|
JPH08123337A
(ja)
*
|
1994-10-26 |
1996-05-17 |
Nagoya Denki Kogyo Kk |
道路情報表示板用表示ユニット
|
|
US6142358A
(en)
|
1997-05-31 |
2000-11-07 |
The Regents Of The University Of California |
Wafer-to-wafer transfer of microstructures using break-away tethers
|
|
US6608370B1
(en)
|
2002-01-28 |
2003-08-19 |
Motorola, Inc. |
Semiconductor wafer having a thin die and tethers and methods of making the same
|
|
EP1700161B1
(en)
|
2003-12-01 |
2018-01-24 |
The Board of Trustees of the University of Illinois |
Methods and devices for fabricating three-dimensional nanoscale structures
|
|
US7195733B2
(en)
|
2004-04-27 |
2007-03-27 |
The Board Of Trustees Of The University Of Illinois |
Composite patterning devices for soft lithography
|
|
WO2005107128A1
(en)
*
|
2004-04-30 |
2005-11-10 |
Research In Motion Limited |
System and method for securing data
|
|
US7799699B2
(en)
|
2004-06-04 |
2010-09-21 |
The Board Of Trustees Of The University Of Illinois |
Printable semiconductor structures and related methods of making and assembling
|
|
US7521292B2
(en)
|
2004-06-04 |
2009-04-21 |
The Board Of Trustees Of The University Of Illinois |
Stretchable form of single crystal silicon for high performance electronics on rubber substrates
|
|
CN102683391B
(zh)
|
2004-06-04 |
2015-11-18 |
伊利诺伊大学评议会 |
用于制造并组装可印刷半导体元件的方法和设备
|
|
JP4801337B2
(ja)
|
2004-09-21 |
2011-10-26 |
株式会社半導体エネルギー研究所 |
半導体装置の作製方法
|
|
US7662545B2
(en)
|
2004-10-14 |
2010-02-16 |
The Board Of Trustees Of The University Of Illinois |
Decal transfer lithography
|
|
KR101430587B1
(ko)
|
2006-09-20 |
2014-08-14 |
더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 |
전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들
|
|
KR101519038B1
(ko)
|
2007-01-17 |
2015-05-11 |
더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 |
프린팅기반 어셈블리에 의해 제조되는 광학 시스템
|
|
US8354674B2
(en)
*
|
2007-06-29 |
2013-01-15 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer
|
|
WO2009067635A1
(en)
|
2007-11-20 |
2009-05-28 |
Board Of Regents, The University Of Texas System |
Method and apparatus for detethering mesoscale, microscale, and nanoscale components and devices
|
|
US8030674B2
(en)
|
2008-04-28 |
2011-10-04 |
Lextar Electronics Corp. |
Light-emitting diode package with roughened surface portions of the lead-frame
|
|
US20100060553A1
(en)
|
2008-08-21 |
2010-03-11 |
Zimmerman Scott M |
LED display utilizing freestanding epitaxial LEDs
|
|
US9123614B2
(en)
|
2008-10-07 |
2015-09-01 |
Mc10, Inc. |
Methods and applications of non-planar imaging arrays
|
|
KR101736722B1
(ko)
|
2008-11-19 |
2017-05-17 |
셈프리어스 아이엔씨. |
전단-보조 탄성 스탬프 전사에 의한 프린팅 반도체 소자
|
|
CN106449805B
(zh)
|
2009-02-09 |
2019-03-12 |
艾克斯瑟乐普林特有限公司 |
集中器型光电（cpv）模块、接收器和子接收器及其形成方法
|
|
US8877648B2
(en)
|
2009-03-26 |
2014-11-04 |
Semprius, Inc. |
Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby
|
|
TWI592996B
(zh)
|
2009-05-12 |
2017-07-21 |
美國伊利諾大學理事會 |
用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
|
|
US9165989B2
(en)
|
2009-09-16 |
2015-10-20 |
Semprius, Inc. |
High-yield fabrication of large-format substrates with distributed, independent control elements
|
|
US8642363B2
(en)
|
2009-12-09 |
2014-02-04 |
Nano And Advanced Materials Institute Limited |
Monolithic full-color LED micro-display on an active matrix panel manufactured using flip-chip technology
|
|
WO2011126726A1
(en)
|
2010-03-29 |
2011-10-13 |
Semprius, Inc. |
Electrically bonded arrays of transfer printed active components
|
|
WO2011123285A1
(en)
|
2010-03-29 |
2011-10-06 |
Semprius, Inc. |
Selective transfer of active components
|
|
TWI478319B
(zh)
|
2010-07-20 |
2015-03-21 |
晶元光電股份有限公司 |
整合式發光裝置及其製造方法
|
|
KR101916968B1
(ko)
|
2010-08-06 |
2018-11-08 |
엑스-셀레프린트 리미티드 |
인쇄가능한 화합물 반도체 장치를 박리시키기 위한 물질 및 방법
|
|
US9142468B2
(en)
|
2010-08-26 |
2015-09-22 |
Semprius, Inc. |
Structures and methods for testing printable integrated circuits
|
|
WO2012078139A1
(en)
|
2010-12-07 |
2012-06-14 |
Primaxx, Inc. |
Process for manufacturing electro-mechanical systems
|
|
JP5966412B2
(ja)
|
2011-04-08 |
2016-08-10 |
ソニー株式会社 |
画素チップ、表示パネル、照明パネル、表示装置および照明装置
|
|
US8889485B2
(en)
|
2011-06-08 |
2014-11-18 |
Semprius, Inc. |
Methods for surface attachment of flipped active componenets
|
|
US9412727B2
(en)
|
2011-09-20 |
2016-08-09 |
Semprius, Inc. |
Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
|
|
US9620478B2
(en)
|
2011-11-18 |
2017-04-11 |
Apple Inc. |
Method of fabricating a micro device transfer head
|
|
US8426227B1
(en)
|
2011-11-18 |
2013-04-23 |
LuxVue Technology Corporation |
Method of forming a micro light emitting diode array
|
|
KR101891257B1
(ko)
|
2012-04-02 |
2018-08-24 |
삼성전자주식회사 |
반도체 발광장치 및 그 제조방법
|
|
US8933433B2
(en)
|
2012-07-30 |
2015-01-13 |
LuxVue Technology Corporation |
Method and structure for receiving a micro device
|
|
US8941215B2
(en)
|
2012-09-24 |
2015-01-27 |
LuxVue Technology Corporation |
Micro device stabilization post
|
|
US8835940B2
(en)
|
2012-09-24 |
2014-09-16 |
LuxVue Technology Corporation |
Micro device stabilization post
|
|
US9029880B2
(en)
|
2012-12-10 |
2015-05-12 |
LuxVue Technology Corporation |
Active matrix display panel with ground tie lines
|
|
US9166114B2
(en)
|
2012-12-11 |
2015-10-20 |
LuxVue Technology Corporation |
Stabilization structure including sacrificial release layer and staging cavity
|
|
US9153171B2
(en)
|
2012-12-17 |
2015-10-06 |
LuxVue Technology Corporation |
Smart pixel lighting and display microcontroller
|
|
WO2014152617A1
(en)
|
2013-03-15 |
2014-09-25 |
Semprius, Inc. |
Engineered substrates for semiconductor epitaxy and methods of fabricating the same
|
|
US9252375B2
(en)
|
2013-03-15 |
2016-02-02 |
LuxVue Technology Corporation |
Method of fabricating a light emitting diode display with integrated defect detection test
|
|
US8791474B1
(en)
|
2013-03-15 |
2014-07-29 |
LuxVue Technology Corporation |
Light emitting diode display with redundancy scheme
|
|
US9217541B2
(en)
|
2013-05-14 |
2015-12-22 |
LuxVue Technology Corporation |
Stabilization structure including shear release posts
|
|
US8987765B2
(en)
|
2013-06-17 |
2015-03-24 |
LuxVue Technology Corporation |
Reflective bank structure and method for integrating a light emitting device
|
|
US9111464B2
(en)
|
2013-06-18 |
2015-08-18 |
LuxVue Technology Corporation |
LED display with wavelength conversion layer
|
|
US9087764B2
(en)
|
2013-07-26 |
2015-07-21 |
LuxVue Technology Corporation |
Adhesive wafer bonding with controlled thickness variation
|
|
US9367094B2
(en)
|
2013-12-17 |
2016-06-14 |
Apple Inc. |
Display module and system applications
|
|
US9831387B2
(en)
|
2014-06-14 |
2017-11-28 |
Hiphoton Co., Ltd. |
Light engine array
|
|
CN113035851B
(zh)
|
2014-06-18 |
2022-03-29 |
艾克斯展示公司技术有限公司 |
微组装led显示器
|
|
US9818725B2
(en)
|
2015-06-01 |
2017-11-14 |
X-Celeprint Limited |
Inorganic-light-emitter display with integrated black matrix
|
|
US20160093600A1
(en)
|
2014-09-25 |
2016-03-31 |
X-Celeprint Limited |
Compound micro-assembly strategies and devices
|
|
US9640715B2
(en)
|
2015-05-15 |
2017-05-02 |
X-Celeprint Limited |
Printable inorganic semiconductor structures
|
|
US10255834B2
(en)
|
2015-07-23 |
2019-04-09 |
X-Celeprint Limited |
Parallel redundant chiplet system for controlling display pixels
|
|
US9640108B2
(en)
|
2015-08-25 |
2017-05-02 |
X-Celeprint Limited |
Bit-plane pulse width modulated digital display system
|
|
US10468363B2
(en)
|
2015-08-10 |
2019-11-05 |
X-Celeprint Limited |
Chiplets with connection posts
|
|
US10380930B2
(en)
*
|
2015-08-24 |
2019-08-13 |
X-Celeprint Limited |
Heterogeneous light emitter display system
|
|
WO2017094461A1
(ja)
*
|
2015-12-01 |
2017-06-08 |
シャープ株式会社 |
画像形成素子
|
|
US9930277B2
(en)
|
2015-12-23 |
2018-03-27 |
X-Celeprint Limited |
Serial row-select matrix-addressed system
|
|
US10091446B2
(en)
|
2015-12-23 |
2018-10-02 |
X-Celeprint Limited |
Active-matrix displays with common pixel control
|
|
US10153256B2
(en)
|
2016-03-03 |
2018-12-11 |
X-Celeprint Limited |
Micro-transfer printable electronic component
|
|
US10153257B2
(en)
|
2016-03-03 |
2018-12-11 |
X-Celeprint Limited |
Micro-printed display
|
|
JP6668455B2
(ja)
*
|
2016-04-01 |
2020-03-18 |
株式会社半導体エネルギー研究所 |
酸化物半導体膜の作製方法
|
|
GB2551103B
(en)
|
2016-04-11 |
2022-03-23 |
Filtronic Broadband Ltd |
A method of optimising a mm wave power amplifier
|
|
JP7015024B2
(ja)
*
|
2016-10-19 |
2022-02-02 |
株式会社オルガノサーキット |
アクティブマトリクスｌｅｄディスプレイ
|
|
US10395966B2
(en)
|
2016-11-15 |
2019-08-27 |
X-Celeprint Limited |
Micro-transfer-printable flip-chip structures and methods
|
|
WO2018091459A1
(en)
|
2016-11-15 |
2018-05-24 |
X-Celeprint Limited |
Micro-transfer-printable flip-chip structures and methods
|
|
DE102016124983A1
(de)
|
2016-12-20 |
2018-06-21 |
Osram Opto Semiconductors Gmbh |
Videowandmodul
|
|
US10332868B2
(en)
|
2017-01-26 |
2019-06-25 |
X-Celeprint Limited |
Stacked pixel structures
|
|
US10468391B2
(en)
|
2017-02-08 |
2019-11-05 |
X-Celeprint Limited |
Inorganic light-emitting-diode displays with multi-ILED pixels
|
|
JP6781087B2
(ja)
*
|
2017-02-28 |
2020-11-04 |
京セラ株式会社 |
表示装置
|
|
US10224432B2
(en)
*
|
2017-03-10 |
2019-03-05 |
Applied Materials, Inc. |
Surface treatment process performed on devices for TFT applications
|
|
US11152512B2
(en)
*
|
2017-05-19 |
2021-10-19 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device, display device, and method for manufacturing semiconductor device
|
|
KR102495930B1
(ko)
*
|
2017-09-12 |
2023-02-03 |
삼성디스플레이 주식회사 |
표시 장치 및 그 제조 방법
|
|
US10690920B2
(en)
*
|
2018-02-28 |
2020-06-23 |
X Display Company Technology Limited |
Displays with transparent bezels
|
|
US10505079B2
(en)
*
|
2018-05-09 |
2019-12-10 |
X-Celeprint Limited |
Flexible devices and methods using laser lift-off
|
|
US10607533B2
(en)
*
|
2018-08-03 |
2020-03-31 |
Kyocera Corporation |
Display apparatus with light emitting portions
|
|
KR102030323B1
(ko)
*
|
2018-11-23 |
2019-10-10 |
엘지디스플레이 주식회사 |
표시 장치 및 표시 장치의 제조 방법
|
|
US12183724B2
(en)
*
|
2019-06-13 |
2024-12-31 |
Lite-On Opto Technology (Changzhou) Co., Ltd. |
Multiple pixel package structure with buried chip and electronic device using the same
|
|
US10944027B2
(en)
|
2019-06-14 |
2021-03-09 |
X Display Company Technology Limited |
Pixel modules with controllers and light emitters
|