JPWO2021065948A1 - - Google Patents

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Publication number
JPWO2021065948A1
JPWO2021065948A1 JP2021551336A JP2021551336A JPWO2021065948A1 JP WO2021065948 A1 JPWO2021065948 A1 JP WO2021065948A1 JP 2021551336 A JP2021551336 A JP 2021551336A JP 2021551336 A JP2021551336 A JP 2021551336A JP WO2021065948 A1 JPWO2021065948 A1 JP WO2021065948A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021551336A
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Japanese (ja)
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JP7300794B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021065948A1 publication Critical patent/JPWO2021065948A1/ja
Application granted granted Critical
Publication of JP7300794B2 publication Critical patent/JP7300794B2/ja
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
JP2021551336A 2019-09-30 2020-09-29 光導波路パッケージおよび発光装置 Active JP7300794B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019180925 2019-09-30
JP2019180925 2019-09-30
JP2020110002 2020-06-25
JP2020110002 2020-06-25
PCT/JP2020/037008 WO2021065948A1 (ja) 2019-09-30 2020-09-29 光導波路パッケージおよび発光装置

Publications (2)

Publication Number Publication Date
JPWO2021065948A1 true JPWO2021065948A1 (https=) 2021-04-08
JP7300794B2 JP7300794B2 (ja) 2023-06-30

Family

ID=75336933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021551336A Active JP7300794B2 (ja) 2019-09-30 2020-09-29 光導波路パッケージおよび発光装置

Country Status (5)

Country Link
US (1) US20220390689A1 (https=)
EP (1) EP4040516A4 (https=)
JP (1) JP7300794B2 (https=)
CN (1) CN114424099A (https=)
WO (1) WO2021065948A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111323878B (zh) * 2020-04-01 2021-10-15 联合微电子中心有限责任公司 一种激光器芯片与硅基光电子芯片的耦合对准装置及方法
EP4350401A4 (en) * 2021-05-28 2025-04-30 Kyocera Corporation Light source module
EP4350402A1 (en) * 2021-05-28 2024-04-10 Kyocera Corporation Light source module
US20250023001A1 (en) * 2021-09-01 2025-01-16 Kyocera Corporation Optical waveguide package and light-emitting device
WO2023100927A1 (ja) * 2021-11-30 2023-06-08 京セラ株式会社 光導波路パッケージおよび光源モジュール
DE102022106948A1 (de) * 2022-03-24 2023-09-28 Ams-Osram International Gmbh Optoelektronisches bauelement
CN119768718A (zh) * 2022-08-31 2025-04-04 京瓷株式会社 光波导封装件
WO2025070158A1 (ja) * 2023-09-28 2025-04-03 京セラ株式会社 光導波路基板、電子素子収納用パッケージ、電子モジュール及び電子デバイス

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05167060A (ja) * 1991-12-12 1993-07-02 Nec Corp 光結合回路
US5454055A (en) * 1992-09-29 1995-09-26 Robert Bosch Gmbh Method of making a cover for an integrated optical circuit, cover for an integrated optical circuit, and integrated optical circuit made with this cover
JPH08110446A (ja) * 1994-10-12 1996-04-30 Hitachi Ltd 光伝送モジュール
JPH0961651A (ja) * 1995-06-14 1997-03-07 Nippon Telegr & Teleph Corp <Ntt> ハイブリッド光集積回路
JPH09512353A (ja) * 1995-02-07 1997-12-09 エルディティ ゲーエムベーハー ウント シーオー．レーザー−ディスプレー−テクノロギー カーゲー カラー画像形成システム及びその使用方法
JP2001174655A (ja) * 1999-12-15 2001-06-29 Opnext Japan Inc 双方向通信光モジュール用素子及びその検査方法
JP2004258268A (ja) * 2003-02-25 2004-09-16 Tdk Corp 埋込型光部品及びその製造方法並びに埋込型光部品を用いた光回路
JP2007328201A (ja) * 2006-06-08 2007-12-20 Nippon Telegr & Teleph Corp <Ntt> 光集積回路
JP2008516525A (ja) * 2004-10-05 2008-05-15 トラツキング・テクノロジーズ・インコーポレーテツド 無線周波識別タグ及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146911A (ja) 1984-08-10 1986-03-07 Nippon Telegr & Teleph Corp <Ntt> 導波形光モジユ−ル
DE19917325C2 (de) * 1999-04-16 2001-06-21 Siemens Ag Fassung für opto-elektronische Bauelemente
EP1378777A3 (en) * 2002-07-02 2005-02-16 Omron Corporation Optical waveguide device, manufacturing method thereof, and optical communication apparatus
JP2004117706A (ja) * 2002-09-25 2004-04-15 Sumitomo Electric Ind Ltd 光集積素子、光集積素子の製造方法、及び光源モジュール
JP2005266179A (ja) * 2004-03-17 2005-09-29 Omron Corp 光導波路装置及び光導波路装置の製造方法並びに光導波路装置の中間体
JP5267426B2 (ja) * 2009-11-04 2013-08-21 住友ベークライト株式会社 光素子搭載基板、光電気混載基板および電子機器
JP2016004224A (ja) * 2014-06-19 2016-01-12 富士通株式会社 光学モジュール、光学モジュールの製造方法及び光学装置
JP6940749B2 (ja) * 2016-04-28 2021-09-29 日亜化学工業株式会社 発光装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05167060A (ja) * 1991-12-12 1993-07-02 Nec Corp 光結合回路
US5454055A (en) * 1992-09-29 1995-09-26 Robert Bosch Gmbh Method of making a cover for an integrated optical circuit, cover for an integrated optical circuit, and integrated optical circuit made with this cover
JPH08110446A (ja) * 1994-10-12 1996-04-30 Hitachi Ltd 光伝送モジュール
JPH09512353A (ja) * 1995-02-07 1997-12-09 エルディティ ゲーエムベーハー ウント シーオー．レーザー−ディスプレー−テクノロギー カーゲー カラー画像形成システム及びその使用方法
JPH0961651A (ja) * 1995-06-14 1997-03-07 Nippon Telegr & Teleph Corp <Ntt> ハイブリッド光集積回路
JP2001174655A (ja) * 1999-12-15 2001-06-29 Opnext Japan Inc 双方向通信光モジュール用素子及びその検査方法
JP2004258268A (ja) * 2003-02-25 2004-09-16 Tdk Corp 埋込型光部品及びその製造方法並びに埋込型光部品を用いた光回路
JP2008516525A (ja) * 2004-10-05 2008-05-15 トラツキング・テクノロジーズ・インコーポレーテツド 無線周波識別タグ及びその製造方法
JP2007328201A (ja) * 2006-06-08 2007-12-20 Nippon Telegr & Teleph Corp <Ntt> 光集積回路

Also Published As

Publication number Publication date
US20220390689A1 (en) 2022-12-08
WO2021065948A1 (ja) 2021-04-08
EP4040516A4 (en) 2023-11-15
JP7300794B2 (ja) 2023-06-30
EP4040516A1 (en) 2022-08-10
CN114424099A (zh) 2022-04-29

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