JPWO2017094498A1 - Light emitting system - Google Patents

Abstract

  The light emitting part is disposed on any surface of the substrate (100), and has a light-transmitting first electrode, an organic layer (light emitting layer), and a second electrode in this order from the space side. The insulating film defines a plurality of light emitting portions. And a translucent area | region is provided between two adjacent light emission parts among the board | substrates (100). The translucent region is a region where the insulating film and the second electrode are not formed. The light extraction side surface of the light emitting device (10) (the first surface (100a) of the substrate (100)) is connected to the second surface (24) which is the outer surface of the partition member (20) via the adhesive layer (200). It is fixed.

Description

  The present invention relates to a light emitting system.

  In recent years, development of light-emitting devices using organic EL has progressed. This light-emitting device is used as a lighting device or a display device, and has a configuration in which an organic layer is sandwiched between a first electrode and a second electrode. In general, a transparent material is used for the first electrode, and a metal material is used for the second electrode.

  One of the light emitting devices using organic EL is a technique described in Patent Document 1. In the technique of Patent Document 1, the second electrode is provided only in a part of the pixel so that the display device using the organic EL has light transmittance (see-through). In such a structure, since the region positioned between the plurality of second electrodes transmits light, the display device can have light transmittance. In the technique described in Patent Document 1, a light-transmitting insulating film is formed between the plurality of second electrodes in order to define pixels. Patent Document 1 exemplifies inorganic materials such as silicon oxide and resin materials such as acrylic resin as the material of the insulating film.

JP 2011-23336 A

  At least a part of the partition member that partitions the space from the outside may be formed of a transparent member in order to make the space easy to visually recognize. On the other hand, in order to make the space easily visible, it is preferable to irradiate the space with light. Here, due to layout restrictions, a light emitting device serving as a light source for illumination may have to be disposed on a transparent member. In such a case, there is a possibility that the space cannot be visually recognized by the light emitting device.

  As an example of the problem to be solved by the present invention, it is possible to irradiate light on the space inside the partition member and to make the space easily visible from the outside.

The invention according to claim 1 is a partition member in which at least a part of partitioning the first space and the second space is translucent,
A translucent substrate overlapping the partition member;
A light emitting part and a light transmitting part disposed on the substrate;
With
The light emission intensity of the light emitting unit is greater in the first space than in the second space,
The first space is a light emitting system that is smaller than the second space.

The invention according to claim 5 is a partition member in which at least part of partitioning the first space and the second space is translucent,
A light emitting part and a light transmitting part arranged in the partition member;
With
The light emission intensity of the light emitting unit is greater in the first space than in the second space,
The first space is a light emitting system that is smaller than the second space.

  The above-described object and other objects, features, and advantages will become more apparent from the preferred embodiments described below and the accompanying drawings.

It is sectional drawing which shows the structure of the light-emitting system which concerns on embodiment. It is sectional drawing which shows the structure of a light-emitting device. It is the figure which expanded the light emission part of the light-emitting device. It is a top view of a light-emitting device. 1 is a cross-sectional view illustrating a configuration of a light emitting device according to Example 1. FIG. 6 is a cross-sectional view illustrating a configuration of a light emitting device according to Example 2. FIG. 6 is a cross-sectional view illustrating a configuration of a light emitting device according to Example 3. FIG. 6 is a cross-sectional view illustrating a configuration of a light emitting device according to Example 4. FIG. Each figure is an example of an enlarged view of a region surrounded by a dotted line α in FIG. FIG. 10 is a cross-sectional view illustrating a configuration of a light emitting device according to Example 5. It is a top view of the light-emitting device shown in FIG. It is a top view which shows the modification of FIG. FIG. 10 is a plan view showing a configuration of a light emitting device according to Example 6. It is CC sectional drawing of FIG. FIG. 10 is a plan view of a light emitting device according to a first modification of the sixth embodiment. FIG. 10 is a plan view showing a configuration of a light emitting device according to Example 7. It is CC sectional drawing of FIG. FIG. 10 is a cross-sectional view illustrating a configuration of a light emitting device according to Modification 1 of Example 7. FIG. 12 is a cross-sectional view illustrating a configuration of a light emitting device according to Modification 2 of Example 7. 12 is a cross-sectional view illustrating a configuration of a light emitting device according to Modification 3 of Example 7. FIG. FIG. 10 is a cross-sectional view illustrating a configuration of a light emitting device according to Modification 4 of Example 7. FIG. 10 is a cross-sectional view illustrating a configuration of a light emitting device according to Modification 5 of Example 7. FIG. 10 is a plan view of a light emitting device according to Modification 6 of Example 7. It is CC sectional drawing of FIG. Each figure shows an example of the planar layout of the film. It is a figure which shows the modification of FIG. FIG. 10 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 8. 10 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 9. FIG. It is sectional drawing which shows the modification of FIG. It is sectional drawing which shows the structure of the light-emitting system which concerns on Example 10. FIG. It is sectional drawing which shows the structure of the light emission system which concerns on Example 11. FIG. It is sectional drawing which shows the structure of the light-emitting system based on Example 12. It is a figure which shows the light emission characteristic of the light-emitting device which concerns on an Example. It is a figure which shows the light emission characteristic of the light-emitting device which concerns on an Example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

(Embodiment)
FIG. 1 is a cross-sectional view illustrating a configuration of a light emitting system according to an embodiment. The light emitting system includes a light emitting device 10 and a partition member 20. At least a part of the partition member 20 has translucency, and a space (first space) where a feature (for example, an article) is accommodated or a person stays is partitioned from the outside (second space). The first space is a space smaller than the second space. The partition member 20 is, for example, at least a part of a cup holder, but is not limited thereto. For example, the partition member 20 may be a window provided in a refrigerator, or may be a member that partitions a space and a space such as a partition or a basket. At least a portion of the partition member 20 that overlaps the light emitting device 10 or the substrate 100 or a second region 104 and a third region 106, which will be described later, is formed using, for example, glass or translucent resin.

  The light emitting device 10 includes a substrate 100, a plurality of light emitting portions 140 (described later using FIG. 2), and an insulating film 150 (described later using FIG. 2). The substrate 100 is disposed on the partition member 20. The light emitting unit 140 is disposed on any surface of the substrate 100, and has a light-transmitting first electrode 110, an organic layer 120 (light emitting layer), and a second electrode 130 in this order from the space side. Yes. The insulating film 150 defines a plurality of light emitting portions 140. A third region 106 (translucent region) is provided between two adjacent light emitting units 140 in the substrate 100. The third region 106 is a region where the insulating film 150 and the second electrode 130 are not formed.

  The light extraction side surface of the light emitting device 10 (for example, the first surface 100 a of the substrate 100) is fixed to the second surface 24 that is the outer surface of the partition member 20 via the adhesive layer 200. For this reason, the light emitted from the light emitting unit 140 of the light emitting device 10 is emitted to the inside of the partition member 20 via the partition member 20. On the other hand, as will be described later, the light emitting device 10 has optical transparency. For this reason, a person located outside the partition member 20 can visually recognize the inside of the partition member 20 through the partition member 20. The entire first surface 100a of the substrate 100 may be fixed to the second surface 24 of the partition member 20 via the adhesive layer 200, or a part of the first surface 100a (for example, two sides facing each other). May be fixed to the second surface 24 of the partition member 20.

  FIG. 2 is a cross-sectional view illustrating a configuration of the light emitting device 10. FIG. 3 is an enlarged view of the light emitting unit 140 of the light emitting device 10. The light emitting device 10 according to the embodiment is a lighting device or a display device. 2 and 3 show a case where the light emitting device 10 is a lighting device. The light emitting device 10 includes a substrate 100, a plurality of light emitting units 140, and an insulating film 150. The substrate 100 is made of a light transmissive material. The plurality of light emitting units 140 are separated from each other, and all include the first electrode 110, the organic layer 120, and the second electrode 130. The first electrode 110 is a light-transmitting electrode, and the second electrode 130 is a light-shielding or light-reflecting electrode. At least a part of the first electrode 110 and the second electrode 130 overlap. However, a part of the second electrode 130 may be a translucent electrode. The organic layer 120 is located between the first electrode 110 and the second electrode 130. The insulating film 150 covers the edge of the first electrode 110. Further, at least a part of the insulating film 150 is not covered with the second electrode 130.

  When viewed from the direction perpendicular to the substrate 100, the light emitting device 10 includes a first region 102, a second region 104, and a third region 106 (translucent region). The first region 102 is a region overlapping with the second electrode 130. That is, the first region 102 is a region covered with the second electrode 130 when viewed from a direction perpendicular to the substrate 100. When the second electrode 130 has a light shielding property, the first region 102 is a region that does not transmit light from the front surface to the back surface and from the back surface to the front surface of the light emitting device 10 or the substrate 100. The second region 104 is a region including the insulating film 150 among regions between the plurality of light emitting units 140. The third region 106 is a region that does not include the insulating film 150 among regions between the plurality of light emitting units 140. And since the width | variety of the 2nd area | region 104 is narrower than the width | variety of the 3rd area | region 106, the light-emitting device 10 has sufficient light transmittance. Details will be described below.

The substrate 100 is a light-transmitting substrate such as a glass substrate or a resin substrate. The substrate 100 may have flexibility. In the case of flexibility, the thickness of the substrate 100 is, for example, not less than 10 μm and not more than 1000 μm. Moreover, the area | region with which the board | substrate 100 of the partition member 20 among the board | substrates 100 may have a curved surface and an uneven surface instead of planar shape. The substrate 100 is, for example, a polygon such as a rectangle or a circle. When the substrate 100 is a resin substrate, the substrate 100 is formed using, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. When the substrate 100 is a resin substrate, an inorganic barrier film such as SiN _x or SiON is formed on at least one surface (preferably both surfaces) of the substrate 100 in order to prevent moisture from permeating the substrate 100. It is preferable. When the substrate 100 is formed of a resin substrate, a method of directly forming a first electrode 110 or an organic layer 120 described later on the resin substrate, and after forming the layers after the first electrode 110 on the glass substrate. There is a method in which the first electrode 110 and the glass substrate are peeled, and the peeled laminate is disposed on a resin substrate.

  A light emitting unit 140 is formed on one surface of the substrate 100. The light emitting unit 140 has a configuration in which a first electrode 110, an organic layer 120 including a light emitting layer, and a second electrode 130 are stacked in this order. When the light emitting device 10 is an illumination device, the plurality of light emitting units 140 extend in a line shape. On the other hand, when the light emitting device 10 is a display device, the plurality of light emitting units 140 are arranged so as to form a matrix, or form a segment or display a predetermined shape (for example, display an icon). It may be. The plurality of light emitting units 140 are formed for each pixel.

  The first electrode 110 is a transparent electrode having optical transparency. The material of the transparent electrode is a material containing a metal, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), or ZnO (Zinc Oxide). The thickness of the first electrode 110 is, for example, not less than 10 nm and not more than 500 nm. The first electrode 110 is formed using, for example, a sputtering method or a vapor deposition method. The first electrode 110 may be a carbon nanotube or a conductive organic material such as PEDOT / PSS. The first electrode 110 may have a stacked structure in which a plurality of films are stacked. In the drawing, a plurality of linear first electrodes 110 are formed on a substrate 100 in parallel with each other. For this reason, the first electrode 110 is not located in the second region 104 and the third region 106.

  The organic layer 120 has a light emitting layer. The organic layer 120 has a configuration in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. In addition, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer 120 may be formed by a vapor deposition method. In addition, at least one layer of the organic layer 120, for example, a layer in contact with the first electrode 110, may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer 120 are formed by vapor deposition. Moreover, all the layers of the organic layer 120 may be formed using the apply | coating method. In addition, you may have another light emitting layer (for example, inorganic light emitting layer) instead of the organic layer 120. FIG. Further, the emission color of the light emitting layer (or the color of light emitted from the organic layer 120) is different from the emission color of the light emitting layer of the adjacent light emitting unit 140 (or the color of light emitted from the organic layer 120). May be the same or the same.

  The second electrode 130 is made of, for example, a metal selected from the first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of a metal selected from the first group. Contains a metal layer. In this case, the second electrode 130 has a light shielding property or a light reflecting property. The thickness of the second electrode 130 is, for example, not less than 10 nm and not more than 500 nm. However, the second electrode 130 may be formed using the material exemplified as the material of the first electrode 110. The second electrode 130 is formed using, for example, a sputtering method or a vapor deposition method. In the example shown in this drawing, the light emitting device 10 has a plurality of linear second electrodes 130. The second electrode 130 is provided for each of the first electrodes 110 and is wider than the first electrode 110. Therefore, when viewed from a direction perpendicular to the substrate 100 (that is, viewed in plan view), the entire first electrode 110 is overlapped and covered by the second electrode 130 in the width direction. With such a configuration, the extraction direction of light emitted from the light emitting layer of the organic layer 120 can be adjusted. Specifically, light emission in the direction where the second electrode 130 of the light emitting device 10 is formed can be suppressed. Conversely, the first electrode 110 is wider than the second electrode 130, and when viewed from a direction perpendicular to the substrate 100, the entire second electrode 130 is covered with the first electrode 110 in the width direction. Also good. In this case, the amount of light emitted in the direction where the second electrode 130 of the light emitting device 10 is formed is relatively large.

  The edge of the first electrode 110 is covered with an insulating film 150. The insulating film 150 is formed by including a photosensitive material in an insulating resin material such as polyimide, and surrounds a portion of the first electrode 110 that becomes the light emitting portion 140. An edge in the width direction of the second electrode 130 is located on the insulating film 150. In other words, when viewed from a direction perpendicular to the substrate 100, a part of the insulating film 150 protrudes from the second electrode 130. In the example shown in this drawing, the organic layer 120 is also formed on the top and side surfaces of the insulating film 150. However, the organic layer 120 is preferably electrically separated between the adjacent light emitting units 140, but may be formed continuously with the adjacent light emitting units. The insulating film 150 may be formed of an inorganic material.

  As described above, the light emitting device 10 includes the first region 102, the second region 104, and the third region 106. These three regions do not overlap each other. The first region 102 is a region overlapping with the second electrode 130. The second region 104 is a region including the insulating film 150 among regions between the plurality of light emitting units 140 and is a part of the light transmitting portion. In the example shown in this figure, the organic layer 120 is also formed in the second region 104. The third region 106 is a region that does not include the insulating film 150 among the regions between the plurality of light emitting units 140 and is another part of the light transmitting portion. In the example shown in the drawing, the organic layer 120 is not formed in at least a part of the third region 106. The width of the second region 104 is narrower than the width of the third region 106. The width of the third region 106 may be wider or narrower than that of the first region 102. When the width of the first region 102 is 1, the width of the second region 104 is, for example, 0 or more (or more than 0 or 0.1 or more) 0.2 or less, and the width of the third region 106 is, for example, 0.3. It is 2 or less. The width of the first region 102 is, for example, 50 μm or more and 500 μm or less, the width of the second region 104 is, for example, 0 μm or more (or more than 0 μm), 100 μm or less, and the width of the third region 106 is, for example, 15 μm or more and 1000 μm or less. is there.

  FIG. 4 is a plan view of the light emitting device 10. 2 corresponds to the AA cross section of FIG. In the example shown in this figure, the first region 102, the second region 104, and the third region 106 are all linear and extend in the same direction. As shown in FIGS. 2 and 2, the second region 104, the first region 102, the second region 104, and the third region 106 are repeatedly arranged in this order.

  Next, a method for manufacturing the light emitting device 10 will be described. First, the first electrode 110 is formed on the substrate 100 by using, for example, a sputtering method. Next, the first electrode 110 is formed into a predetermined pattern using, for example, a photolithography method. Next, the insulating film 150 is formed on the edge of the first electrode 110. For example, in the case where the insulating film 150 is formed so as to include a photosensitive material, the insulating film 150 is formed in a predetermined pattern through an exposure and development process. Next, the organic layer 120 and the second electrode 130 are formed in this order. When the organic layer 120 includes a layer formed by an evaporation method, this layer is formed in a predetermined pattern using, for example, a mask. The second electrode 130 is also formed in a predetermined pattern using, for example, a mask. Thereafter, the light emitting unit 140 is sealed using a sealing member (not shown).

  The adhesive layer 200 adheres the partition member 20 and the light emitting device 10. The material is not particularly limited as long as it has such a function. In addition, when the refractive index of the partition member 20 and the refractive index of the substrate 100 of the light emitting device 10 are the same, for example, when both are formed of glass, the adhesive layer 200 having the same or close refractive index as both. Is used. On the other hand, when the refractive index is different between the partition member 20 and the substrate 100 (for example, the partition member 20 is formed of plastic and the substrate 100 is formed of glass), the refractive index of the adhesive layer 200 is the same as that of the partition member 20. A numerical value between the substrates 100 is preferred. By doing in this way, it is because light emission of the light-emitting device 10 can be efficiently taken out outside through the partition member 20. Moreover, it is preferable that the light emitting device 10 and the partition member 20 are bonded without a gap. This is because if there is a gap, the light emitted from the light emitting device 10 is reflected by the partition member 20 and the reflected light is transmitted to the inside through the second region 104 and the third region 106 of the light emitting device 10.

  In the present embodiment, among the first region 102, the second region 104, and the third region 106, the first region 102 has the lowest light transmittance. In addition, the second region 104 has a lower light transmittance than the third region 106 due to the presence of the insulating film 150. In the present embodiment, the width of the second region 104 is narrower than the width of the third region 106. For this reason, in the light emitting device 10, the area occupancy of the second region 104 is lower than the area occupancy of the third region 106. Therefore, the light transmittance of the light emitting device 10 is increased. For this reason, even if the light emitting device 10 is attached to the partition member 20, a person can visually recognize the region inside the partition member 20 through the light emitting device 10 and the partition member 20. Moreover, the area | region inside the partition member 20 can be illuminated using the light-emitting device 10. FIG.

  In addition, when the second electrode 130 is formed using a light-shielding material such as metal, light from the light emitting device 10 is emitted to the inside (first space) of the partition member 20 through the partition member 20. The light is hardly emitted to the side opposite to the partition member 20. In addition, the light emitting device 10 includes the light transmitting portions (the second region 104 and the third region 106) as described above. Therefore, a person can easily visually recognize the inner region of the partition member 20 in a state where the light emitting device 10 emits light. For example, when an object is arranged inside the partition member 20, a person can visually recognize an object inside the partition member 20 in each of the light emitting device 10 emitting light and the non-light emitting state. A specific difference in light emission intensity between the light emitting surface and the non-light emitting surface of the light emitting device 10 will be described later.

  The insulating film 150 is formed of a light-transmitting material, but generally the light transmittance of the light-transmitting material varies depending on the wavelength of light. For this reason, when the width of the insulating film 150 is wide, the spectral distribution of the light changes when light passes through the insulating film 150. In this case, when an object is viewed through the light emitting device 10, the color of the object looks different from the actual color. That is, the color of the object changes through the light emitting device 10. For example, when the absorption at a blue wavelength of 400 nm to 600 nm is 50% and is larger than the absorption at other wavelengths, the blue color becomes weak and yellowish when viewed through the light emitting device 10. In contrast, in the present embodiment, since the width of the second region 104 is narrower than the width of the third region 106, the above-described color change can be suppressed.

Example 1
FIG. 5 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to Example 1, and corresponds to FIG. 2 in the embodiment. The light emitting device 10 according to the present example has the same configuration as the light emitting device 10 according to the embodiment except for the layout of the organic layer 120. Moreover, an example of the usage method of the light-emitting device 10 which concerns on a present Example is as having shown in embodiment.

  In the present embodiment, the organic layer 120 is formed on the entire surface of the third region 106. In other words, the organic layer 120 is continuously formed over the first region 102, the second region 104, and the third region 106. The organic layer 120 is continuously formed so as to connect the plurality of light emitting units 140.

  FIG. 33 shows the angle dependency of the light emission intensity with respect to the first surface 100a side (FIG. 33A) and the light emission intensity with respect to the second surface 100b side (FIG. 33B) in the light emitting device 10 according to this example. The result of having measured is shown. In this measurement, the perpendicular direction of the substrate 100 was 0 °, and the direction parallel to the substrate 100 was 90 °.

  As shown in FIG. 33A, on the first surface 100a side (that is, the first space side) of the light-emitting device 10, the angle at which the light emission intensity is the strongest was 0 °. The light emission intensity decreased as the angle increased (in other words, the measurement direction moved obliquely from the front of the light emitting device 10).

  On the other hand, as shown in FIG. 33B, on the second surface 100b side of the light emitting device 10 (that is, the second space side), the angle at which the light emission intensity is the weakest was 0 °. However, at any angle, the light emission intensity of the light emitting device 10 with respect to the second surface 100b side of the light emitting device 10 was 5% or less of the light emission intensity with respect to the first surface 100a side. In particular, at the front surface (0 °) of the light emitting device 10, the light emission intensity of the light emitting device 10 with respect to the second surface 100b side of the light emitting device 10 was 0.02% or less of the light emission intensity with respect to the first surface 100a side. The light emitting main surface of the light emitting device 10 is the first surface 100a side.

  FIG. 34 shows the measurement of the angle dependence of the emission spectrum on the first surface 100a side (FIG. 34 (a)) and the second surface 100b side (FIG. 34 (b)) in the light emitting device 10 of this example. The results are shown. The light emitting layer of the organic layer 120 contains a red light emitting material.

  Even in this example, even if the light emitting device 10 is attached to the partition member 20 as in the embodiment, a person can visually recognize the region inside the partition member 20 through the light emitting device 10 and the partition member 20. Moreover, the area | region inside the partition member 20 can be illuminated using the light-emitting device 10. FIG. Moreover, since the organic layer 120 is formed continuously, the cost for forming the organic layer 120 is reduced.

(Example 2)
FIG. 6 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to Example 2, and corresponds to FIG. 3 in the embodiment. The light emitting device 10 according to this example has the same configuration as that of the light emitting device 10 according to the first embodiment except for the width of the second electrode 130. Moreover, an example of the usage method of the light-emitting device 10 which concerns on a present Example is as having shown in embodiment.

  In the present embodiment, the width of the second electrode 130 is narrower than the width of the first electrode 110. For this reason, when viewed from a direction perpendicular to the substrate 100, the end portion of the first electrode 110 in the width direction protrudes from the second electrode 130. In other words, a part of the second region 104 overlaps the first electrode 110.

  Also in this example, as in the embodiment, even if the light emitting device 10 is attached to the partition member 20, a person can visually recognize the region inside the partition member 20 through the light emitting device 10 and the partition member 20. . Moreover, the area | region inside the partition member 20 can be illuminated using the light-emitting device 10. FIG.

(Example 3)
FIG. 7 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to Example 3, and corresponds to FIG. 3 in the embodiment. The light emitting device 10 according to the present example has the same configuration as that of the light emitting device 10 according to the first embodiment, except that the peeling preventing unit 160 is provided. Moreover, an example of the usage method of the light-emitting device 10 which concerns on a present Example is as having shown in embodiment.

  The peeling prevention unit 160 is provided on the surface of the substrate 100 where the light emitting unit 140 is formed. The peeling prevention unit 160 is insulated from the first electrode 110 and is formed of a material having higher adhesion to the insulating film 150 than the substrate 100. The insulating film 150 is formed from the edge of the first electrode 110 to the peeling prevention unit 160. In the example shown in the figure, the peeling prevention unit 160 is made of the same material as the first electrode 110 and is physically separated from the first electrode 110 to be insulated from the first electrode 110. ing. In this case, the peeling prevention unit 160 is formed in the same process as the first electrode 110. The insulating film 150 is also formed on a region of the substrate 100 located between the peeling prevention unit 160 and the first electrode 110. The edge of the insulating film 150 is located on the peeling prevention unit 160.

  Also in this example, as in the embodiment, even if the light emitting device 10 is attached to the partition member 20, a person can visually recognize the region inside the partition member 20 through the light emitting device 10 and the partition member 20. . Moreover, the area | region inside the partition member 20 can be illuminated using the light-emitting device 10. FIG. Further, the edge of the insulating film 150 is located on the peeling preventing portion 160. The peeling prevention unit 160 has higher adhesion to the insulating film 150 than the substrate 100. Accordingly, the insulating film 150 can be prevented from peeling off. In the case of using the substrate 100 having flexibility, it becomes more difficult to peel off.

(Example 4)
FIG. 8 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to Example 4, and corresponds to FIG. 3 in the embodiment. The light emitting device 10 according to the present example has the same configuration as that of the light emitting device 10 according to Example 3, except that the conductive portion 170 is provided. Moreover, an example of the usage method of the light-emitting device 10 which concerns on a present Example is as having shown in embodiment.

  The conductive portion 170 is, for example, an auxiliary electrode for the first electrode 110 and is in contact with the first electrode 110. The conductive portion 170 is formed of a material having a lower resistance value than that of the first electrode 110, and is formed using, for example, at least one metal layer. The conductive portion 170 has a configuration in which, for example, a first metal layer such as Mo or Mo alloy, a second metal layer such as Al or Al alloy, and a third metal layer such as Mo or Mo alloy are stacked in this order. Yes. Of these three metal layers, the second metal layer is the thickest. The conductive portion 170 is covered with the insulating film 150. For this reason, the conductive part 170 is not directly connected to either the organic layer 120 or the second electrode 130.

  FIG. 9A is a first example of an enlarged view of a region surrounded by a dotted line α in FIG. In the example shown in this figure, the conductive portion 170 has a configuration in which a second layer 174 is stacked on a first layer 172. The first layer 172 is formed of a metal such as Al or Al alloy, for example, and the second layer 174 is formed of a conductive material having a higher hardness and a lower etching rate than the first layer 172, such as Mo or Mo alloy. Has been. The first layer 172 is made of a material having a lower resistance than the second layer 174. When the first layer 172 is formed of an AlNd alloy, the second layer 174 is formed of a MoNb alloy. The thickness of the first layer 172 is, for example, not less than 50 nm and not more than 1000 nm. Preferably it is 600 nm or less. The second layer 174 is thinner than the first layer 172. The thickness of the second layer 174 is, for example, 100 nm or less, preferably 60 nm or less, more preferably 30 nm or less.

  The visible light reflectance of the second layer 174 is lower than the visible light reflectance of the first layer 172. For example, for light having a wavelength of 530 nm, the reflectance of the second layer 174 is about 60%, and the reflectance of the first layer 172 is about 90%.

  The width of the first layer 172 is narrower than the width of the second layer 174. For this reason, in the width direction of the conductive portion 170, the end portion of the first layer 172 is located closer to the center of the conductive portion 170 than the end portion of the second layer 174. The distance d between the end of the first layer 172 and the end of the second layer 174 is preferably 150 nm or more, more preferably 300 nm or more.

  In addition, at least a part of the conductive portion 170 overlaps the second electrode 130. The width w of the conductive portion 170 overlapping the second electrode 130 is preferably, for example, 150 nm or more. In the example shown in this drawing, the entire conductive portion 170 overlaps the second electrode 130.

  The timing for forming the conductive portion 170 is after the first electrode 110 is formed and before the insulating film 150 is formed. The conductive portion 170 is formed as follows, for example. First, the first layer 172 and the second layer 174 are formed in this order by using a film forming method such as a sputtering method. Next, a resist pattern (not shown) is formed on the second layer 174, and the second layer 174 and the first layer 172 are etched (for example, wet etching) using the resist pattern as a mask. At this time, the etching is made isotropic. Also, under this etching condition, the etching rate of the first layer 172 is faster than the etching rate of the second layer 174. For this reason, the first layer 172 is etched faster than the second layer 174. As a result, the side surface of the first layer 172 enters the center side of the conductive portion 170 more than the side surface of the second layer 174. That is, the end portion of the first layer 172 is positioned closer to the center of the conductive portion 170 than the end portion of the second layer 174. Note that the size of the interval d is controlled by adjusting etching conditions (for example, etching time).

  Even in this example, even if the light emitting device 10 is attached to the partition member 20 as in the embodiment, a person can visually recognize the region inside the partition member 20 through the light emitting device 10 and the partition member 20. Moreover, the area | region inside the partition member 20 can be illuminated using the light-emitting device 10. FIG. Further, since the conductive portion 170 is formed on the first electrode 110, the apparent resistance value of the first electrode 110 can be lowered. Moreover, it is suppressed that the color of the thing when seeing an object via the light-emitting device 10 looks different from an actual color.

  Further, since the conductive portion 170 is covered with the insulating film 150, the amount of light transmitted through the insulating film 150 increases when light is reflected from the end face of the conductive portion 170. Since the light transmittance of the insulating film 150 varies depending on the wavelength of light, when the amount of light transmitted through the insulating film 150 increases, the color of the object changes when the object is viewed through the light emitting device 10. The chance of seeing is increased. On the other hand, in the present embodiment, the visible light reflectance of the second layer 174 is lower than the visible light reflectance of the first layer 172. The end portion of the first layer 172 is located closer to the center of the conductive portion 170 than the end portion of the second layer 174. Accordingly, at least part of the light incident on the end portion of the first layer 172 is blocked by the second layer 174. Thereby, the amount of light transmitted through the insulating film 150 can be reduced.

  As shown in FIG. 9B, the conductive portion 170 may have a configuration in which the first layer 172 is stacked on the second layer 174. In this case, at least a part of the light reflected by the end portion of the first layer 172 is blocked by the second layer 174 before entering the substrate 100. Thereby, the amount of light transmitted through the insulating film 150 can be reduced.

  9C, the conductive portion 170 may have a configuration in which a second layer 174, a first layer 172, and a second layer 174 are stacked in this order. In the example of FIG. 9C, the film thicknesses of the two second layers 174 may be different from each other or the same.

(Example 5)
FIG. 10 is a cross-sectional view illustrating the configuration of the light emitting device 10 according to the fifth embodiment. FIG. 11 is a plan view of the light emitting device 10 shown in FIG. However, some members are omitted in FIG. FIG. 10 corresponds to the BB cross section of FIG. The light emitting device 10 according to this example has the same configuration as that of the light emitting device 10 according to the embodiment or any of Examples 1 to 4 except that the sealing member 180 and the desiccant 190 are provided.

  In the example shown in the figure, the planar shape of the substrate 100 is, for example, a polygon such as a rectangle or a circle. The sealing member 180 has translucency and is formed using, for example, glass or resin. The sealing member 180 is a polygon or a circle similar to the substrate 100, and has a shape in which a recess is provided at the center. The edge of the sealing member 180 is fixed to the substrate 100 with an adhesive. Thereby, the space surrounded by the sealing member 180 and the substrate 100 is sealed. The plurality of light emitting units 140 are all located in a sealed space.

  The light emitting device 10 includes a first terminal 112, a first lead wire 114, a second terminal 132, and a second lead wire 134. The first terminal 112, the first lead wiring 114, the second terminal 132, and the second lead wiring 134 are all formed on the same surface of the substrate 100 as the light emitting unit 140. The first terminal 112 and the second terminal 132 are located outside the sealing member 180. The first lead wire 114 connects the first terminal 112 and the first electrode 110, and the second lead wire 134 connects the second terminal 132 and the second electrode 130. In other words, each of the first lead wiring 114 and the second lead wiring 134 extends from the inside to the outside of the sealing member 180.

  The first terminal 112, the second terminal 132, the first lead wiring 114, and the second lead wiring 134 have, for example, a layer formed of the same material as that of the first electrode 110. In addition, at least a part of at least one of the first terminal 112, the second terminal 132, the first lead wiring 114, and the second lead wiring 134 is a metal film having a lower resistance than the first electrode 110 on this layer. (For example, a film similar to the conductive portion 170) may be included. This metal film does not need to be formed on all of the first terminal 112, the second terminal 132, the first lead wiring 114, and the second lead wiring 134. Of the first terminal 112, the first lead wire 114, the second terminal 132, and the second lead wire 134, a layer formed of the same material as the first electrode 110 is formed in the same process as the first electrode 110. Yes. For this reason, the first electrode 110 is integrated with at least a part of the layer of the first terminal 112. When these have a metal film, the metal film is formed in the same process as that of the conductive portion 170, for example. In this case, the light transmittance of the first terminal 112, the first lead wire 114, the second terminal 132, and the second lead wire 134 is lower than the light transmittance of the substrate 100.

  In the example shown in the drawing, the first lead wiring 114 and the second lead wiring 134 are formed one by one for one light emitting unit 140. The plurality of first lead wires 114 are all connected to the same first terminal 112, and the plurality of second lead wires 134 are all connected to the same second terminal 132. The first terminal 112 is connected to a positive terminal of a control circuit via a conductive member such as a bonding wire or a lead terminal, and the second terminal 132 is controlled via a conductive member such as a bonding wire or a lead terminal. The negative terminal of the circuit is connected.

  The desiccant 190 does not overlap any light emitting unit 140 or the second region 104 or the third region 106 when viewed from the direction perpendicular to the substrate 100 in the space sealed by the sealing member 180. It is arranged in a region, for example, a region overlapping with at least one of the first lead wiring 114 and the second lead wiring 134.

  Specifically, the desiccant 190 contains a hygroscopic material such as CaO or BaO. The light transmittance of the desiccant 190 is lower than the light transmittance of the substrate 100. The desiccant 190 is fixed to the surface of the sealing member 180 that faces the substrate 100. In the example shown in the drawing, the desiccant 190 is disposed in each of the region overlapping the first lead wiring 114 and the region overlapping the second lead wiring 134. In other words, the desiccant 190 is disposed along two opposite sides of the rectangular substrate 100, but is disposed along the remaining two sides, that is, the remaining two sides and the light emitting unit 140. Not.

  FIG. 12 is a plan view showing a modification of FIG. In the example shown in this drawing, a part of the first terminal 112 and the second terminal 132 is located inside the sealing member 180. At least a part of the desiccant 190 overlaps at least one of the first terminal 112 and the second terminal 132.

  Also in this example, as in the embodiment, even if the light emitting device 10 is attached to the partition member 20, a person can visually recognize the region inside the partition member 20 through the light emitting device 10 and the partition member 20. . Moreover, the area | region inside the partition member 20 can be illuminated using the light-emitting device 10. FIG. Further, when viewed from a direction perpendicular to the substrate 100, the desiccant 190 does not overlap the light emitting unit 140 and is located near the edge of the substrate 100. Therefore, as compared with the case where the desiccant 190 is provided at a position overlapping the light emitting unit 140, the desiccant 190 is less visible to the user. In particular, in the present embodiment, the desiccant 190 overlaps the first lead wiring 114 and the second lead wiring 134. The first lead wiring 114 and the second lead wiring 134 also have low light transmittance. For this reason, compared with the case where the desiccant 190 is not overlapped with the 1st extraction wiring 114 and the 2nd extraction wiring 134, the light transmittance of the light-emitting device 10 improves. In particular, when the first terminal 112 and the second terminal 132 are overlapped with the desiccant 190, the light transmittance of the light emitting device 10 is greatly improved as compared with the case where they are not overlapped.

  The luminance of the light emitting unit 140 varies depending on the temperature of the organic layer 120. When the desiccant 190 is provided at a position overlapping the organic layer 120, at least a part of the heat radiated from the light emitting unit 140 is absorbed by the desiccant 190. Therefore, the temperature of the region of the organic layer 120 that overlaps with the desiccant 190 is lower than the other regions of the organic layer 120. In this case, in-plane variation occurs in the luminance of the light emitting unit 140.

  On the other hand, in this embodiment, the desiccant 190 does not overlap the light emitting unit 140. Therefore, it is possible to suppress in-plane variation in the luminance of the light emitting unit 140.

  Further, due to the resistance of the first electrode 110 and the second electrode 130, the luminance of the region located near the first lead wiring 114 in the light emitting unit 140 and the region located near the second lead wiring 134 The brightness is higher than the brightness at the center of the light emitting unit 140. On the other hand, in the present embodiment, the desiccant 190 is provided at a position overlapping the first extraction wiring 114 and a position overlapping the second extraction wiring 134. Accordingly, the temperature of the region located near the first lead wire 114 in the organic layer 120 and the temperature of the region located near the second lead wire 134 are both the center of the light emitting unit 140 in the organic layer 120. It becomes lower than the temperature of the region located in the part. Thereby, the variation in the luminance of the light emitting unit 140 due to the resistance of the first electrode 110 and the second electrode 130 is absorbed. Accordingly, the in-plane variation in luminance of the light emitting unit 140 is reduced.

(Example 6)
FIG. 13 is a plan view illustrating a configuration of the light emitting device 10 according to the sixth embodiment. 14 is a cross-sectional view taken along the line CC of FIG. The light emitting device 10 according to this example has the same configuration as that of the light emitting device 10 according to any of the embodiment and Examples 1 to 5 except for the layout of the insulating film 150. Specifically, the width of at least a portion (a first portion 152 described later) of the insulating film 150 positioned between the light emitting units 140 is positioned next to the first portion 152 of the insulating film 150. It is different from the area to do. In the example shown in FIGS. 13 and 14, the width of the first portion 152 is narrower than that of the other portions.

  The plurality of light emitting units 140 extend in parallel to each other. In the example shown in FIG. 13, the plurality of light emitting units 140 all extend in a rectangular shape (stripe shape). However, the light emitting unit 140 may be bent halfway.

  The insulating film 150 has a portion (hereinafter referred to as a first portion 152) having a different width compared to the others. When the insulating film 150 is formed using a photosensitive material, the first portion 152 is formed when the insulating film 150 is exposed and developed. When the planar shape of the insulating film 150 is formed using, for example, a mask pattern, the first portion 152 is formed simultaneously with the insulating film 150 by making the mask pattern a predetermined shape. Note that “there are a plurality of insulating films 150” means, for example, that the insulating films 150 are formed at a plurality of locations in a specific cross section. Even when the plurality of insulating films 150 are continuously formed at locations on the substrate 100 and as a result, a single structure is included in the “plural insulating films 150” in this embodiment.

  Note that when viewed from the direction perpendicular to the substrate 100, the first portion 152 can also be regarded as a recess provided in the insulating film 150. In the example shown in FIG. 13, the planar shape of the recess is a rectangle. However, this recess may have other shapes. For example, the concave portion may be semicircular or V-shaped. In other words, the insulating film 150 has different widths in cross sections of different portions of the light emitting portion 140 (for example, the CC cross section and the DD cross section in FIG. 13). Here, the insulating film 150 of the continuous light emitting unit 140 may have the first portion 152 that is narrower than the other, and one of the insulating films 150 of the adjacent light emitting units 140 is the first portion 152. There may be. It can be appropriately selected according to a desired shape to be described later.

  Also in the present example, similarly to the embodiment, even if the light emitting device 10 is attached to the partition member 20, a person can visually recognize the region inside the partition member 20 through the light emitting device 10 and the partition member 20. . Moreover, the area | region inside the partition member 20 can be illuminated using the light-emitting device 10. FIG.

  In this embodiment, the insulating film 150 has a portion having a narrower width than other portions, that is, a first portion 152. In the portion where the first portion 152 is located, a part of the light from the light emitting unit 140 is the surface opposite to the light emitting side of the light emitting device 10 (that is, the direction in which the light reflective electrode is formed as viewed from the organic layer 120) Leaks into the surface. For this reason, by making the number and position of the first portions 152 appropriate, when the light emitting device 10 is caused to emit light, a desired shape (for example, letters, numbers) is formed on the surface opposite to the light emitting side of the light emitting device 10. , Graphics, and / or patterns) can be displayed.

  When the light emitting device 10 includes a plurality of first portions 152, the shapes of the plurality of first portions 152 (for example, at least one of the width and depth of the recesses described above) may be the same. However, the shape of at least one of the first portions 152 may be different from the shape of the other first portions 152. In the latter case, the intensity of light leaking from the at least one first portion 152 may be different from the intensity of light leaking from the other first portion 152 (may be strong or weak). it can. Thereby, the variation of the shape displayed on the surface on the opposite side to the light emission side of the light-emitting device 10 increases.

(Modification 1 of Example 6)
FIG. 15 is a plan view of the light emitting device 10 according to the first modification of the sixth embodiment, and corresponds to FIG. 13 in the sixth embodiment. The light emitting device 10 according to this modification has the same configuration as that of the light emitting device 10 according to Example 6, except that the insulating film 150 includes a second portion 154 instead of the first portion 152. The second portion 154 is formed using a material different from other regions of the insulating film 150. The second portion 154 can also be regarded as a configuration in which an insulator different from the insulating film 150 is disposed on the first portion 152 according to the sixth embodiment. The second portion 154 may be formed after the other portion of the insulating film 150 is formed, or may be formed before the other portion of the insulating film 150 is formed. In addition, a material having optical functionality (for example, a particle having light diffusibility or a particle having a refractive index different from that of the insulating film 150) may be mixed only in a portion to be the second portion 154 in the insulating film 150. In this case, the portion including this material becomes the second portion 154.

  The material constituting the second portion 154 of the insulating film 150 is, for example, a material having a higher light transmittance (for example, silicon oxide) or a material having a higher refractive index than materials constituting the other portions of the insulating film 150.

  In this modification, the amount of light leaking from the light emitting unit 140 to the third region 106 in the portion where the second portion 154 is located is the amount of light leaking from the light emitting unit 140 to the third region 106 in other portions of the insulating film 150. Is different. For example, when the light transmittance of the material constituting the second portion 154 is higher than the light transmittance of the other portions of the insulating film 150, the amount of light leaking from the light emitting unit 140 in the second portion 154 depends on the insulating film. It is larger than the amount of light leaking from the light emitting unit 140 in other parts of 150. For this reason, by appropriately designing the number and position of the second portions 154, when the light emitting device 10 emits light, a desired shape (for example, a character, At least one of a number, a figure, and a pattern can be displayed.

  In the present modification, when the portions adjacent to each other through the light emitting unit 140 in the insulating film 150 are compared, one whole may be the second portion 154.

(Example 7)
FIG. 16 is a plan view illustrating the configuration of the light emitting device 10 according to the seventh embodiment. 17 is a cross-sectional view taken along the line CC of FIG. The light emitting device 10 according to this example has the same configuration as that of the light emitting device 10 according to Example 6, except that the first portion 152 is wider than the other portions of the insulating film 150. . In other words, in this embodiment, the width of a part of the second region 104 is different from the width of the other part of the second region 104, and is one of the widths of the third region 106 that is a light-transmitting region. The part is different from the width of the other part of the third region 106.

  According to this example, similarly to the embodiment, even if the light emitting device 10 is attached to the partition member 20, the person can visually recognize the region inside the partition member 20 through the light emitting device 10 and the partition member 20. it can. Moreover, the area | region inside the partition member 20 can be illuminated using the light-emitting device 10. FIG.

  In addition, according to the present embodiment, apparently, the amount of light transmitted through the region of the third region 106 where the first portion 152 is provided is the amount of light transmitted through the other portion of the third region 106. And different. In other words, the light transmittance in the third region 106 differs depending on the presence or absence of the first portion 152. For this reason, by appropriately designing the number and position of the first portions 152, desired shapes (for example, letters, numbers, figures, and patterns) are formed on both sides of the light emitting device 10 when the light emitting device 10 is not emitting light. At least one) can be raised. Even when the light emitting device 10 emits light, the amount of light leaking from the light emitting unit 140 is different in the first portion 152 compared to other portions, and therefore the number and position of the first portions 152 should be designed appropriately. Thus, when the light emitting device 10 is caused to emit light, a desired shape (for example, at least one of letters, numbers, figures, and patterns) can be raised on the side opposite to the light exit surface of the light emitting device 10.

  In the example shown in FIGS. 16 and 17, the two first portions 152 facing each other through the third region 106 are separated from each other. However, these two first portions 152 may be connected to each other.

  Further, in the present embodiment, when the portions adjacent to each other through the light emitting unit 140 in the insulating film 150 are compared, one whole may be wider than the other.

(Modification 1 of Example 7)
FIG. 18 is a cross-sectional view illustrating the configuration of the light emitting device 10 according to the first modification of the seventh embodiment, and corresponds to FIG. 17 in the seventh embodiment. The light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to the seventh embodiment except for the following points.

  An insulating film 153 (film) is formed in the third region 106. In the direction in which the light emitting unit 140 extends (for example, the vertical direction in FIG. 16), the method for determining the position of the insulating film 153 is the same as the method for determining the position of the first portion 152 in the seventh embodiment. The insulating film 153 is formed in the same process as the insulating film 150. Therefore, the insulating film 153 is formed of the same material as the insulating film 150 and has almost the same height as the insulating film 150 (for example, a range of 90% to 110% of the height of the insulating film 150). doing. Note that the insulating film 153 is separated from the insulating film 150.

  In the present modification, the amount of light transmitted through the region where the insulating film 153 is provided in the third region 106 is smaller than the amount of light transmitted through the other part of the third region 106. For this reason, similarly to Example 7, when the light emitting device 10 is not emitting light, a desired shape (for example, at least one of letters, numbers, figures, and patterns) can be highlighted on both surfaces of the light emitting device 10.

  Further, at the time of light emission of the light emitting device 10, part of the light leaking from the light emitting unit 140 to the third region 106 is reflected by the insulating film 153, and is exposed to the outside from the surface opposite to the light emitting side of the light emitting device 10. Get out. Therefore, when the light emitting device 10 emits light, a desired shape (for example, at least one of letters, numbers, figures, and patterns) can be displayed on the surface opposite to the light emitting side of the light emitting device 10.

  In this modification, the insulating film 150 may have the first portion 152. In this case, in the direction in which the light emitting unit 140 extends (vertical direction in FIG. 16), the first portion 152 may be disposed at a position that overlaps with the insulating film 153 or at a position that does not overlap with the insulating film 153. It may be.

  Further, in the present modification, when the third regions 106 adjacent to each other through the light emitting unit 140 are compared, the insulating film 153 is formed in one third region 106 over the entire direction in which the light emitting unit 140 extends. It may be.

(Modification 2 of Example 7)
FIG. 19 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to the second modification of the seventh embodiment, and corresponds to FIG. 17 in the seventh embodiment. The light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to the seventh embodiment except for the following points.

  First, the insulating film 150 does not have the first portion 152. In the direction in which the light emitting portion 140 extends, a part of the second electrode 130 is wider than the other part, and the region without the insulating film 150 (that is, the third region 106 in Example 7). To the area that was). In this portion, the substrate 100 does not have the second region 104 and the width of the third region 106 is narrow. The method of determining the position of the wide portion of the second electrode 130 is the same as the method of determining the position of the first portion 152 in the seventh embodiment.

  Also in this modification, the amount of light transmitted through the third region 106 is reduced in the portion where the width of the second electrode 130 is wide. For this reason, by appropriately designing the number and positions of the wide portions of the second electrode 130, as in the seventh embodiment, when the light emitting device 10 does not emit light, it is desired on both sides of the light emitting device 10. (For example, at least one of letters, numbers, figures, and patterns) can be raised.

  In addition, in this modification, when the 2nd electrode 130 of the light emission part 140 adjacent to each other is compared, one whole may be wider than the other.

(Modification 3 of Example 7)
FIG. 20 is a cross-sectional view illustrating the configuration of the light emitting device 10 according to the third modification of the seventh embodiment, and corresponds to FIG. 17 in the seventh embodiment. In the light emitting device 10 according to this modification, contrary to FIG. 19, the width of the second electrode 130 is partially narrowed in the direction in which the light emitting unit 140 extends (in other words, the first region). The configuration is the same as that of the light emitting device 10 according to the second modification of the seventh embodiment except that the width of the portion 102 is partially narrowed.

  In this modification, the width of the second electrode 130 is narrow in a part of the light emitting unit 140. For this reason, when the light emitting device 10 emits light, light easily leaks from the light emitting unit 140 to the third region 106 in the portion where the second electrode 130 is narrow. This light exits from the surface opposite to the light emitting side of the light emitting device 10. For this reason, by making the number and arrangement of the narrowed portions of the second electrode 130 appropriate, when the light emitting device 10 emits light, a desired shape is formed on the surface opposite to the light emitting side of the light emitting device 10. (Eg, at least one of letters, numbers, figures, and patterns) can be displayed.

  In addition, in this modification, when the 2nd electrode 130 of the light emission part 140 adjacent to each other is compared, the width of one whole may be narrower than the other.

(Modification 4 of Example 7)
FIG. 21 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to the fourth modification of the seventh embodiment, and corresponds to FIG. 17 in the seventh embodiment. The light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to the seventh embodiment except for the following points.

  First, the insulating film 150 does not have the first portion 152. In the direction in which the light emitting unit 140 extends, a part of the first electrode 110 is wider than the other part. Along with this, the width of the insulating film 150 also increases. In other words, in the present modification, the width of the second region 104 is partially increased in the direction in which the light emitting unit 140 extends, and accordingly the width of the third region 106 is partially reduced. ing.

  In this modification, the amount of light transmitted through the third region 106 is reduced in the portion where the width of the first electrode 110 is wide. For this reason, by appropriately designing the number and positions of the wide portions of the first electrode 110, as in the seventh embodiment, when the light emitting device 10 does not emit light, it is desired on both sides of the light emitting device 10. (For example, at least one of letters, numbers, figures, and patterns) can be raised. In addition, when the light emitting device 10 emits light, the amount of light that is refracted and reflected is larger in the portion where the width of the first electrode 110 is wider than in other portions, so the width of the first electrode 110 is increased. By appropriately designing the length and position of the width of the light emitting portion, when the light emitting device 10 emits light, a desired shape (for example, letters, numbers, At least one of a figure and a pattern) can be raised.

  In addition, in this modification, when the 1st electrode 110 of the light emission part 140 adjacent to each other is compared, the width of one whole may be narrower than the other.

(Modification 5 of Example 7)
FIG. 22 is a cross-sectional view illustrating a configuration of a light-emitting device 10 according to Modification 5 of Example 7, and corresponds to FIG. The light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to the seventh embodiment except for the following points. In this figure, the organic layer 120 is not formed in the third region 106, but the organic layer 120 may also be formed in the third region 106 as in the first embodiment.

  First, the insulating film 150 does not have the first portion 152. In a part of the third region 106, at least one surface of the substrate 100 and the organic layer 120 has unevenness 107. The unevenness 107 is formed using, for example, etching.

  In the present modification, the light transmittance is higher in the portion of the third region 106 where the unevenness 107 is formed than in the portion where the unevenness 107 is not present. For this reason, by appropriately designing the number and positions of the regions where the projections and depressions 107 are formed, a desired shape (for example, on both surfaces of the light-emitting device 10 when the light-emitting device 10 is not emitting light, as in Example 7, for example. At least one of letters, numbers, figures and patterns) can be raised.

  In this modification, when the third regions 106 that are adjacent to each other through the light emitting unit 140 are compared, the unevenness 107 is formed in one third region 106 over the entire direction in which the light emitting unit 140 extends. May be.

(Modification 6 of Example 7)
FIG. 23 is a plan view of the light emitting device 10 according to Modification 6 of Example 7. FIG. 24 is a cross-sectional view taken along the line CC of FIG. The light emitting device 10 according to the present example has the same configuration as the light emitting device 10 according to Example 7 except for the following points.

  First, the insulating film 150 does not have the first portion 152. A film 155 is provided over part of the region between the adjacent insulating films 150 in the substrate 100, in other words, part of the light-transmitting third region 106. The film 155 is a semi-transmissive film having higher light transmittance than the second electrode 130. In order to do this, the material and thickness of the film 155 may be selected. Note that the material forming the film 155 is preferably, for example, a material that transmits light and has a refractive index different from that of the substrate. An example of such a material is ITO. In this case, the thickness of the film 155 is not particularly limited. For example, when the film 155 is formed of ITO, the film 155 can be formed in the same process as the first electrode 110. In this case, the thickness of the film 155 is almost the same as the thickness of the first electrode 110.

  FIG. 25 is a diagram illustrating an example of a planar layout of the film 155. In the first example shown in FIG. 25A, the film 155 is formed as one continuous film. In this case, for example, the light transmittance of the film 155 becomes a desired value by reducing the film thickness of the film 155 to an appropriate thickness to obtain a semi-transmissive film.

  On the other hand, in the second example shown in FIG. 25B, the film 155 is formed as a discontinuous film. For example, in the example shown in FIG. 25B, the film 155 is a plurality of films separated from each other. However, the film 155 may have a plurality of openings. In these cases, the ratio of the width of the film 155 to the arrangement interval of the film 155 or the ratio of the width of the opening to the arrangement interval of the opening of the film 155 (in other words, the occupation ratio of the film 155 to the third region 106) is appropriately set. By setting the value, the light transmittance of the film 155 is apparently a desired value.

  In the example shown in FIG. 24, the end of the film 155 is located on the organic layer 120. In order to do this, the film 155 may be formed after the organic layer 120. However, as shown in FIG. 26, the organic layer 120 may be positioned on the film 155. In order to do this, the film 155 may be formed before the organic layer 120 is formed. In this case, the film 155 may be formed using a material similar to that of the insulating film 150.

  Note that a light reflective film may be provided instead of the film 155. In this case, the film 155 may be formed integrally with the second electrode 130. Further, the film 155 may be formed of the material of the first electrode 110. In this case, the film 155 is formed at the same timing as the first electrode 110. Therefore, when the organic layer 120 is formed in the third region, the film 155 is formed between the substrate 100 and the organic layer 120 as shown in FIG.

  Also according to this modification, the amount of light transmitted through the region where the film 155 is provided in the third region 106 is different from the amount of light transmitted through the other part of the third region 106. For this reason, by appropriately designing the number and positions of the films 155, when the light emitting device 10 is not emitting light, a desired shape (for example, letters, numbers) is formed on the surface opposite to the light emitting side of the light emitting device 10. , At least one of a figure and a pattern).

  In this modification, when the third regions 106 that are adjacent to each other through the light emitting unit 140 are compared, a film 155 is formed in the third region 106 over the entire direction in which the light emitting unit 140 extends. May be.

(Example 8)
FIG. 27 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 8, and corresponds to FIG. 1 of the embodiment. The light emitting system according to the present embodiment is the same as the embodiment except that the light emitting device 10 is attached to the inner surface (first surface 22) (first space side) of the moving body 30 in the partition member 20. It is the structure similar to the light-emitting system which concerns.

  The light emitting device 10 according to this example has the configuration shown in any of the embodiments, Examples 1 to 7, and each modification. However, in the light emitting device 10, the surface opposite to the partition member 20 is a light extraction surface. In order to do this, it is necessary to make the light emitting device 10 a top emission type light emitting device, or to make the second surface 100b side of the light emitting device 10 face the partition member 20.

  In order to make the light emitting device 10 a top emission type, the material of the first electrode 110 and the material of the second electrode 130 may be switched. In other words, in this example, the second electrode 130 is formed using a light-transmitting material. On the other hand, the first electrode 110 is preferably formed using a light-shielding material such as metal.

  Even in this example, similarly to the embodiment, even if the light emitting device 10 is attached to the partition member 20, the person can define the region inside the first partition member 20 (first space) via the light emitting device 10 and the partition member 20. It can be visually recognized. Moreover, the area | region inside the partition member 20 can be illuminated using the light-emitting device 10. FIG.

Example 9
FIG. 28 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 9, and corresponds to FIG. 1 of the embodiment. The light emitting system according to this example has the same configuration as that of the light emitting system according to the embodiment except that the light emitting device 10 is fixed to the partition member 20 using the fixing member 210. However, the light emitting device 10 may have the configuration shown in any of Examples 1 to 7 and each modification.

  The fixing member 210 is a frame-like member, and the lower surface is fixed to the partition member 20 using the adhesive layer 200. The upper part of the fixing member 210 is bent toward the inside of the fixing member 210, and the edge of the light emitting device 10 is pressed by the bent part. However, the shape of the fixing member 210 is not limited to the example shown in this figure.

  Also in this example, as in the embodiment, even if the light emitting device 10 is attached to the partition member 20, a person can visually recognize the region inside the partition member 20 through the light emitting device 10 and the partition member 20. . Moreover, the area | region inside the partition member 20 can be illuminated using the light-emitting device 10. FIG.

  In addition, as illustrated in FIG. 29, the partition member 20 may be curved in a direction in which the surface opposite to the light emitting device 10 is convex. In such a case, it is difficult to directly fix the light emitting device 10 on the flat plate to the inner surface (first surface 22) of the partition member 20. However, if the fixing member 210 is used, the light emitting device 10 can be fixed to the partition member 20 even in such a case.

  When the curved partition member 20 and the light emitting device 10 on the flat plate are fixed by such a method, a filler may be filled in the gap between the partition member 20 and the light emitting device 10. As described above, if there is a gap, the light emitted from the light emitting device 10 is reflected by the partition member 20 and the reflected light is transmitted in the opposite direction to the light emitting side of the light emitting device 10. When the refractive index of the partition member 20 and the refractive index of the substrate 100 of the light emitting device 10 are substantially the same (for example, when both are formed of glass), is the refractive index of the filling member the same as these refractive indexes? A close value is preferable. Further, when the partition member 20 and the substrate 100 have different refractive indexes (for example, the partition member 20 is formed of plastic and the substrate 100 is formed of glass), the refractive index of the filler is the refractive index of the partition member 20. A numerical value between the refractive index and the refractive index of the substrate 100 of the light emitting device 10 is preferable.

  In addition to the light emitting system of the above embodiment, the light emitting device 10 and the adhesive layer 200 or the light emitting module including the light emitting device 10 and the fixing member 210 may be used.

(Example 10)
FIG. 30 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 10. The light emitting system according to this example has the same configuration as that of the light emitting system according to the embodiment except that the light emitting unit 140 is formed on the first surface 22 or the second surface 24 of the partition member 20. In other words, in this example, the partition member 20 also serves as the substrate 100 in the embodiment. In addition, the light-emitting device 10 may have the structure shown in any of Examples 1-7 and each modification.

  In this embodiment, a recess may be formed on the surface of the partition member 20 where the light emitting unit 140 is formed, and the light emitting unit 140 may be formed in the recess. For example, one recess may be formed in a region where the plurality of light emitting units 140 are formed, and the plurality of light emitting units 140 may be formed on the bottom surface of the recess. It may be formed. In this case, the light-emitting portion 140 may be sealed with a highly transmissive structure, for example, a structure in which a plurality of recesses are sealed at once by film sealing or the like. In any case where the concave portion is individual or plural with respect to the light emitting portion 140, it is possible to suppress the light emitting portion 140 from protruding from the partition member 20. In addition, when forming the light emission part 140 in the recessed part of the partition member 20, the upper part of the light emission part 140 may protrude from the 2nd surface 24 (or 1st surface 22) of the partition member 20, or the light emission part 140 of FIG. The entirety may be located below the second surface 24 (or the first surface 22).

  Even in this embodiment, as in the embodiment, even if the light emitting device 10 is attached to the partition member 20, the person visually recognizes the region (first space) inside the partition member 20 through the light emitting device 10 and the partition member 20. can do. Moreover, the area | region (1st space) inside the partition member 20 can be illuminated using the light-emitting device 10. FIG. In addition, since the light emitting system does not include the substrate 100, the manufacturing cost of the light emitting system is reduced.

(Example 11)
FIG. 31 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 11. The light emitting system according to the present embodiment has the same configuration as that of the embodiment, any of the examples, or any of the modified examples, except that the plurality of light emitting devices 10 are attached to the partition member 20. The plurality of light emitting devices 10 may be controlled to emit and extinguish according to the same control signal, or may be controlled to emit and extinguish according to different control signals.

  Even in the present example, as in the embodiment, even if the light emitting device 10 is attached to the partition member 20, a person can define a region (first space) inside the partition member 20 via the light emitting device 10 and the partition member 20. It can be visually recognized. Moreover, the area | region (1st space) inside the partition member 20 can be illuminated using the light-emitting device 10. FIG.

(Example 12)
FIG. 32 is a cross-sectional view illustrating a configuration of a light emitting system according to Example 12. In this embodiment, the partition member 20 closes the opening of the accommodating portion 26. A meter 28 is attached to the surface of the accommodating portion 26 opposite to the partition member 20. Such a configuration can be applied to, for example, a portion of the driver's seat that houses various display devices. In this case, the meter 28 is, for example, an analog speedometer.

  Also in this example, as in the embodiment, even if the light emitting device 10 is attached to the partition member 20, a person can visually recognize the meter 28 through the light emitting device 10 and the partition member 20. Further, the meter 28 can be illuminated using the light emitting device 10.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

  This application claims the priority on the basis of Japanese application Japanese Patent Application No. 2015-233916 for which it applied on November 30, 2015, and takes in those the indications of all here.

Claims (8)

A partition member that at least partly partitions the first space and the second space;
A translucent substrate overlapping the partition member;
A light emitting part and a light transmitting part disposed on the substrate;
With
The light emission intensity of the light emitting unit is greater in the first space than in the second space,
The light emitting system, wherein the first space is smaller than the second space.   The light emitting system according to claim 1, wherein the first space is a space in which a feature is arranged. An insulating film that defines the light emitting portion,
The light emitting system according to claim 2, wherein the translucent portion includes a region overlapping with the insulating film and a region not overlapping with the insulating film. Seen from the second space,
The light emitting system according to claim 3, wherein the feature can be visually recognized through the substrate and the partition member regardless of whether the light emitting unit emits light or does not emit light. A partition member that at least partly partitions the first space and the second space;
A light emitting part and a light transmitting part arranged in the partition member;
With
The light emission intensity of the light emitting unit is greater in the first space than in the second space,
The light emitting system, wherein the first space is smaller than the second space.   The light emitting system according to claim 5, wherein the first space is a space in which a feature is arranged. An insulating film that defines the light emitting portion,
The light emitting system according to claim 6, wherein the translucent portion includes a region overlapping with the insulating film and a region not overlapping. Seen from the second space,
The light emitting system according to claim 7, wherein the feature can be visually recognized through the partition member regardless of whether the light emitting unit emits light or does not emit light.

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