JPWO2019236230A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2019236230A5
JPWO2019236230A5 JP2020545640A JP2020545640A JPWO2019236230A5 JP WO2019236230 A5 JPWO2019236230 A5 JP WO2019236230A5 JP 2020545640 A JP2020545640 A JP 2020545640A JP 2020545640 A JP2020545640 A JP 2020545640A JP WO2019236230 A5 JPWO2019236230 A5 JP WO2019236230A5
Authority
JP
Japan
Prior art keywords
array
communication device
antenna patches
handheld communication
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020545640A
Other languages
English (en)
Japanese (ja)
Other versions
JP7544447B2 (ja
JP2021526321A (ja
JP2021526321A5 (https=
Publication date
Priority claimed from US16/000,795 external-priority patent/US10797394B2/en
Application filed filed Critical
Publication of JP2021526321A publication Critical patent/JP2021526321A/ja
Publication of JPWO2019236230A5 publication Critical patent/JPWO2019236230A5/ja
Publication of JP2021526321A5 publication Critical patent/JP2021526321A5/ja
Priority to JP2024139346A priority Critical patent/JP7772304B2/ja
Application granted granted Critical
Publication of JP7544447B2 publication Critical patent/JP7544447B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2020545640A 2018-06-05 2019-05-06 アンテナモジュールおよび通信デバイス Active JP7544447B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024139346A JP7772304B2 (ja) 2018-06-05 2024-08-20 アンテナモジュールおよび通信デバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/000,795 2018-06-05
US16/000,795 US10797394B2 (en) 2018-06-05 2018-06-05 Antenna modules and communication devices
PCT/US2019/030838 WO2019236230A1 (en) 2018-06-05 2019-05-06 Antenna modules and communication devices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024139346A Division JP7772304B2 (ja) 2018-06-05 2024-08-20 アンテナモジュールおよび通信デバイス

Publications (4)

Publication Number Publication Date
JP2021526321A JP2021526321A (ja) 2021-09-30
JPWO2019236230A5 true JPWO2019236230A5 (https=) 2022-04-06
JP2021526321A5 JP2021526321A5 (https=) 2022-04-06
JP7544447B2 JP7544447B2 (ja) 2024-09-03

Family

ID=68695302

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020545640A Active JP7544447B2 (ja) 2018-06-05 2019-05-06 アンテナモジュールおよび通信デバイス
JP2024139346A Active JP7772304B2 (ja) 2018-06-05 2024-08-20 アンテナモジュールおよび通信デバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024139346A Active JP7772304B2 (ja) 2018-06-05 2024-08-20 アンテナモジュールおよび通信デバイス

Country Status (8)

Country Link
US (3) US10797394B2 (https=)
EP (1) EP3804032A4 (https=)
JP (2) JP7544447B2 (https=)
KR (1) KR102344153B1 (https=)
CN (1) CN111886755A (https=)
SG (1) SG11202009749TA (https=)
TW (1) TWI797316B (https=)
WO (1) WO2019236230A1 (https=)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11088468B2 (en) * 2017-12-28 2021-08-10 Samsung Electro-Mechanics Co., Ltd. Antenna module
US11336015B2 (en) 2018-03-28 2022-05-17 Intel Corporation Antenna boards and communication devices
US11380979B2 (en) 2018-03-29 2022-07-05 Intel Corporation Antenna modules and communication devices
KR102468136B1 (ko) 2018-04-23 2022-11-18 삼성전자 주식회사 안테나 장치 및 이를 포함하는 전자 장치
US11011827B2 (en) 2018-05-11 2021-05-18 Intel IP Corporation Antenna boards and communication devices
US11509037B2 (en) 2018-05-29 2022-11-22 Intel Corporation Integrated circuit packages, antenna modules, and communication devices
US10797394B2 (en) 2018-06-05 2020-10-06 Intel Corporation Antenna modules and communication devices
EP3588673B1 (en) * 2018-06-29 2024-04-03 Advanced Automotive Antennas, S.L. Under-roof antenna modules for vehicles
KR102514474B1 (ko) * 2018-07-13 2023-03-28 삼성전자주식회사 안테나 구조체 및 안테나를 포함하는 전자 장치
JP7047918B2 (ja) * 2018-08-06 2022-04-05 株式会社村田製作所 アンテナモジュール
KR102526400B1 (ko) * 2018-09-06 2023-04-28 삼성전자주식회사 5g 안테나 모듈을 포함하는 전자 장치
JP2020065246A (ja) * 2018-10-16 2020-04-23 株式会社村田製作所 通信装置
KR102572251B1 (ko) * 2018-11-09 2023-08-29 삼성전자주식회사 지정된 방향 방사 구조를 갖는 안테나 및 그것을 포함하는 전자 장치
US11258165B2 (en) * 2018-12-31 2022-02-22 Qualcomm Incorporated Asymmetric antenna structure
CN113873799B (zh) 2019-02-19 2023-11-21 三星电子株式会社 包括天线的电子装置
US12205877B2 (en) * 2019-02-21 2025-01-21 AT&S(Chongqing) Company Limited Ultra-thin component carrier having high stiffness and method of manufacturing the same
EP3903378B8 (en) * 2019-03-04 2025-11-12 Huawei Technologies Co., Ltd. Millimeter-wave assembly
US11031681B2 (en) 2019-06-20 2021-06-08 Nxp Usa, Inc. Package integrated waveguide
US11335652B2 (en) * 2019-07-29 2022-05-17 Nxp Usa, Inc. Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide
US10993325B2 (en) 2019-07-31 2021-04-27 Abb Power Electronics Inc. Interposer printed circuit boards for power modules
US11490517B2 (en) * 2019-07-31 2022-11-01 ABB Power Electronics, Inc. Interposer printed circuit boards for power modules
WO2021025471A1 (en) * 2019-08-05 2021-02-11 Samsung Electronics Co., Ltd. Antenna module and electronic device for using the antenna module
US11171424B2 (en) * 2019-08-21 2021-11-09 Samsung Electronics Co., Ltd. Solution for beam tilting associated with dual-polarized MM-wave antennas in 5G terminals
US11522270B2 (en) 2019-08-21 2022-12-06 Samsung Electronics Co., Ltd. Solution for beam tilting associated with dual-polarized mm-Wave antennas in 5G terminals
WO2021059693A1 (ja) * 2019-09-27 2021-04-01 株式会社村田製作所 アンテナ基板、アンテナモジュール、アンテナ基板の製造方法
CN113036461A (zh) * 2019-12-25 2021-06-25 中国移动通信集团终端有限公司 系统级封装天线模组和终端
DE102020203970A1 (de) * 2020-03-26 2021-09-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Hochfrequenzanordnung mit einer vorderseitigen und einer rückseitigen Antenne
US12300893B2 (en) * 2020-03-31 2025-05-13 3M Innovative Properties Company Antenna assemblies
KR102755829B1 (ko) * 2020-04-06 2025-01-17 동우 화인켐 주식회사 안테나 삽입 전극 구조체 및 이를 포함하는 화상 표시 장치
KR20210157643A (ko) 2020-06-22 2021-12-29 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 안테나 모듈
WO2022038879A1 (ja) * 2020-08-21 2022-02-24 株式会社村田製作所 アンテナモジュール、およびそれを搭載した通信装置
KR20220034547A (ko) * 2020-09-11 2022-03-18 삼성전기주식회사 안테나 장치 및 이를 포함하는 전자 장치
KR102930613B1 (ko) * 2020-09-29 2026-02-24 동우 화인켐 주식회사 안테나 패키지 및 이를 포함하는 화상 표시 장치
US11735539B2 (en) * 2020-11-09 2023-08-22 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming discrete antenna modules
US11658391B2 (en) * 2020-12-21 2023-05-23 Qualcomm Incorporated Antenna module
WO2022255763A1 (ko) * 2021-06-01 2022-12-08 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 안테나 장치
WO2022258130A1 (en) * 2021-06-07 2022-12-15 Huawei Technologies Co., Ltd. Signal distribution network and method of installing signal distribution network in antenna
KR102891793B1 (ko) * 2021-06-11 2025-11-28 엘지이노텍 주식회사 안테나 모듈
WO2023277202A1 (ko) 2021-06-28 2023-01-05 엘지전자 주식회사 디스플레이 장치
KR20230006224A (ko) * 2021-07-02 2023-01-10 삼성전자주식회사 안테나를 포함하는 전자 장치
CN113647929B (zh) * 2021-08-17 2023-10-31 电子科技大学 一种微波轴向断层脑成像的穿戴设备
US11735530B2 (en) * 2021-08-25 2023-08-22 STATS ChipPAC Pte. Ltd. Semiconductor device and method of integrating RF antenna interposer with semiconductor package
KR20230069548A (ko) * 2021-11-12 2023-05-19 삼성전자주식회사 안테나 모듈을 포함하는 전자 장치
CN113809514B (zh) * 2021-11-16 2022-02-15 深圳市睿德通讯科技有限公司 天线设备及电子装置
EP4207490A1 (en) * 2022-01-03 2023-07-05 MediaTek Inc. Antenna module and antenna system applying the antenna module
US12218419B2 (en) 2022-01-03 2025-02-04 Mediatek Inc. Antenna module and antenna system applying the antenna module
CN114430110A (zh) * 2022-01-25 2022-05-03 蓬托森思股份有限公司 一种天线
CN114844543B (zh) * 2022-03-10 2023-10-03 电子科技大学 一种低交叉极化的共形阵列混合波束形成码本设计方法
US20240387986A1 (en) * 2023-05-15 2024-11-21 Yun-Chan Tsai Flexible antenna structure
CN117438774B (zh) * 2023-11-17 2024-05-28 云谷(固安)科技有限公司 天线组件、壳体及移动终端
CN117498027A (zh) * 2024-01-03 2024-02-02 福州福大信捷天线技术有限公司 一种弧形抗干扰卫星导航终端天线
CN120149801B (zh) * 2025-05-14 2025-08-15 天目山实验室 基于高共形异质层合材料的紧凑型柔性低频电磁通信装置

Family Cites Families (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838475A (en) * 1987-08-28 1989-06-13 Motorola, Inc. Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device
SE9603565D0 (sv) 1996-05-13 1996-09-30 Allgon Ab Flat antenna
US6404643B1 (en) 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
US6870438B1 (en) 1999-11-10 2005-03-22 Kyocera Corporation Multi-layered wiring board for slot coupling a transmission line to a waveguide
EP1304766A4 (en) 2000-06-30 2009-05-13 Sharp Kk RADIO COMMUNICATION DEVICE WITH INTEGRATED ANTENNA, INTEGRATED TRANSMITTER AND INTEGRATED RECEIVER
US6456242B1 (en) * 2001-03-05 2002-09-24 Magis Networks, Inc. Conformal box antenna
GB2397697A (en) * 2003-01-22 2004-07-28 Roke Manor Research Folded flexible antenna array
US7084823B2 (en) 2003-02-26 2006-08-01 Skycross, Inc. Integrated front end antenna
GB0304327D0 (en) 2003-02-26 2003-04-02 Rolls Royce Plc Component casting
JP4189274B2 (ja) 2003-06-25 2008-12-03 京セラ株式会社 アンテナ装置
US6974724B2 (en) 2004-04-28 2005-12-13 Nokia Corporation Shielded laminated structure with embedded chips
US7119745B2 (en) 2004-06-30 2006-10-10 International Business Machines Corporation Apparatus and method for constructing and packaging printed antenna devices
JP4401889B2 (ja) * 2004-07-29 2010-01-20 パナソニック株式会社 折畳式携帯無線機
US7289069B2 (en) * 2005-01-04 2007-10-30 Nokia Corporation Wireless device antenna
FR2885456A1 (fr) * 2005-05-03 2006-11-10 Thomson Licensing Sa Dispositif rayonnant polyvalent
US7342299B2 (en) 2005-09-21 2008-03-11 International Business Machines Corporation Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
KR200406775Y1 (ko) 2005-10-18 2006-01-24 주식회사 에이텔시스텍 차량용 안테나
JP2007116217A (ja) 2005-10-18 2007-05-10 Hitachi Ltd ミリ波レーダ装置およびそれを用いたミリ波レーダシステム
US7636063B2 (en) 2005-12-02 2009-12-22 Eswarappa Channabasappa Compact broadband patch antenna
US7265719B1 (en) 2006-05-11 2007-09-04 Ball Aerospace & Technologies Corp. Packaging technique for antenna systems
US20080204238A1 (en) 2007-02-28 2008-08-28 Symbol Technologies, Inc. Method to RFID enable electronic devices
US8374558B2 (en) * 2007-08-27 2013-02-12 Rambus Inc. Antenna array with flexible interconnect for a mobile wireless device
JP2009065321A (ja) 2007-09-05 2009-03-26 Toppan Printing Co Ltd パッチアンテナ
US7830301B2 (en) 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
US7696930B2 (en) 2008-04-14 2010-04-13 International Business Machines Corporation Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities
US8599072B2 (en) 2008-06-10 2013-12-03 Apple Inc. Antennas
KR100988909B1 (ko) 2008-09-23 2010-10-20 한국전자통신연구원 고이득 및 광대역 특성을 갖는 마이크로스트립 패치 안테나
CN101800354B (zh) 2008-11-06 2015-03-11 庞研究有限公司 嵌入电池内的天线、无线设备和无线设备的智能外壳
US8706049B2 (en) * 2008-12-31 2014-04-22 Intel Corporation Platform integrated phased array transmit/receive module
US8256685B2 (en) 2009-06-30 2012-09-04 International Business Machines Corporation Compact millimeter wave packages with integrated antennas
JP5507692B2 (ja) 2009-09-08 2014-05-28 モレックス インコーポレイテド 間接的な給電アンテナ
US8866258B2 (en) 2009-10-06 2014-10-21 Broadcom Corporation Interposer structure with passive component and method for fabricating same
DE102010006809A1 (de) 2010-02-04 2011-08-04 EADS Deutschland GmbH, 85521 Gestapelte Mikrostreifen-Antenne
US8411444B2 (en) 2010-09-15 2013-04-02 International Business Machines Corporation Thermal interface material application for integrated circuit cooling
TWI453990B (zh) 2010-11-17 2014-09-21 Univ Nat Central 雙極化雙饋入之平面天線結構
US8988299B2 (en) 2011-02-17 2015-03-24 International Business Machines Corporation Integrated antenna for RFIC package applications
US9742077B2 (en) 2011-03-15 2017-08-22 Intel Corporation Mm-wave phased array antenna with beam tilting radiation pattern
KR101780024B1 (ko) 2011-10-19 2017-09-20 삼성전자주식회사 안테나-회로기판 패키지
US8648454B2 (en) 2012-02-14 2014-02-11 International Business Machines Corporation Wafer-scale package structures with integrated antennas
US9196951B2 (en) 2012-11-26 2015-11-24 International Business Machines Corporation Millimeter-wave radio frequency integrated circuit packages with integrated antennas
US9225058B2 (en) * 2013-03-15 2015-12-29 Blackberry Limited Flex PCB folded antenna
US9806422B2 (en) 2013-09-11 2017-10-31 International Business Machines Corporation Antenna-in-package structures with broadside and end-fire radiations
TWI523315B (zh) * 2013-10-31 2016-02-21 環旭電子股份有限公司 使用硬軟結合板整合天線之無線模組
US10686252B2 (en) 2014-06-16 2020-06-16 Apple Inc. Electronic device with patch antenna
US9391370B2 (en) 2014-06-30 2016-07-12 Samsung Electronics Co., Ltd. Antenna feed integrated on multi-layer PCB
US9620464B2 (en) 2014-08-13 2017-04-11 International Business Machines Corporation Wireless communications package with integrated antennas and air cavity
US10193231B2 (en) 2015-03-02 2019-01-29 Trimble Inc. Dual-frequency patch antennas
US9667290B2 (en) * 2015-04-17 2017-05-30 Apple Inc. Electronic device with millimeter wave antennas
JP6591909B2 (ja) 2015-07-27 2019-10-16 京セラ株式会社 アンテナモジュール
CN208016128U (zh) * 2015-07-30 2018-10-26 株式会社村田制作所 多层基板及电子设备
US10347967B2 (en) 2016-01-26 2019-07-09 Qualcomm Incorporated Signal delivery and antenna layout using flexible printed circuit board (PCB)
US10418687B2 (en) * 2016-07-22 2019-09-17 Apple Inc. Electronic device with millimeter wave antennas on printed circuits
US10186756B2 (en) 2016-08-01 2019-01-22 Intel IP Corporation Antennas in electronic devices
JP6500859B2 (ja) * 2016-08-22 2019-04-17 株式会社村田製作所 無線モジュール
US10205224B2 (en) 2016-09-23 2019-02-12 Apple Inc. Electronic device with millimeter wave antenna arrays
JP6572924B2 (ja) * 2017-03-02 2019-09-11 Tdk株式会社 アンテナ装置
CN110785893B (zh) * 2017-06-14 2021-06-11 株式会社村田制作所 天线模块和通信装置
US11245175B2 (en) 2017-09-30 2022-02-08 Qualcomm Incorporated Antenna module configurations
KR102402492B1 (ko) 2017-11-01 2022-05-27 삼성전자주식회사 안테나를 포함하는 전자 장치
US11050150B2 (en) 2017-12-01 2021-06-29 Samsung Electro-Mechanics Co., Ltd. Antenna apparatus and antenna module
US10580761B2 (en) 2017-12-13 2020-03-03 Intel Corporation Systems in packages including wide-band phased-array antennas and methods of assembling same
US20190260110A1 (en) 2018-02-20 2019-08-22 Intel Corporation Antenna modules and communication devices
CN111742447B (zh) 2018-02-22 2021-07-23 株式会社村田制作所 天线模块和搭载有天线模块的通信装置
US11336015B2 (en) 2018-03-28 2022-05-17 Intel Corporation Antenna boards and communication devices
US11380979B2 (en) 2018-03-29 2022-07-05 Intel Corporation Antenna modules and communication devices
US11011827B2 (en) 2018-05-11 2021-05-18 Intel IP Corporation Antenna boards and communication devices
US11509037B2 (en) 2018-05-29 2022-11-22 Intel Corporation Integrated circuit packages, antenna modules, and communication devices
US10797394B2 (en) 2018-06-05 2020-10-06 Intel Corporation Antenna modules and communication devices
US11729902B2 (en) 2019-02-05 2023-08-15 Intel Corporation Radio frequency front-end structures

Similar Documents

Publication Publication Date Title
JPWO2019236230A5 (https=)
JP2021526321A5 (https=)
US11664596B2 (en) Antenna modules and communication devices
US12068525B2 (en) Integrated circuit packages, antenna modules, and communication devices
TWI676219B (zh) 半導體封裝
US9113545B2 (en) Tape wiring substrate and chip-on-film package including the same
CN106856195B (zh) 包括侧屏蔽部件的半导体封装
US8951048B2 (en) Printed circuit board having terminals
KR20200113186A (ko) 안테나 모듈 및 통신 장치
US20090322620A1 (en) Electronic device with edge surface antenna elements and related methods
CN110600861A (zh) 多频带双极化天线结构及其无线通信设备
TW202005180A (zh) 天線結構及具有該天線結構的無線通訊裝置
KR100355223B1 (ko) 멀티 인라인 메모리 모듈 및 그와 결합되는 전자 부품 소켓
US20030104184A1 (en) Multiple wiring board
WO2020008980A1 (ja) アンテナ装置
JP7315043B2 (ja) パッチアンテナ
US9883593B2 (en) Semiconductor modules and semiconductor packages
KR20230052577A (ko) 칩 패치 안테나 및 칩 패치 안테나 모듈
US10770789B2 (en) Antenna structure
US12400979B2 (en) Integrated antenna package structure and manufacturing method thereof
CN110660782A (zh) 在裸片堆叠中并入毫米波天线的堆叠式存储器封装
CN116364690A (zh) 具有天线阵列的半导体封装结构
CN212366219U (zh) 指向性天线
JP7760216B2 (ja) 平面アンテナの構造
JP7660720B2 (ja) アンテナおよび通信モジュール