Number Publication Date
JPWO2021125248A1 true JPWO2021125248A1 (ja) 2021-06-24

Family

ID=76477648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021565634A Pending JPWO2021125248A1 (ja) 2019-12-17 2020-12-16

Country Status (3)

Country Link
JP (1) JPWO2021125248A1 (ja)
TW (1) TW202132396A (ja)
WO (1) WO2021125248A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023162928A1 (ja) * 2022-02-22 2023-08-31 積水化学工業株式会社 樹脂組成物及び半導体装置
WO2024154715A1 (ja) * 2023-01-16 2024-07-25 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート、積層板、金属箔張積層板、及びプリント配線板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632077B2 (ja) * 2002-10-15 2011-02-16 Ｄｉｃ株式会社 エポキシ樹脂組成物、エポキシ樹脂の製造方法、新規エポキシ樹脂、及び新規フェノール樹脂
JP4539025B2 (ja) * 2003-04-28 2010-09-08 Ｄｉｃ株式会社 液状封止材用樹脂組成物及び半導体装置
JP5314874B2 (ja) * 2007-10-05 2013-10-16 ナミックス株式会社 保護膜層用封止剤
JP5609357B2 (ja) * 2009-07-30 2014-10-22 東レ株式会社 組成物およびそれからなる組成物シート
JP5357697B2 (ja) * 2009-10-26 2013-12-04 ナミックス株式会社 チップ抵抗器または圧電発音体の保護膜用樹脂組成物
JP6176412B2 (ja) * 2014-12-24 2017-08-09 Dic株式会社 電子材料用エポキシ樹脂組成物、その硬化物および電子部材
JP7336636B2 (ja) * 2017-12-11 2023-09-01 パナソニックＩｐマネジメント株式会社 チップ抵抗器

Also Published As

Publication number Publication date
TW202132396A (zh) 2021-09-01
WO2021125248A1 (ja) 2021-06-24

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230907