JPWO2020184517A1 - - Google Patents

Info

Publication number
JPWO2020184517A1
JPWO2020184517A1 JP2021505063A JP2021505063A JPWO2020184517A1 JP WO2020184517 A1 JPWO2020184517 A1 JP WO2020184517A1 JP 2021505063 A JP2021505063 A JP 2021505063A JP 2021505063 A JP2021505063 A JP 2021505063A JP WO2020184517 A1 JPWO2020184517 A1 JP WO2020184517A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021505063A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020184517A1 publication Critical patent/JPWO2020184517A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2021505063A 2019-03-13 2020-03-09 Pending JPWO2020184517A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019046508 2019-03-13
PCT/JP2020/010054 WO2020184517A1 (ja) 2019-03-13 2020-03-09 キャパシタ及びその製造方法

Publications (1)

Publication Number Publication Date
JPWO2020184517A1 true JPWO2020184517A1 (ja) 2020-09-17

Family

ID=72427583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021505063A Pending JPWO2020184517A1 (ja) 2019-03-13 2020-03-09

Country Status (4)

Country Link
US (1) US11784000B2 (ja)
JP (1) JPWO2020184517A1 (ja)
CN (1) CN113544847A (ja)
WO (1) WO2020184517A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022131048A1 (ja) * 2020-12-18 2022-06-23
TW202243237A (zh) * 2021-04-21 2022-11-01 日商松下知識產權經營股份有限公司 電容器
WO2023149313A1 (ja) * 2022-02-04 2023-08-10 パナソニックＩｐマネジメント株式会社 キャパシタ及びキャパシタの製造方法
WO2024116968A1 (ja) * 2022-11-29 2024-06-06 パナソニックＩｐマネジメント株式会社 キャパシタ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160342A (ja) * 1991-12-02 1993-06-25 Canon Inc 半導体装置及びその製造方法
JPH0613547A (ja) * 1992-01-31 1994-01-21 Nec Corp 半導体装置およびその製造方法
JP2001523050A (ja) * 1997-11-12 2001-11-20 エプコス アクチエンゲゼルシャフト 少なくとも１つのコンデンサを有する回路構造およびその製造方法
JP2009059990A (ja) * 2007-09-03 2009-03-19 Rohm Co Ltd コンデンサ、電子部品、およびコンデンサの製造方法
JP2017098499A (ja) * 2015-11-27 2017-06-01 三菱電機株式会社 Ｍｉｍキャパシタ及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0553791A1 (en) 1992-01-31 1993-08-04 Nec Corporation Capacitor electrode for dram and process of fabrication thereof
EP1949418A2 (en) 2005-11-08 2008-07-30 Nxp B.V. Integrated capacitor arrangement for ultrahigh capacitance values
US8502340B2 (en) * 2010-12-09 2013-08-06 Tessera, Inc. High density three-dimensional integrated capacitors
US9184041B2 (en) * 2013-06-25 2015-11-10 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit with backside structures to reduce substrate warp
DE102014200869B4 (de) * 2013-11-22 2018-09-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Integrierter Kondensator und Verfahren zum Herstellen desselben und dessen Verwendung
JPWO2017145515A1 (ja) * 2016-02-22 2018-10-11 株式会社村田製作所 半導体コンデンサおよび電源モジュール
WO2021186893A1 (ja) * 2020-03-17 2021-09-23 パナソニックＩｐマネジメント株式会社 キャパシタ及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160342A (ja) * 1991-12-02 1993-06-25 Canon Inc 半導体装置及びその製造方法
JPH0613547A (ja) * 1992-01-31 1994-01-21 Nec Corp 半導体装置およびその製造方法
JP2001523050A (ja) * 1997-11-12 2001-11-20 エプコス アクチエンゲゼルシャフト 少なくとも１つのコンデンサを有する回路構造およびその製造方法
JP2009059990A (ja) * 2007-09-03 2009-03-19 Rohm Co Ltd コンデンサ、電子部品、およびコンデンサの製造方法
JP2017098499A (ja) * 2015-11-27 2017-06-01 三菱電機株式会社 Ｍｉｍキャパシタ及びその製造方法

Also Published As

Publication number Publication date
US20210407734A1 (en) 2021-12-30
US11784000B2 (en) 2023-10-10
WO2020184517A1 (ja) 2020-09-17
CN113544847A (zh) 2021-10-22

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