JPWO2020195744A1 - - Google Patents
Info
- Publication number
- JPWO2020195744A1 JPWO2020195744A1 JP2021508962A JP2021508962A JPWO2020195744A1 JP WO2020195744 A1 JPWO2020195744 A1 JP WO2020195744A1 JP 2021508962 A JP2021508962 A JP 2021508962A JP 2021508962 A JP2021508962 A JP 2021508962A JP WO2020195744 A1 JPWO2020195744 A1 JP WO2020195744A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019060411 | 2019-03-27 | ||
PCT/JP2020/010002 WO2020195744A1 (ja) | 2019-03-27 | 2020-03-09 | ワーク加工用シート |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2020195744A1 true JPWO2020195744A1 (ko) | 2020-10-01 |
Family
ID=72610493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021508962A Pending JPWO2020195744A1 (ko) | 2019-03-27 | 2020-03-09 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2020195744A1 (ko) |
KR (1) | KR20210148068A (ko) |
CN (1) | CN113226754A (ko) |
TW (1) | TWI842853B (ko) |
WO (1) | WO2020195744A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022156835A (ja) * | 2021-03-31 | 2022-10-14 | マクセル株式会社 | ワーク加工用粘着テープ |
JP2022156837A (ja) * | 2021-03-31 | 2022-10-14 | マクセル株式会社 | ワーク加工用粘着テープ |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1137028C (zh) * | 1998-11-20 | 2004-02-04 | 琳得科株式会社 | 压敏粘合片及其使用方法 |
JP4828009B2 (ja) * | 1998-11-20 | 2011-11-30 | リンテック株式会社 | 粘着シートおよびその使用方法 |
JP4707805B2 (ja) * | 2000-08-08 | 2011-06-22 | 三井化学株式会社 | 半導体ウエハ表面保護用粘着フィルム及びそれを用いる半導体ウエハ表面の保護方法 |
JP5318435B2 (ja) * | 2008-02-29 | 2013-10-16 | 日東電工株式会社 | 半導体ウエハの裏面研削用粘着シート及びこの裏面研削用粘着シートを用いる半導体ウエハの裏面研削方法 |
JP6085076B2 (ja) * | 2009-03-16 | 2017-02-22 | リンテック株式会社 | 粘着シートおよび半導体ウエハの加工方法、半導体チップの製造方法 |
JP5414953B1 (ja) * | 2012-08-03 | 2014-02-12 | リンテック株式会社 | ダイシングシートおよびデバイスチップの製造方法 |
KR101817411B1 (ko) * | 2013-05-29 | 2018-01-10 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 반도체 웨이퍼 보호용 필름 및 반도체 장치의 제조 방법 |
SG11201704347YA (en) * | 2014-12-02 | 2017-06-29 | Lintec Corp | Adhesive sheet, and method for manufacturing processed article |
CN107750386B (zh) * | 2015-07-03 | 2021-09-14 | 三井化学东赛璐株式会社 | 半导体晶片表面保护膜以及半导体装置的制造方法 |
JP6885966B2 (ja) * | 2016-11-01 | 2021-06-16 | リンテック株式会社 | ダイシングダイボンディングシート、及び半導体チップの製造方法 |
JP6224284B1 (ja) * | 2017-03-08 | 2017-11-01 | リンテック株式会社 | 粘着フィルム |
-
2020
- 2020-03-09 WO PCT/JP2020/010002 patent/WO2020195744A1/ja active Application Filing
- 2020-03-09 CN CN202080007508.8A patent/CN113226754A/zh active Pending
- 2020-03-09 JP JP2021508962A patent/JPWO2020195744A1/ja active Pending
- 2020-03-09 KR KR1020217008158A patent/KR20210148068A/ko not_active Application Discontinuation
- 2020-03-12 TW TW109108152A patent/TWI842853B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2020195744A1 (ja) | 2020-10-01 |
TWI842853B (zh) | 2024-05-21 |
TW202101550A (zh) | 2021-01-01 |
CN113226754A (zh) | 2021-08-06 |
KR20210148068A (ko) | 2021-12-07 |
Similar Documents
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