JPWO2019183023A5 - - Google Patents

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Publication number
JPWO2019183023A5
JPWO2019183023A5 JP2020549817A JP2020549817A JPWO2019183023A5 JP WO2019183023 A5 JPWO2019183023 A5 JP WO2019183023A5 JP 2020549817 A JP2020549817 A JP 2020549817A JP 2020549817 A JP2020549817 A JP 2020549817A JP WO2019183023 A5 JPWO2019183023 A5 JP WO2019183023A5
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Japan
Prior art keywords
semiconductor wafer
liquid
film
wafer
container
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JP2020549817A
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English (en)
Japanese (ja)
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JP2021518664A5 (https=
JP2021518664A (ja
JP7289027B2 (ja
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Priority claimed from PCT/US2019/022859 external-priority patent/WO2019183023A1/en
Publication of JP2021518664A publication Critical patent/JP2021518664A/ja
Publication of JP2021518664A5 publication Critical patent/JP2021518664A5/ja
Publication of JPWO2019183023A5 publication Critical patent/JPWO2019183023A5/ja
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JP2020549817A 2018-03-19 2019-03-19 形状メトロロジのための基板保持装置及び方法 Active JP7289027B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862645128P 2018-03-19 2018-03-19
US62/645,128 2018-03-19
PCT/US2019/022859 WO2019183023A1 (en) 2018-03-19 2019-03-19 Substrate holding apparatus and method for shape metrology

Publications (4)

Publication Number Publication Date
JP2021518664A JP2021518664A (ja) 2021-08-02
JP2021518664A5 JP2021518664A5 (https=) 2022-03-22
JPWO2019183023A5 true JPWO2019183023A5 (https=) 2022-03-22
JP7289027B2 JP7289027B2 (ja) 2023-06-09

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ID=67905048

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JP2020549817A Active JP7289027B2 (ja) 2018-03-19 2019-03-19 形状メトロロジのための基板保持装置及び方法

Country Status (6)

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US (2) US11247309B2 (https=)
JP (1) JP7289027B2 (https=)
KR (1) KR102719817B1 (https=)
CN (1) CN111699548B (https=)
TW (1) TWI803597B (https=)
WO (1) WO2019183023A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111699548B (zh) * 2018-03-19 2023-12-05 东京毅力科创株式会社 基片固持设备和形状度量方法
US12469725B2 (en) 2021-06-27 2025-11-11 Delta Design, Inc. Method for determining corrective film pattern to reduce semiconductor wafer bow

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141331A (en) * 1981-02-24 1982-09-01 Nec Home Electronics Ltd Thin plate piece conveying method
US5235995A (en) * 1989-03-27 1993-08-17 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
JPH06331339A (ja) 1993-05-21 1994-12-02 Hitachi Cable Ltd 薄板の変形測定方法及びその装置
JPH0776774A (ja) 1993-06-24 1995-03-20 Nissin Electric Co Ltd 基板保持装置
JPH09258432A (ja) * 1996-03-21 1997-10-03 Toshiba Corp ガラスマスクの保持装置、及びこれを有する露光装置及び検査装置、並びにガラスマスクの保持方法、製造方法及び検査方法
US6439967B2 (en) * 1998-09-01 2002-08-27 Micron Technology, Inc. Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
US6602380B1 (en) * 1998-10-28 2003-08-05 Micron Technology, Inc. Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
JP2001196446A (ja) 2000-01-06 2001-07-19 Olympus Optical Co Ltd ホルダ装置
JP4108941B2 (ja) * 2000-10-31 2008-06-25 株式会社荏原製作所 基板の把持装置、処理装置、及び把持方法
JP3770078B2 (ja) * 2000-11-29 2006-04-26 セイコーエプソン株式会社 薄板状被測定物の保持装置及び保持方法、水晶板のカット面検査装置及び検査方法、薄板状被測定物の平坦度測定装置及び測定方法
JP2005019439A (ja) * 2003-06-23 2005-01-20 Tokyo Seimitsu Co Ltd ウェーハ受渡し方法、ウェーハ受渡し装置及びそれを用いたウェーハ加工装置
JP4265306B2 (ja) 2003-06-27 2009-05-20 株式会社東京精密 ウェーハ受渡し装置
US7181132B2 (en) * 2003-08-20 2007-02-20 Asm International N.V. Method and system for loading substrate supports into a substrate holder
US7301623B1 (en) * 2003-12-16 2007-11-27 Nanometrics Incorporated Transferring, buffering and measuring a substrate in a metrology system
US10896842B2 (en) * 2009-10-20 2021-01-19 Tokyo Electron Limited Manufacturing method of sample table
JP5414602B2 (ja) * 2010-03-31 2014-02-12 株式会社日立ハイテクノロジーズ 検査装置
NL2007182A (en) * 2010-08-23 2012-02-27 Asml Netherlands Bv Fluid handling structure, module for an immersion lithographic apparatus, lithographic apparatus and device manufacturing method.
CN103278103B (zh) * 2013-05-18 2016-01-06 大连理工大学 一种薄基片变形的测量方法与装置
JP2015060852A (ja) * 2013-09-17 2015-03-30 株式会社東芝 半導体装置の製造方法及び製造装置
AT517792A3 (de) * 2013-09-26 2018-04-15 Suss Microtec Lithography Gmbh Aufspannvorrichtung zum Ansaugen und Halten eines Wafers
CN111699548B (zh) * 2018-03-19 2023-12-05 东京毅力科创株式会社 基片固持设备和形状度量方法

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