JPWO2018087902A1 - Immersion cooling electronic device, power supply unit, and cooling system - Google Patents

Abstract

Provided is an electronic device that is immersed in a cooling fluid in a cooling device to be directly cooled. The electronic device includes a carrier substrate provided with a voltage input end for supplying a DC voltage for the electronic device, and a support member supporting the carrier substrate. The voltage input end is electrically connected to the voltage output end of the power supply unit. The support member supports the carrier substrate so as to be located at the top of the power supply unit installed at the bottom of the cooling tank provided in the cooling device when the electronic device is electrically connected to the power supply unit. The support member may include a backboard or frame structure in which the carrier substrate is secured to one side. The backboard or frame structure may be slidably supported by a plurality of support columns vertically fixed in the cooling tank. The backboard or frame structure may include a support pin or guide pin inserted from above into a bracket fixed in the cooling bath.

Description

  The present invention relates to an electronic device and a power supply unit, and more particularly to an electronic device which is immersed in a cooling liquid in a cooling device and directly cooled, and a power supply unit. The present invention also relates to a cooling system using the electronic device and the power supply unit. In the present specification, an electronic device generally refers to an electronic device that requires super high performance operation and stable operation such as a super computer and a data center, and generates a large amount of heat from itself, but is limited thereto is not. A power supply unit is a step-down device that steps down high-voltage input (for example, DC380V, AC200V) from an external power supply to a DC voltage output (for example, DC48V (including DC47.5V), DC12V) for electronic devices. The unit that contains

  One of the biggest problems in determining the limit of the performance of supercomputers in recent years is power consumption, and the importance of research on power saving performance of supercomputers has already been widely recognized. That is, the speed performance per power consumption (Flops / W) is one index for evaluating a super computer. In addition, in the data center, about 45% of the power consumption of the entire data center is considered to be cooling, and the demand for reduction of the power consumption by the improvement of the cooling efficiency is increasing.

  Air-cooled and liquid-cooled systems are conventionally used to cool supercomputers and data centers. The liquid cooling type generally uses a liquid having a heat transfer performance much better than that of air, and thus is generally considered to have a good cooling efficiency. In particular, the immersion cooling system using a fluorocarbon-based coolant is superior to maintenance of electronic devices (specifically, for example, adjustment, inspection, repair, replacement, extension, the same applies hereinafter) as compared to one using synthetic oil. Etc., and has attracted attention in recent years.

  The inventor has already developed a small-sized, highly efficient immersion cooling device for small-scale immersion cooling supercomputers. The device is applied to and operated by a small super computer "Suiren" installed at the High Energy Accelerator Research Organization (Non-Patent Document 1).

  Further, the present inventor has proposed an improved immersion cooling apparatus capable of significantly increasing the mounting density in immersion cooled electronic devices (Non-Patent Document 2, Non-Patent Document 3).

"Immersion cooling small super computer" ExaScaler-1 measures the value equivalent to the world's top of the latest supercomputer power consumption performance ranking "Green 500" by performance improvement over 25%, March 31, 2015, Press Release, ExaScaler Co., Ltd., URL: http://www.exascaler.co.jp/wp-content/uploads/2015/03/20150331.pdf "To achieve high-performance Exa-class machines, semiconductor, cooling, and connection reform (upper), Nikkei Electronics July 2015 issue, pp. 99-105, June 20, 2015, published by Nikkei BP "Super computer" Shoubu "wins 3rd consecutive world No. 1 ranking in the energy saving ranking Green 500 of the supercomputer-" Satsuki "also wins 2nd place The supercomputer installed at RIKEN occupies the first and second place- ", June 20, 2016, press release, ExaScaler, Inc., etc., URL: http://www.exascaler.co.jp/wp-content/uploads/2016/06/20160620_1.pdf

  An electronic device applied to the immersion cooling device normally reduces the high voltage input supplied from the external power supply to a low voltage output used in a processor of the electronic device, a storage device, or a device such as a network card. It has a unit. The power supply unit is connected to an external power supply via a power cable, and thus is placed at the top of the electronic device so that the connector plug of the power cable can be easily connected. However, for example, in an immersion cooling apparatus containing several tens of electronic devices, several tens of network cables and several tens of thick power cables are wired on top of these electronic devices, so the cable wiring is complicated. In addition, there is a problem that the efficiency of the maintenance of the electronic device is hampered. Also, depending on the configuration of the electronic device, the volume, length, and weight of the power supply unit may occupy 1/4 to 1/3 of the volume, length, and weight of the entire electronic device. For this reason, in order to store a long electronic device, it was necessary to design the height of the cooling tank (hereinafter sometimes referred to as “immersion tank”) to be high (the depth is deep). Furthermore, since a relatively heavy power supply unit is placed at the top of the electronic device, the center of gravity of the electronic device and thus the center of gravity of the entire immersion cooling device may be high, and may be unstable against large vibrations such as a large earthquake. there were.

  Therefore, in the electronic device applied to the immersion cooling device, it is desirable to develop a new configuration electronic device that does not require the wiring of the power cable on the upper side of the electronic device and a power supply unit having a new configuration compatible with the electronic device. It is rare.

  On the other hand, in recent years, there has been proposed a system (hereinafter sometimes referred to as "HVCD system") for supplying a high voltage direct current (hereinafter referred to as "HVDC") of DC 380 V to electronic devices such as servers installed in data centers. The main advantage of the HVDC system is the significant reduction of power loss. For example, when converting 380 V DC supplied from an external power source to 48 V DC and supplying it to an electronic device, the power loss generated by the electronic device is In theory, it can be reduced to 1/16 compared to the power loss when supplying 12 VDC. Since the power loss generated in the electronic device is released as heat, the reduction of the power loss is effective to improve the cooling efficiency of the immersion cooling system. Therefore, it is desirable to develop a new power supply unit for adapting the immersion cooling electronics to the HVDC system.

In order to solve the above problems, according to one aspect of the present invention, an electronic device immersed in a cooling liquid in a cooling device and directly cooled is:
A carrier substrate comprising a voltage input end for supplying a DC voltage for the electronic device, wherein the voltage input end is electrically connected to a voltage output end of a power supply unit;
A supporting member configured to support the substrate so as to be located at the top of the power supply unit installed at the bottom of a cooling bath provided in the cooling device when the electronic device is electrically connected to the power supply unit;
including.

  In a preferred embodiment of the electronic device according to one aspect of the present invention, the support member may include a backboard or a frame structure in which the carrier substrate is fixed to one surface.

  Further, in a preferred embodiment of the electronic device according to one aspect of the present invention, the backboard or frame structure is slidably supported by a plurality of support columns which are vertically stood and fixed in the cooling tank. It is good.

  In a preferred embodiment of the electronic device according to one aspect of the present invention, the backboard or frame structure may include a support pin or a guide pin inserted from above into a bracket fixed in the cooling tank.

According to another aspect of the present invention, the power supply unit immersed in the cooling fluid in the cooling device and directly cooled is:
A unit substrate comprising a voltage input end for supplying an external power supply voltage and a voltage output end, the voltage output end electrically connected to a voltage input end of an electronic device;
A step-down device mounted on the unit substrate;
Including
The power supply unit is installed at a bottom portion of a cooling bath provided in the cooling device such that the electronic device is positioned above the power supply unit when the electronic device is electrically connected to the power supply unit. It is cooled by the coolant flowing from the bottom or from the other part of the cooling tank.

  In a preferred embodiment of the power supply unit according to the other aspect of the present invention, the unit substrate forms a flow channel for passing the cooling fluid between one surface of the unit substrate and the bottom portion. And may be located away from the bottom.

  Also, in a preferred embodiment of the power supply unit according to the other aspect of the present invention, the unit substrate may have a flow channel for passing the cooling liquid in the unit substrate.

  In a preferred embodiment of a power supply unit according to another aspect of the present invention, the step-down device may include a converter module that steps down an external high voltage DC voltage of 200V-420V to a DC voltage of 24V-52V.

  In a preferred embodiment of the power supply unit according to another aspect of the present invention, the step-down device performs AC-DC conversion and step-down of 100V-250V single-phase or three-phase external high voltage AC voltage into 24V-52V DC voltage. It is good to include a converter module.

  In a preferred embodiment of the power supply unit according to the other aspect of the present invention, the step-down device is any one or more of a power factor correction circuit, a noise filter, an additional rectifier, and a surge circuit. It is better to include peripheral circuits.

  In a preferred embodiment of the power supply unit according to the other aspect of the present invention, when it is detected that the voltage output end is coupled to the voltage input end of the electronic device, supply of voltage to the electronic device is started. The controller may further include a first controller.

  In a preferred embodiment of the power supply unit according to the other aspect of the present invention, control is provided in the upper part of the liquid surface of the cooling liquid of the cooling tank, the wall surface structure of the cooling tank, or the vicinity of the cooling tank. It is preferable to further include a second controller that detects ON / OFF of a switch operable from the panel to switch on / off the supply of voltage to the electronic device.

Further, according to still another aspect of the present invention, an electronic device which is immersed in a cooling liquid in a cooling device and is directly cooled is:
A carrier substrate comprising a voltage input end for supplying a DC voltage for the electronic device, wherein the voltage input end is electrically connected to a voltage output end of a power supply unit;
A plurality of module connectors disposed on one side of the carrier substrate;
A plurality of module boards, each of the plurality of module boards having a module connector plug electrically coupled to each of the plurality of module connectors;
A plurality of support plates attached at predetermined intervals in the longitudinal direction of the carrier substrate, the adjacent support plates holding both ends of the plurality of module substrates;
A supporting member configured to support the carrier substrate so as to be located at the top of the power supply unit installed at the bottom of a cooling bath provided in the cooling device when the electronic device is electrically connected to the power supply unit;
including.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, the support member may include a backboard or a frame structure in which the carrier substrate is fixed to one surface.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, the backboard or frame structure is slidably supported by a plurality of support columns vertically fixed in the cooling tank. It is good.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, the backboard or frame structure includes a support pin or a guide pin inserted from above to a bracket fixed in the cooling tank. Good.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, the backboard or frame structure is composed of an outer frame portion and a beam portion which traverses the inside of the outer frame portion in the width direction, A plurality of support plates may be attached to the outer frame portion and the beam portion.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, a plurality of grooves are formed in each of the support plates, and an end of the plurality of module substrates is formed in each of the plurality of grooves. Each should be inserted.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, each of the plurality of module substrates is a module substrate on which a processor and a memory are mounted, a module substrate on which a programmable logic device is mounted, and network communication A module board having an adapter card function, a module board having a storage device, or a combination of two or more of the processor and memory, the programmable logic device, the adapter card function for the network communication, or the storage device Preferably, it is a composite module substrate mounted.

A power supply unit according to still another aspect of the present invention is a power supply unit which is immersed in a cooling liquid in a cooling device and directly cooled,
A unit substrate including a power supply voltage input terminal for supplying an external power supply voltage and a voltage output terminal, the voltage output terminal electrically connected to a voltage input terminal of the electronic device;
A step-down device mounted on the unit substrate;
A stage to which the unit substrate is fixed;
Including
The power supply unit is installed at a bottom portion of a cooling bath provided in the cooling device such that the electronic device is positioned above the power supply unit when the electronic device is electrically connected to the power supply unit.
The stage holds the unit substrate so as to form a flow channel between one surface of the unit substrate and the bottom through which the cooling fluid flowing from the bottom passes.

  In a preferred embodiment of a power supply unit according to a further aspect of the present invention, a plurality of spacers for forming the flow channel may be attached to the stage.

  In a preferred embodiment of the power supply unit according to still another aspect of the present invention, the stage includes a flat plate placed on the bottom, and the flat is formed with a hole for passing the cooling fluid flowing from the bottom. Good to have.

  In a preferred embodiment of a power supply unit according to still another aspect of the present invention, the stage is provided with a plurality of support columns vertically standing in the cooling tank, and the plurality of support columns are the electronic The backboard or frame structure of the device may be slidably supported.

  In a preferred embodiment of a power supply unit according to still another aspect of the present invention, the upper end or the side surface of the plurality of support columns further includes a switch for switching the start / disconnection of the supply of voltage to the electronic device. Good.

  In a preferred embodiment of a power supply unit according to still another aspect of the present invention, the step-down device may include a converter module that steps down an external high voltage DC voltage of 200V-420V to a DC voltage of 24V-52V. .

  In a preferred embodiment of a power supply unit according to still another aspect of the present invention, the step-down device performs AC-DC conversion of 100V-250V single-phase or three-phase external high voltage AC voltage into 24V-52V DC voltage and The converter module may be included to step down.

  In a preferred embodiment of a power supply unit according to still another aspect of the present invention, the step-down device is any one or more of a power factor correction circuit, a noise filter, an additional rectifier, and a surge circuit. Preferably include peripheral circuits of

  In a preferred embodiment of a power supply unit according to still another aspect of the present invention, when it is detected that the voltage output end is coupled to the voltage input end of the electronic device, supply of voltage to the electronic device is performed. It may further include a first controller to start.

  In a preferred embodiment of the power supply unit according to still another aspect of the present invention, the power supply unit is installed in the upper part of the liquid surface of the cooling liquid in the cooling tank, the wall surface structure of the cooling tank, or the vicinity of the cooling tank. The electronic device may further include a second controller that detects ON / OFF of a switch operable from the control panel and switches on / off of supply of voltage to the electronic device.

A cooling system according to still another aspect of the present invention is
A cooling device,
A plurality of electronic devices which are immersed in the cooling fluid in the cooling device and are directly cooled;
A plurality of power supply units which are immersed and cooled directly in the cooling fluid in the cooling device;
Including
The cooling device has a cooling tank having an open space formed by a bottom wall and a side wall, and a plurality of inflow openings into which the cooling fluid flows are formed at the bottom of the cooling tank, and the cooling tank is circulated. An outflow opening is formed in the vicinity of the liquid surface of the cooling fluid to be
Each of the plurality of electronic devices includes a voltage input terminal for supplying a DC voltage for the electronic device,
Each of the plurality of power supply units includes a power supply voltage input end for supplying an external power supply voltage, and a voltage output end electrically connected to a voltage input end of the electronic device,
Each of the power supply units is installed at the bottom of the cooling bath such that the electronic devices are positioned on top of the power supply units when each of the electronic devices is electrically connected to each of the power supply units. The power supply unit and the electronic device are cooled by a coolant flowing from the bottom.

  In a preferred embodiment of a cooling system according to still another aspect of the present invention, each of the electronic devices may have a carrier substrate provided with the voltage input terminal and a support member for supporting the carrier substrate.

  In a preferred embodiment of a cooling system according to still another aspect of the present invention, the support member may include a backboard or a frame structure on which the carrier substrate is fixed on one side.

  In a preferred embodiment of a cooling system according to still another aspect of the present invention, the power supply unit comprises: a unit substrate comprising the power supply voltage input end and the power supply output end; and a step-down device mounted on the unit substrate. And a stage to which the unit substrate is fixed, wherein the stage forms a flow channel between one surface of the unit substrate and the bottom through which the cooling fluid flowing from the bottom passes. It is preferable to hold a unit substrate.

  In a preferred embodiment of a cooling system according to still another aspect of the present invention, a plurality of spacers for forming the flow channel may be attached to the stage.

  In a preferred embodiment of a cooling system according to still another aspect of the present invention, the stage includes a flat plate placed on the bottom, and the flat is formed with a hole for passing the cooling fluid flowing from the bottom. Good to have.

  In a preferred embodiment of a cooling system according to still another aspect of the present invention, the stage is provided with a plurality of support columns vertically standing in the cooling tank, and the plurality of support columns are the electronic The backboard or frame structure of the device may be slidably supported.

  According to the present invention, since the power supply unit is eliminated from the electronic device, the wiring of the power supply cable on the upper side of the electronic device is unnecessary, the cable wiring can be simplified, and the maintainability of the electronic device can be improved. it can. Since the combined length of the electronic device according to the present invention and the power supply unit can be shortened, the height of the cooling tank can be designed low. Furthermore, since a relatively heavy power supply unit is placed at the bottom of the cooling tank, the center of gravity of the entire immersion cooling apparatus can be lowered and vibration resistance can be improved.

  Furthermore, when the power supply unit is adapted to the HVDC system, the power loss generated in the electronic device is reduced and the heat generated in the electronic device is reduced, and the cooled coolant flowing from the bottom of the cooling tank is Since heat is quickly taken from the power supply unit placed at the bottom of the cooling tank, the efficiency of cooling the electronic device and the power supply unit can be further improved.

  The cooling tank having the “open space” in the present specification also includes a cooling tank having a simple sealed structure that does not impair the maintainability of the electronic device. For example, the structure in which the top plate for closing the open space of the cooling tank can be placed at the opening of the cooling tank, or the structure in which the top plate can be detachably attached via packing etc. is a simple sealing structure. It can be said.

  The objects and advantages of the present invention described above, as well as other objects and advantages, will be more clearly understood through the following description of the embodiments. However, the embodiment described below is an exemplification, and the present invention is not limited to this.

It is a perspective view of the electronic device concerning one embodiment of the present invention. It is a side view of electronic equipment concerning one embodiment of the present invention. It is a front view of the electronic device concerning one embodiment of the present invention. FIG. 7 is a partial assembly view of the electronic device according to an embodiment of the present invention, and is an assembly view of a backboard or frame structure, a carrier substrate, and a support plate. It is a perspective view which shows an example of the unit board | substrate in the power supply unit which concerns on one Embodiment of this invention. It is a perspective view which shows an example of the stage in the power supply unit which concerns on one Embodiment of this invention. It is a perspective view which shows the state which attached the unit board | substrate on the stage. It is a perspective view of a cooling tank with which a cooling device is provided in a cooling system concerning one embodiment of the present invention. It is a top view of a cooling tank with which a cooling device is provided in a cooling system concerning one embodiment of the present invention. It is a partial cross section figure of the cooling device in the cooling system concerning one embodiment of the present invention. It is a top view which shows the example which arranges and installs four stages in which the unit board | substrate was attached in the bottom part of a cooling tank. It is a cross-sectional perspective view which shows the principal part structure of a liquid immersion cooling device.

Hereinafter, preferred embodiments of an electronic device, a power supply unit, and a cooling system according to the present invention will be described in detail based on the drawings.
First, an electronic device 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG. 1 is a perspective view of an electronic device 100 according to an embodiment of the present invention, FIG. 2 is a side view, FIG. 3 is a front view, and FIG. 4 is a partial assembly view. The electronic device 100 is an electronic device which is immersed in a cooling liquid in a cooling device described later to be directly cooled. The electronic device 100 includes a backboard or frame structure 110 (hereinafter simply referred to as “backboard 110”), a plurality of module substrates 120, a carrier substrate 121, and a plurality of support plates 115, 117. As illustrated, the power supply unit is eliminated from the electronic device 100. The power supply unit is installed at the bottom of the cooling tank provided in the cooling device, as described later.

  The backboard 110 constitutes a support member for supporting the carrier substrate 121. The backboard 110 is comprised from the outer frame part 110b and the beam part 110c which traverses the inside of the outer frame part 110b in the width direction, as shown in FIG. In the upper part of the outer frame 110b, a hanging bracket hole 111 for passing a hanging tool is formed when the electronic device 100 is put in or taken out of the cooling tank. The backboard 110 also includes a pair of support pins or guide pins 113 (hereinafter simply referred to as "support pins 113") extending downward from the lower portion of the outer frame portion 110b. The plurality of support plates 115 and 117 are attached to the outer frame portion 110 b and the beam portion 110 c through fasteners such as screws passing through the carrier substrate 121. Accordingly, the carrier substrate 121 is fixed to one surface of the backboard 110, and the plurality of support plates 115 and 117 are attached at predetermined intervals in the longitudinal direction of the carrier substrate 121. A plurality of grooves are formed in each of the support plates 115 and 117, and each of the ends of the plurality of module substrates 120 is inserted into each of the plurality of grooves. In this manner, the adjacent support plates 115 and 117 hold both ends of the plurality of module substrates 120.

  At the lower part of the carrier substrate 121, a DC voltage input connector 131 for supplying a DC voltage for electronic devices is provided. The DC voltage input connector 131 corresponds to a voltage input terminal provided in the carrier substrate 121. A plurality of module connectors 128 are disposed on one surface of the carrier substrate 121. Each of the plurality of module substrates 120 has a module connector plug 129 electrically coupled to each of the plurality of module connectors. Therefore, the module substrate 120 can be inserted into the carrier substrate 121 and extracted from the carrier substrate 121. In the illustrated example, two network cards 123 are attached to the carrier substrate 121. Further, although 32 module substrates 120 are attached to the carrier substrate 121, the number of module substrates 120 is arbitrary and is not particularly limited. The type of module substrate 120 is a module substrate mounted with a processor and a memory in the illustrated example (however, FIGS. 1-4 illustrate only the processor 124 and the main memory socket 127 to which the heat sink is thermally connected), Module board with programmable logic device, module board with adapter card function for network communication, module board with storage device, or processor and memory, programmable logic device, adapter card function for network communication or storage device It may be a composite module substrate mounted by combining two or more of them, and is not particularly limited. For example, the processor may use a semiconductor device of system-on-chip design (as an example, Intel Xeon processor D product family made by Intel Corporation), and an ultra-low-profile memory module (as an example, general-purpose 32 GB) as a main memory. DDR4 (Double-Data-Rate 4) VLP DIMM (very low profile Dual Inline Memory Module) may be used, and Programmable Logic Device may use Field-Programmable Gate Array (FPGA) Furthermore, network communication A device compliant with Ethernet or InfiniBand may be used as an adapter card function for the device, and flash storage such as M.2 SSD (Solid State Drive) or mSATA SSD may be used as a storage device.

  Referring to FIGS. 2 and 4, on the surface opposite to the one surface of backboard 110, a plurality of sliders 112 is provided via slider holding portion 114 along the longitudinal direction of outer frame portion 110 b of backboard 110. Is attached. A pair of sliders 112 attached to both the left and right of the outer frame portion 110b are engaged with rail grooves provided in adjacent supporting posts vertically erected and fixed in a cooling tank described later. The backboard 110 is slidably (vertically raised and lowered) supported.

  When the electronic device 100 configured as described above slides the backboard 110 with respect to the plurality of support columns and is immersed in the cooling liquid in the cooling device to be directly cooled, the electronic device 100 flows in the electronic device. The cooling fluid is provided from the lower side to the upper side of the electronic device 100, the hole 117a provided in the support plate 117 → the space between the adjacent module substrates 120 → the hole 117a → the space between the adjacent module substrates 120 → the hole 117a → adjacent Since the heat is quickly and efficiently taken away from the module substrate 120 and the carrier substrate 121 through the space between the matching module substrates 120 → the holes 115a provided in the support plate 115 in order, the electronic device is mounted even if it is mounted at high density Stable operation of 100 can be secured. Also, each module substrate 120 can be attached to the carrier substrate 121 and removed from the carrier substrate 121 in addition. As a result, adjustment, inspection, repair, replacement, expansion, and the like can be performed for each module substrate 120, so that the maintainability is significantly improved.

  Next, a power supply unit 20 according to an embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a perspective view showing an example of a unit substrate 21 in the power supply unit 20 according to an embodiment of the present invention, and FIG. 6 is a perspective view showing an example of the stage 22 in the power supply unit 20 according to an embodiment of the present invention. FIG. 7 is a perspective view showing the unit substrate 21 mounted on the stage 22. As shown in FIG.

  As described above, the power supply unit 20 is a component not included in the electronic device 100, and is installed at the bottom of the cooling tank provided in the cooling device. The power supply unit 20 includes a unit substrate 21 and a step-down device 215 mounted on the unit substrate 21. Unit substrate 21 outputs, as shown in FIG. 5, a power supply voltage input connector 212 for supplying an external power supply voltage from an external power supply (not shown) via a power supply cable 211, and a DC voltage stepped down by step-down device 215. And a DC voltage output connector 213. The power supply voltage input connector 212 corresponds to the voltage input end of the unit substrate 21, and the DC voltage output connector 213 corresponds to the voltage output end. The step-down device 215 is, for example, a converter module that steps down an external high voltage DC voltage of 200 V to 420 V to a DC voltage of 24 V to 52 V, or a single phase or three phase external high voltage AC of 100 V to 250 V, 24 V to 52 V It is preferable to include a converter module that performs AC-DC conversion and step-down to DC voltage. The former converter module may more specifically be capable of stepping down DC380V to DC48V, and the latter converter module may be capable of AC-DC conversion and bucking 200VAC to 48V DC. If necessary, the step-down device 215 may include any one or more peripheral circuits of a power factor correction circuit, a noise filter, an additional rectifier, and a surge circuit. A heat sink 216 for heat dissipation may be thermally connected to the surface of the step-down device 215. Further, the unit substrate 21 may include a plurality of input fuses 217 for protection at the time of failure. The unit substrate 21 is fixed to the stage 22 via a plurality of spacers 218 as shown in FIGS. 5 and 7. Thereby, the unit substrate 21 is disposed apart from the bottom so as to form a flow channel 219 for passing the cooling liquid between one surface of the unit substrate 21 and the bottom of the cooling tank described later. The unit substrate 21 may be configured to have a flow channel for passing the coolant. For example, the unit substrate 21 may be formed in a hierarchical structure or a hollow structure having an intermediate space, and a coolant may be passed through the inside of the structure.

  The stage 22 includes, as shown in FIG. 6, a flat plate placed at the bottom of a cooling tank described later. A plurality of holes 23 for passing the cooling fluid flowing from the bottom are formed at intervals in the longitudinal direction, near the center in the width direction of the flat plate. In addition, a plurality of notches 24 are formed at intervals in the longitudinal direction at the width direction end of the flat plate. The adjacent notches 24 have a length and a width necessary to form substantially the same holes as the holes 23 when the plurality of stages 22 are arranged side by side. A plurality of support posts 25 are vertically mounted on the stage 22 using L-shaped brackets 26. Therefore, when the stage 22 is installed at the bottom of the cooling tank, the plurality of support columns 25 stand vertically in the cooling tank. Also, a plurality of brackets 27 are fixed on the stage 22. The support pin insertion hole 28 is formed in the bracket 27.

  A rail groove 251 is formed in each of the plurality of support posts 25. The backboard 110 is supported slidably (vertically raised and lowered) by engaging a pair of sliders 112 of the backboard 110 of the electronic device 100 with the rail grooves 251 provided in the adjacent support columns. .

  With respect to the power supply unit 20 configured as described above, the electronic device 100 can slide the backboard 110 relative to the plurality of support columns 25 to raise or lower it. When the electronic device 100 is lowered, a pair of support pins 113 extending downward from the lower part of the outer frame portion 110 b of the backboard 110 of the electronic device 100 is a support pin of the pair of brackets 27 fixed to the power supply unit 20. It is inserted into the insertion hole 28, and accurate alignment between the DC voltage output connector 213 of the power supply unit 20 and the DC voltage input connector 131 of the electronic device 100 is performed. When the electronic device 100 is further lowered, the DC voltage output connector 213 and the DC voltage input connector 131 are electrically connected. At this time, the pair of support columns 25 and the pair of brackets 27 support the weight of the electronic device 100 of one unit.

  The power supply unit 20 may further include a first controller that starts supply of the DC voltage to the electronic device 100 when detecting a state in which the DC voltage output connector 213 is coupled to the DC voltage input connector 131 of the electronic device 100. . The first controller may be mounted on the unit substrate 21 as an additional circuit or an electronic mechanism. As a result, the plug-in operation of the electronic device 100 can be performed immediately after the electronic device 100 is lowered into the cooling tank and coupled with the power supply unit 20 so that the current can be immediately energized.

  Further, the power supply unit 20 detects ON / OFF of an operable switch from the upper part of the liquid surface of the cooling liquid of the cooling tank, the wall surface structure part of the cooling tank, or the control panel installed in the vicinity of the cooling tank. The electronic device 100 may further include a second controller that switches on / off the supply of voltage. As a result, the operator can manually switch ON / OFF of each electronic device 100, so that the maintainability can be improved. The second controller may also be mounted on the unit substrate 21 as an additional circuit or an electronic mechanism.

  A switch for sending to the second controller a signal for switching on / off the supply of voltage to the electronic device 100 may be provided on the upper end or the side of each of the plurality of support posts 25.

  Next, a preferred embodiment of the immersion cooling apparatus for immersing the electronic device 100 and the power supply unit 20 according to one embodiment of the present invention and the power supply unit 20 directly in the cooling liquid and cooling them directly will be described based on the drawings. explain. In the description of the present embodiment, a configuration of a high-density immersion cooling apparatus will be described, in which the electronic device 100 and the power supply unit 20 are respectively accommodated in a total of 24 units and in 6 × 4 sections of the cooling tank and cooled. This is an example, the number of units of the electronic device in the high-density immersion cooling apparatus is arbitrary, and the configuration of the electronic device usable in the present invention is not limited at all.

  With reference to FIGS. 8 to 12, the immersion cooling apparatus 1 according to one embodiment has a cooling tank 10, and an open space 10 a is formed by the bottom wall 11 and the side wall 12 of the cooling tank 10. In the bottom wall (bottom) 11, a plurality of inflow openings 150 into which the coolant flows are formed in a 9 × 3 pattern. Further, on the side wall 12, a power cable inlet 12a, a network cable inlet 12b, and an outflow opening 170 formed in the vicinity of the liquid surface of the coolant are formed.

  The immersion cooling device 1 has a top plate 10 b for closing the open space 10 a of the cooling tank 10. During maintenance work of the immersion cooling device 1, the top plate 10b is removed from the opening to open the open space 10a, and when the immersion cooling device 1 is operated, the top plate 10b is placed at the opening of the cooling tank 10 The space 10a can be closed.

  The cooling tank 10 is filled with a sufficient amount of cooling liquid to immerse the entire electronic device 100 up to the liquid level (see FIG. 10). As a coolant, the trade name "Fluorinert (trademark of 3M, hereinafter the same) FC-72" (boiling point 56 ° C), "Florinert FC-770" (boiling point 95 ° C), "Florinert FC-3283" (trade name of 3M company) A fluorinated inert liquid consisting of a fully fluorinated compound (perfluorocarbon compound) known as boiling point 128 ° C.), “Fluorinert FC-40” (boiling point 155 ° C.), and “Fluorinert FC-43” (boiling point 174 ° C.) Although it can be used, it is not limited to these. In addition, since Fluorinert FC-40 and FC-43 have a boiling point higher than 150 ° C. and are extremely difficult to evaporate, when any of them is used as a cooling liquid, the height of the liquid surface in the cooling tank 10 is long-term It is advantageous to keep it across.

  Below the bottom wall 11 of the cooling tank 10, a plurality of inflow headers 16 having an inlet 15 for the coolant at one end are provided. Further, on the outer side of the side wall 12 of the cooling tank 10, a receiving portion 17 having an outlet 18 for the coolant is provided. The receiving part 17 covers the outlet opening 170 and receives the coolant flowing out from the outlet opening 170 without leaking.

  Referring to FIG. 11, four flat plate stages 22 are arranged side by side on the bottom wall 11 of the cooling tank 10. Each of the plurality of holes 23 formed in the stage 22 and the substantially same holes as the holes 23 formed by combining the adjacent notches 24 with each of the plurality of inflow openings 150 formed in the bottom wall 11 Match Therefore, the coolant flowing from the inflow opening 150 is not blocked by the power supply unit 20. In addition, since a flow channel through which the coolant passes is secured between the unit substrate 21 of the power supply unit 20 and the stage 22 (bottom wall 11), the coolant quickly and efficiently heats heat from both sides of the unit substrate 21. Take away. Therefore, the cooling efficiency of the power supply unit 20 is excellent. Furthermore, since the unit substrate 21 of the power supply unit 20 can be placed parallel to the bottom wall 11 of the cooling tank 10, the height of the power supply unit 20 in the height (depth) direction of the cooling tank 10 is It can be kept low compared to it. Therefore, since the combined length of the electronic device 100 and the power supply unit 20 can be shortened, the height of the cooling tank 10 can be designed low (the depth is made shallow).

  In addition, the coolant flowing from the inflow opening 150 is provided from the lower side to the upper side of the electronic device 100 in the hole 117 a provided in the support plate 117 → space between adjacent module substrates 120 → hole 117 a → adjacent module substrate 120 Spaces → holes 117a → spaces between adjacent module substrates 120 → holes 115a provided in the support plate 115 in this order to quickly and efficiently take heat away from the module substrate 120 and the carrier substrate 121. The coolant thus warmed passes through the outlet opening 170, the receiver 17 and the outlet 18. The outlet 18 is connected to a pipe (not shown) leading to the inlet 15 through a heat exchanger (not shown), in which the coolant is cooled and the cooled coolant is received at the inlet 15. Supplied to

  In the immersion cooling device 1 according to an embodiment of the present invention, all of the plurality of power supply units 20 are fixed on the plurality of stages 22, so six electronic devices on one stage 22 After the stage 100 is taken out of the cooling tank 10 and the stage 22 is lifted and taken out of the cooling tank 10, adjustment, inspection, repair, replacement, expansion and the like of the power supply unit 20 can be performed. A power cable 211 connected to each of the power units 20 can pass through a space between the lower portion of the electronic device 100 and the stage 22. Therefore, the wiring of the power supply cable 211 may be a wiring which is introduced from the power supply cable inlet 12a, is made along the side wall 12, passes through the bottom of the cooling tank 10, and reaches the power supply voltage input connector 212 of the unit substrate 21; Wiring at the top of the device 100 is unnecessary. Therefore, cable wiring can be simplified, and the maintainability of the electronic device can be improved.

  The present invention can be widely applied to ultra-high density mounted immersion cooling electronic devices.

DESCRIPTION OF SYMBOLS 1 Immersion cooling device 10 Cooling tank 10a Open space 10b Top plate 11 Bottom wall 12 Side wall 12a Power supply cable inlet 12b Network cable inlet 100 Electronic equipment 110 Backboard or frame structure 110a Hole 110b Outer frame 110c Beam 111 Suspension bracket Hole 112 Slider 113 Support pin or guide pin 114 Slider holder 115, 117 Support plate 115a, 117a Hole 120 Module board 121 Carrier board 123 Network card 124 Processor 127 Main memory socket 128 Module connector 129 Module connector plug 131 DC voltage input connector 15 Inlet 150 Inflow opening 16 Inflow header 17 Receiving portion 170 Outflow opening 18 Exit 20 Power supply unit 21 Unit board 211 Power supply Buru 212 supply voltage input connector 213 DC voltage output connector 215 buck device (converter module)
216 heat sink 217 input fuse 218 spacer 219 flow channel 22 stage 23 hole 24 notch 25 support column 251 rail groove 26 L type bracket 27 bracket 28 support pin insertion hole

Claims (4)

An electronic device which is immersed in a cooling liquid in a cooling device and is directly cooled,
A carrier substrate comprising a voltage input end for supplying a DC voltage for the electronic device, wherein the voltage input end is electrically connected to a voltage output end of a power supply unit;
A supporting member configured to support the carrier substrate so as to be located at the top of the power supply unit installed at the bottom of a cooling bath provided in the cooling device when the electronic device is electrically connected to the power supply unit;
Including electronic equipment.   The electronic device according to claim 1, wherein the support member includes a backboard or a frame structure in which the carrier substrate is fixed to one surface.   The electronic device according to claim 2, wherein the backboard or the frame structure is slidably supported by a plurality of support columns vertically fixed in the cooling tank.   The electronic device according to claim 3, wherein the backboard or frame structure includes a support pin or a guide pin inserted from above to a bracket fixed in the cooling tank.

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