JPWO2018177747A5 - - Google Patents
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- Publication number
- JPWO2018177747A5 JPWO2018177747A5 JP2019553253A JP2019553253A JPWO2018177747A5 JP WO2018177747 A5 JPWO2018177747 A5 JP WO2018177747A5 JP 2019553253 A JP2019553253 A JP 2019553253A JP 2019553253 A JP2019553253 A JP 2019553253A JP WO2018177747 A5 JPWO2018177747 A5 JP WO2018177747A5
- Authority
- JP
- Japan
- Prior art keywords
- measuring radiation
- antireflection coating
- measuring
- microlithography
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005855 radiation Effects 0.000 claims description 20
- 238000000576 coating method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 9
- 238000001393 microlithography Methods 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 19
- 235000012431 wafers Nutrition 0.000 claims 7
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000002310 reflectometry Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 229910021418 black silicon Inorganic materials 0.000 claims 1
- 230000001419 dependent effect Effects 0.000 claims 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 claims 1
- 238000001914 filtration Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017205212.0 | 2017-03-28 | ||
| DE102017205212.0A DE102017205212A1 (de) | 2017-03-28 | 2017-03-28 | Verfahren zum Detektieren von Partikeln an der Oberfläche eines Objekts, Wafer und Maskenblank |
| PCT/EP2018/056352 WO2018177747A1 (de) | 2017-03-28 | 2018-03-14 | Verfahren zum detektieren von partikeln an der oberfläche eines objekts, wafer und maskenblank |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2020515844A JP2020515844A (ja) | 2020-05-28 |
| JPWO2018177747A5 true JPWO2018177747A5 (https=) | 2022-11-17 |
| JP2020515844A5 JP2020515844A5 (https=) | 2022-11-17 |
| JP7300998B2 JP7300998B2 (ja) | 2023-06-30 |
Family
ID=61691960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019553253A Active JP7300998B2 (ja) | 2017-03-28 | 2018-03-14 | 物体、ウェハ、及びマスクブランクの表面上の粒子を検出する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11555783B2 (https=) |
| EP (1) | EP3602198B1 (https=) |
| JP (1) | JP7300998B2 (https=) |
| KR (1) | KR102563712B1 (https=) |
| DE (1) | DE102017205212A1 (https=) |
| WO (1) | WO2018177747A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020216258A1 (de) * | 2020-12-18 | 2022-06-23 | Q.ant GmbH | Verfahren zum Kalibrieren eines Partikelsensors, Partikelsensor und Vorrichtung mit einem Partikelsensor |
| DE112021007875T5 (de) * | 2021-06-24 | 2024-04-11 | Beijing Tongmei Xtal Technology Co., Ltd. | Verfahren und einrichtung zum detektieren von oberflächen-haze von materialien |
| CN116833169A (zh) * | 2023-07-26 | 2023-10-03 | 青岛融合智能科技有限公司 | 盖板玻璃加工用非接触式除尘和缺陷检测装置 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5072911A (https=) * | 1973-10-30 | 1975-06-16 | ||
| JPH0682727B2 (ja) * | 1986-02-18 | 1994-10-19 | ホ−ヤ株式会社 | 検査用基板とその製造方法 |
| JPH06103272B2 (ja) * | 1988-01-21 | 1994-12-14 | 株式会社日立製作所 | X線露光用マスクのマスク上異物検査方法 |
| JP2731914B2 (ja) * | 1988-08-25 | 1998-03-25 | ホーヤ株式会社 | 検査用基板およびその製造方法 |
| US5242711A (en) * | 1991-08-16 | 1993-09-07 | Rockwell International Corp. | Nucleation control of diamond films by microlithographic patterning |
| JP3253177B2 (ja) * | 1993-06-15 | 2002-02-04 | キヤノン株式会社 | 表面状態検査装置 |
| JP3624359B2 (ja) * | 1995-10-18 | 2005-03-02 | 富士通株式会社 | 光変調素子、その製造方法、及び、光学装置 |
| US6137570A (en) * | 1998-06-30 | 2000-10-24 | Kla-Tencor Corporation | System and method for analyzing topological features on a surface |
| US7061601B2 (en) * | 1999-07-02 | 2006-06-13 | Kla-Tencor Technologies Corporation | System and method for double sided optical inspection of thin film disks or wafers |
| WO2002040970A1 (en) * | 2000-11-15 | 2002-05-23 | Real Time Metrology, Inc. | Optical method and apparatus for inspecting large area planar objects |
| US6608321B1 (en) * | 2001-02-01 | 2003-08-19 | Advanced Micro Devices, Inc. | Differential wavelength inspection system |
| JP2003177100A (ja) * | 2001-12-12 | 2003-06-27 | Sumitomo Mitsubishi Silicon Corp | 鏡面面取りウェーハの品質評価方法 |
| US6781688B2 (en) * | 2002-10-02 | 2004-08-24 | Kla-Tencor Technologies Corporation | Process for identifying defects in a substrate having non-uniform surface properties |
| US20060008749A1 (en) * | 2004-07-08 | 2006-01-12 | Frank Sobel | Method for manufacturing of a mask blank for EUV photolithography and mask blank |
| WO2007039161A1 (en) * | 2005-09-27 | 2007-04-12 | Schott Ag | Mask blanc and photomasks having antireflective properties |
| JP2006270111A (ja) * | 2006-04-21 | 2006-10-05 | Hitachi Ltd | 半導体デバイスの検査方法及びその装置 |
| DE102008022792A1 (de) * | 2008-05-08 | 2009-11-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Elektrostatisches Halteelement mit Antireflexbeschichtung, Vermessungsverfahren und Verwendung des Halteelementes |
| JP5564807B2 (ja) * | 2009-03-12 | 2014-08-06 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置及び欠陥検査方法 |
| JP2010267934A (ja) * | 2009-05-18 | 2010-11-25 | Panasonic Corp | 太陽電池およびその製造方法 |
| WO2010147846A2 (en) * | 2009-06-19 | 2010-12-23 | Kla-Tencor Technologies Corporation | Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks |
| JP5297930B2 (ja) * | 2009-07-29 | 2013-09-25 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置およびその方法 |
| CN102117850B (zh) * | 2010-11-12 | 2012-09-19 | 北京大学 | 微纳复合结构的太阳能电池及其制备方法 |
| WO2012075351A2 (en) * | 2010-12-03 | 2012-06-07 | Bae Systems Information And Electronic Systems Integration Inc. | Asymmetric slotted waveguide and method for fabricating the same |
| JP5988690B2 (ja) * | 2012-05-18 | 2016-09-07 | 浜松ホトニクス株式会社 | 分光センサ |
| DE102014204171A1 (de) | 2014-03-06 | 2015-09-24 | Carl Zeiss Smt Gmbh | Optisches Element und optische Anordnung damit |
| JP6044849B2 (ja) * | 2014-03-24 | 2016-12-14 | コニカミノルタ株式会社 | 処理装置および粒子固定方法 |
| US9599573B2 (en) * | 2014-12-02 | 2017-03-21 | Kla-Tencor Corporation | Inspection systems and techniques with enhanced detection |
| WO2017025373A1 (en) * | 2015-08-12 | 2017-02-16 | Asml Netherlands B.V. | Inspection apparatus, inspection method and manufacturing method |
| JP6482993B2 (ja) * | 2015-09-04 | 2019-03-13 | シャープ株式会社 | 照明装置 |
| JP2017054105A (ja) * | 2015-09-11 | 2017-03-16 | 旭硝子株式会社 | マスクブランク |
-
2017
- 2017-03-28 DE DE102017205212.0A patent/DE102017205212A1/de not_active Ceased
-
2018
- 2018-03-14 KR KR1020197031217A patent/KR102563712B1/ko active Active
- 2018-03-14 JP JP2019553253A patent/JP7300998B2/ja active Active
- 2018-03-14 WO PCT/EP2018/056352 patent/WO2018177747A1/de not_active Ceased
- 2018-03-14 EP EP18712138.9A patent/EP3602198B1/de active Active
-
2019
- 2019-09-27 US US16/585,374 patent/US11555783B2/en active Active
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