JPWO2021038771A1 - - Google Patents

Info

Publication number
JPWO2021038771A1
JPWO2021038771A1 JP2021541883A JP2021541883A JPWO2021038771A1 JP WO2021038771 A1 JPWO2021038771 A1 JP WO2021038771A1 JP 2021541883 A JP2021541883 A JP 2021541883A JP 2021541883 A JP2021541883 A JP 2021541883A JP WO2021038771 A1 JPWO2021038771 A1 JP WO2021038771A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021541883A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021038771A1 publication Critical patent/JPWO2021038771A1/ja
Priority to JP2024008834A priority Critical patent/JP2024045302A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021541883A 2019-08-28 2019-08-28 Pending JPWO2021038771A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024008834A JP2024045302A (ja) 2019-08-28 2024-01-24 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/033793 WO2021038771A1 (ja) 2019-08-28 2019-08-28 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024008834A Division JP2024045302A (ja) 2019-08-28 2024-01-24 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Publications (1)

Publication Number Publication Date
JPWO2021038771A1 true JPWO2021038771A1 (de) 2021-03-04

Family

ID=74684663

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021541883A Pending JPWO2021038771A1 (de) 2019-08-28 2019-08-28
JP2024008834A Pending JP2024045302A (ja) 2019-08-28 2024-01-24 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024008834A Pending JP2024045302A (ja) 2019-08-28 2024-01-24 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Country Status (4)

Country Link
JP (2) JPWO2021038771A1 (de)
KR (1) KR20220055469A (de)
CN (1) CN114127184A (de)
WO (1) WO2021038771A1 (de)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037093A1 (ja) * 2005-09-29 2007-04-05 Idemitsu Kosan Co., Ltd. 反射材及び発光ダイオード用反射体
JP2009129801A (ja) * 2007-11-27 2009-06-11 Denki Kagaku Kogyo Kk 金属ベース回路基板
JP2011219634A (ja) * 2010-04-09 2011-11-04 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2012030476A (ja) * 2010-07-30 2012-02-16 Sumitomo Chemical Co Ltd 液晶ポリエステル成形体の製造方法
JP2015152643A (ja) * 2014-02-10 2015-08-24 パナソニックＩｐマネジメント株式会社 光反射体用熱硬化性樹脂組成物、光反射体、及び発光装置
JP2015189932A (ja) * 2014-03-28 2015-11-02 株式会社ダイセル 熱硬化性樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
WO2017131152A1 (ja) * 2016-01-27 2017-08-03 クラスターテクノロジー株式会社 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
JP2019026710A (ja) * 2017-07-28 2019-02-21 日立化成株式会社 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101308306B1 (ko) 2006-11-15 2013-09-17 히타치가세이가부시끼가이샤 열경화성 광반사용 수지 조성물 및 그 제조방법, 및 그 수지 조성물을 이용한 광반도체 소자 탑재용 기판 및 광반도체 장치
JP5665285B2 (ja) 2009-06-15 2015-02-04 日立化成株式会社 光半導体素子搭載用部材及び光半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037093A1 (ja) * 2005-09-29 2007-04-05 Idemitsu Kosan Co., Ltd. 反射材及び発光ダイオード用反射体
JP2009129801A (ja) * 2007-11-27 2009-06-11 Denki Kagaku Kogyo Kk 金属ベース回路基板
JP2011219634A (ja) * 2010-04-09 2011-11-04 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2012030476A (ja) * 2010-07-30 2012-02-16 Sumitomo Chemical Co Ltd 液晶ポリエステル成形体の製造方法
JP2015152643A (ja) * 2014-02-10 2015-08-24 パナソニックＩｐマネジメント株式会社 光反射体用熱硬化性樹脂組成物、光反射体、及び発光装置
JP2015189932A (ja) * 2014-03-28 2015-11-02 株式会社ダイセル 熱硬化性樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
WO2017131152A1 (ja) * 2016-01-27 2017-08-03 クラスターテクノロジー株式会社 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
JP2019026710A (ja) * 2017-07-28 2019-02-21 日立化成株式会社 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Also Published As

Publication number Publication date
KR20220055469A (ko) 2022-05-03
JP2024045302A (ja) 2024-04-02
CN114127184A (zh) 2022-03-01
WO2021038771A1 (ja) 2021-03-04

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