JPWO2020085372A1 - 導電性樹脂組成物および半導体装置 - Google Patents

導電性樹脂組成物および半導体装置 Download PDF

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Publication number
JPWO2020085372A1
JPWO2020085372A1 JP2020553425A JP2020553425A JPWO2020085372A1 JP WO2020085372 A1 JPWO2020085372 A1 JP WO2020085372A1 JP 2020553425 A JP2020553425 A JP 2020553425A JP 2020553425 A JP2020553425 A JP 2020553425A JP WO2020085372 A1 JPWO2020085372 A1 JP WO2020085372A1
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Prior art keywords
conductive resin
resin composition
particles
mass
composition according
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Pending
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JP2020553425A
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English (en)
Japanese (ja)
Inventor
孝一 玉野
孝一 玉野
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of JPWO2020085372A1 publication Critical patent/JPWO2020085372A1/ja
Priority to JP2022075758A priority Critical patent/JP7359252B2/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymerisation Methods In General (AREA)
JP2020553425A 2018-10-24 2019-10-23 導電性樹脂組成物および半導体装置 Pending JPWO2020085372A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022075758A JP7359252B2 (ja) 2018-10-24 2022-05-02 導電性樹脂組成物および半導体装置

Applications Claiming Priority (3)

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JP2018200424 2018-10-24
JP2018200424 2018-10-24
PCT/JP2019/041504 WO2020085372A1 (ja) 2018-10-24 2019-10-23 導電性樹脂組成物および半導体装置

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JP2022075758A Division JP7359252B2 (ja) 2018-10-24 2022-05-02 導電性樹脂組成物および半導体装置

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JPWO2020085372A1 true JPWO2020085372A1 (ja) 2021-09-02

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JP2020553425A Pending JPWO2020085372A1 (ja) 2018-10-24 2019-10-23 導電性樹脂組成物および半導体装置
JP2022075758A Active JP7359252B2 (ja) 2018-10-24 2022-05-02 導電性樹脂組成物および半導体装置

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JP (2) JPWO2020085372A1 (https=)
CN (1) CN112912427B (https=)
TW (1) TWI824045B (https=)
WO (1) WO2020085372A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0221626A (ja) * 1988-07-08 1990-01-24 Narumi China Corp 半導体素子塔載用セラミック基板
JPH05501783A (ja) * 1989-11-29 1993-04-02 アチソン・インダストリーズ・インコーポレイテツド 導電性支持ベースに半導体ダイを接着するのに有用な導電性接着剤
JPH06350000A (ja) * 1993-06-04 1994-12-22 Hitachi Ltd リードフレームの表面処理剤およびそれを用いた半導体集積回路装置の製造方法
JPH11195662A (ja) * 1997-12-26 1999-07-21 Japan Energy Corp エポキシブリ−ドアウト防止剤及び防止方法
JP2001181482A (ja) * 1999-12-27 2001-07-03 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2010126617A (ja) * 2008-11-27 2010-06-10 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4604230A (en) * 1984-10-15 1986-08-05 Stauffer Chemical Company Thermally stable adhesive
JP2000186261A (ja) * 1998-12-21 2000-07-04 Hitachi Chem Co Ltd 銅フレーム用接着剤、半導体パッケージ及び半導体パッケージの製造法
JP5352970B2 (ja) * 2007-07-04 2013-11-27 住友ベークライト株式会社 樹脂組成物および半導体装置
JP5540916B2 (ja) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 接続構造体の製造方法
JP6747000B2 (ja) * 2016-03-25 2020-08-26 住友ベークライト株式会社 ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法
CN109643662B (zh) * 2016-08-19 2021-07-13 住友电木株式会社 芯片粘结膏和半导体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0221626A (ja) * 1988-07-08 1990-01-24 Narumi China Corp 半導体素子塔載用セラミック基板
JPH05501783A (ja) * 1989-11-29 1993-04-02 アチソン・インダストリーズ・インコーポレイテツド 導電性支持ベースに半導体ダイを接着するのに有用な導電性接着剤
JPH06350000A (ja) * 1993-06-04 1994-12-22 Hitachi Ltd リードフレームの表面処理剤およびそれを用いた半導体集積回路装置の製造方法
JPH11195662A (ja) * 1997-12-26 1999-07-21 Japan Energy Corp エポキシブリ−ドアウト防止剤及び防止方法
JP2001181482A (ja) * 1999-12-27 2001-07-03 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2010126617A (ja) * 2008-11-27 2010-06-10 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
有機過酸化物 ORGANIC PEROXIDES（第１０版）, JPN6021036629, November 2004 (2004-11-01), pages 1 - 6, ISSN: 0004597676 *

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JP2022115943A (ja) 2022-08-09
TWI824045B (zh) 2023-12-01
CN112912427B (zh) 2023-08-22
WO2020085372A1 (ja) 2020-04-30
TW202033567A (zh) 2020-09-16
JP7359252B2 (ja) 2023-10-11
CN112912427A (zh) 2021-06-04

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