JPWO2020026207A5 - - Google Patents
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- Publication number
- JPWO2020026207A5 JPWO2020026207A5 JP2021505856A JP2021505856A JPWO2020026207A5 JP WO2020026207 A5 JPWO2020026207 A5 JP WO2020026207A5 JP 2021505856 A JP2021505856 A JP 2021505856A JP 2021505856 A JP2021505856 A JP 2021505856A JP WO2020026207 A5 JPWO2020026207 A5 JP WO2020026207A5
- Authority
- JP
- Japan
- Prior art keywords
- ink
- substrate
- silver
- copper
- carboxylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 copper carboxylate Chemical class 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 23
- 229910052709 silver Inorganic materials 0.000 claims description 19
- 239000004332 silver Substances 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 239000003607 modifier Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 6
- 239000000194 fatty acid Substances 0.000 claims description 6
- 229930195729 fatty acid Natural products 0.000 claims description 6
- 150000004665 fatty acids Chemical class 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- 229920008790 Amorphous Polyethylene terephthalate Polymers 0.000 claims description 4
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 4
- 229920000547 conjugated polymer Polymers 0.000 claims description 4
- 229920000620 organic polymer Polymers 0.000 claims description 4
- 239000002491 polymer binding agent Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 4
- AKEXVWKYUAMNKL-UHFFFAOYSA-N 2,2-dimethylpropanoic acid;silver Chemical compound [Ag].CC(C)(C)C(O)=O AKEXVWKYUAMNKL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229920000123 polythiophene Polymers 0.000 claims description 3
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 claims description 3
- 229940071536 silver acetate Drugs 0.000 claims description 3
- XNGYKPINNDWGGF-UHFFFAOYSA-L silver oxalate Chemical group [Ag+].[Ag+].[O-]C(=O)C([O-])=O XNGYKPINNDWGGF-UHFFFAOYSA-L 0.000 claims description 3
- AWQSAIIDOMEEOD-UHFFFAOYSA-N 5,5-Dimethyl-4-(3-oxobutyl)dihydro-2(3H)-furanone Chemical compound CC(=O)CCC1CC(=O)OC1(C)C AWQSAIIDOMEEOD-UHFFFAOYSA-N 0.000 claims description 2
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 claims description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Natural products CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 claims description 2
- 229920000742 Cotton Polymers 0.000 claims description 2
- 239000004677 Nylon Substances 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- GONOPSZTUGRENK-UHFFFAOYSA-N benzyl(trichloro)silane Chemical compound Cl[Si](Cl)(Cl)CC1=CC=CC=C1 GONOPSZTUGRENK-UHFFFAOYSA-N 0.000 claims description 2
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical group [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims description 2
- 239000000806 elastomer Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N n-hexanoic acid Natural products CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 claims description 2
- 229920001778 nylon Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000004753 textile Substances 0.000 claims description 2
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862714363P | 2018-08-03 | 2018-08-03 | |
| US62/714,363 | 2018-08-03 | ||
| PCT/IB2019/056612 WO2020026207A1 (en) | 2018-08-03 | 2019-08-02 | Uv-sinterable molecular ink and processing thereof using broad spectrum uv light |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2021533229A JP2021533229A (ja) | 2021-12-02 |
| JP2021533229A5 JP2021533229A5 (https=) | 2022-07-27 |
| JPWO2020026207A5 true JPWO2020026207A5 (https=) | 2022-07-27 |
| JP7374177B2 JP7374177B2 (ja) | 2023-11-06 |
Family
ID=69231658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021505856A Active JP7374177B2 (ja) | 2018-08-03 | 2019-08-02 | 広域スペクトルｕｖ光を使用したｕｖ焼結性分子インク及びその処理 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11873413B2 (https=) |
| EP (1) | EP3830200A4 (https=) |
| JP (1) | JP7374177B2 (https=) |
| KR (1) | KR102790704B1 (https=) |
| CN (1) | CN112789331B (https=) |
| CA (1) | CA3108631A1 (https=) |
| TW (1) | TWI825140B (https=) |
| WO (1) | WO2020026207A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI853828B (zh) | 2018-08-07 | 2024-09-01 | 加拿大國家研究委員會 | 包覆成型的印刷電子零件和其製造方法 |
| US11043729B2 (en) * | 2019-02-05 | 2021-06-22 | Best Medical Canada Ltd. | Flexible antenna for a wireless radiation dosimeter |
| US11741329B2 (en) | 2019-09-26 | 2023-08-29 | Best Theratronics, Ltd. | Low power non-volatile non-charge-based variable supply RFID tag memory |
| EP3882038A1 (en) * | 2020-03-18 | 2021-09-22 | Heraeus Deutschland GmbH & Co. KG | Assembly for an inkjet printer, inkjet printer and method for printing a functional layer on a surface of a three-dimensional electronic device |
| CN116013890A (zh) * | 2023-01-05 | 2023-04-25 | 哈尔滨理工大学 | 一种半导体封装用低温烧结铜浆料及其制备方法 |
| CN116321774A (zh) * | 2023-02-17 | 2023-06-23 | 潍坊东大电子材料有限公司 | 一种基于无颗粒墨水制备超细导电线路的工艺 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3989644A (en) | 1974-09-27 | 1976-11-02 | General Electric Company | Radiation curable inks |
| US4088801A (en) | 1976-04-29 | 1978-05-09 | General Electric Company | U.V. Radiation curable electrically conductive ink and circuit boards made therewith |
| US5527627A (en) * | 1993-03-29 | 1996-06-18 | Delco Electronics Corp. | Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit |
| US20060000172A1 (en) | 2001-06-22 | 2006-01-05 | Amazon Forms One, Inc. | Lightweight concrete composite blocks |
| US7629017B2 (en) * | 2001-10-05 | 2009-12-08 | Cabot Corporation | Methods for the deposition of conductive electronic features |
| US7141104B2 (en) | 2003-06-05 | 2006-11-28 | Agfa-Gevaert | UV-absorbing ink composition for ink-jet printing |
| WO2007043664A1 (ja) | 2005-10-14 | 2007-04-19 | Toyo Ink Mfg. Co., Ltd. | 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および導電性被膜 |
| JP2007194175A (ja) * | 2006-01-23 | 2007-08-02 | Seiko Epson Corp | 導体パターン用インク、導体パターン、配線基板及び電気光学装置並びに電子機器 |
| US20090148600A1 (en) | 2007-12-05 | 2009-06-11 | Xerox Corporation | Metal Nanoparticles Stabilized With a Carboxylic Acid-Organoamine Complex |
| CN101271929B (zh) | 2008-05-04 | 2012-02-01 | 常州亿晶光电科技有限公司 | 无铅太阳能电池银浆及其制备方法 |
| JP5527060B2 (ja) | 2010-07-06 | 2014-06-18 | コニカミノルタ株式会社 | 有機光電変換素子、その製造方法及び太陽電池 |
| KR101487342B1 (ko) * | 2010-07-30 | 2015-01-30 | 주식회사 잉크테크 | 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막 |
| JPWO2012114925A1 (ja) * | 2011-02-23 | 2014-07-07 | ナミックス株式会社 | 導電性組成物及びそれを用いた外部電極 |
| CN104024351B (zh) | 2011-09-06 | 2016-11-16 | 汉高知识产权控股有限责任公司 | 导电金属和方法 |
| WO2013096664A1 (en) * | 2011-12-23 | 2013-06-27 | The Board Of Trustees Of The University Of Illinois | Ink composition for making a conductive silver structure |
| JP6001861B2 (ja) | 2012-01-11 | 2016-10-05 | 株式会社ダイセル | 銀ナノ粒子の製造方法及び銀ナノ粒子、並びに銀塗料組成物 |
| KR20150006091A (ko) * | 2012-02-29 | 2015-01-15 | 이슘 리서치 디벨롭먼트 컴퍼니 오브 더 히브루 유니버시티 오브 예루살렘, 엘티디. | 금속 전구체 나노입자들을 함유한 잉크 |
| CN102618033B (zh) | 2012-03-28 | 2013-09-11 | 成都多吉昌新材料有限公司 | 一种组合物、含该组合物的led线路板基材和制作方法 |
| CN104341860B (zh) | 2013-08-01 | 2019-04-09 | 索尼公司 | 纳米导电墨水及其制备方法 |
| JP6443024B2 (ja) | 2014-12-11 | 2018-12-26 | 東洋インキＳｃホールディングス株式会社 | 金属ナノ粒子非水性分散体の製造方法 |
| EP3085811A1 (en) * | 2015-04-20 | 2016-10-26 | Heraeus Deutschland GmbH & Co. KG | Low temperature ag-compositions |
| KR20170019157A (ko) * | 2015-08-11 | 2017-02-21 | (주)창성 | 저온 소성용 구리 나노잉크 제조를 위한 구리 나노 입자 제조방법 |
| EP3491082B1 (en) * | 2016-07-28 | 2022-03-30 | National Research Council of Canada | Copper ink and conductive solderable copper traces produced therefrom |
| JP6851776B2 (ja) * | 2016-10-31 | 2021-03-31 | トッパン・フォームズ株式会社 | 積層体及びその製造方法 |
| CN106700735B (zh) | 2016-12-02 | 2020-06-02 | 东北大学 | 可在空气中加热的无颗粒导电铜墨水及其制备和使用方法 |
| CN106752381A (zh) | 2016-12-02 | 2017-05-31 | 东北大学 | 无颗粒银墨水及其制备方法和透明银导电薄膜及其制备方法 |
| TWI874294B (zh) | 2017-02-08 | 2025-03-01 | 加拿大國家研究委員會 | 可印刷分子油墨 |
-
2019
- 2019-08-02 EP EP19844170.1A patent/EP3830200A4/en active Pending
- 2019-08-02 KR KR1020217006583A patent/KR102790704B1/ko active Active
- 2019-08-02 WO PCT/IB2019/056612 patent/WO2020026207A1/en not_active Ceased
- 2019-08-02 US US17/265,572 patent/US11873413B2/en active Active
- 2019-08-02 CN CN201980064477.7A patent/CN112789331B/zh active Active
- 2019-08-02 JP JP2021505856A patent/JP7374177B2/ja active Active
- 2019-08-02 CA CA3108631A patent/CA3108631A1/en active Pending
- 2019-08-02 TW TW108127562A patent/TWI825140B/zh active
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