JPWO2008136251A1 - 部品内蔵モジュール及びその製造方法 - Google Patents
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2924/15192—Resurf arrangement of the internal vias
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- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
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- H—ELECTRICITY
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
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- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- H05K3/22—Secondary treatment of printed circuits
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49002—Electrical device making
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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Abstract
Description
−他の製造方法−
1 モジュール基板
2 配線電極(配線パターン)
3 ビア導体
4 シールド電極
5 配線電極(配線パターン)
7 第1の回路部品
10 サブモジュール
11 サブモジュール基板
12 配線電極
13 ビア導体
14 端子電極
15 第2の回路部品
15a 集積回路素子
15b 個別受動部品
16 樹脂層
17 シールド電極
20 絶縁樹脂層
21 シールド層
22 ビア導体
30 支持板
31 レジストパターン
32 接着シート
Claims (17)
- 上面及び下面に配線パターンを有し、上記下面の配線パターンから上面に至るビア導体又はスルーホール導体が形成されたモジュール基板と、
上記モジュール基板の上面の配線パターン上に実装された第1の回路部品と、
上記モジュール基板より小面積に形成され、下面に端子電極を有し、上記モジュール基板上面の上記配線パターンが形成されていない領域に配置されたサブモジュールと、
上記サブモジュール上に搭載され及び/又は上記サブモジュールに内蔵された第2の回路部品と、
上記モジュール基板の上面全面に、上記第1の回路部品及び上記サブモジュールの少なくとも一部を覆うように形成された絶縁樹脂層とを備え、
上記サブモジュールの端子電極は上記モジュール基板に形成された上記ビア導体又はスルーホール導体と直接接続されていることを特徴とする部品内蔵モジュール。 - 上記サブモジュールの下面は接着シートを介して上記モジュール基板の上面に接着され、上記ビア導体又はスルーホール導体は上記接着シートを貫通していることを特徴とする請求項1に記載の部品内蔵モジュール。
- 上記接着シートは、上記絶縁樹脂層と同一材料によって形成されていることを特徴とする請求項2に記載の部品内蔵モジュール。
- 上記サブモジュールは、その外周が上記モジュール基板の上面に形成されたレジストパターンによって位置決めされていることを特徴とする請求項1ないし3のいずれか1項に記載の部品内蔵モジュール。
- 上記モジュール基板上面の上記配線パターンが形成されていない領域にはSnプリコートされた固定用ランドが形成され、上記サブモジュールの下面には上記端子電極から独立したダミー電極が形成され、上記ダミー電極を上記固定ランドに対してプリコート実装してなることを特徴とする請求項1に記載の部品内蔵モジュール。
- 上記第2の回路部品は多数の端子を持つ集積回路素子を含むことを特徴とする請求項1ないし5のいずれか1項に記載の部品内蔵モジュール。
- 上記第1の回路部品は上記集積回路素子より端子数の少ない個別回路部品であることを特徴とする請求項6に記載の部品内蔵モジュール。
- 上記第1の回路部品は、上記第2の回路部品より背丈の高い回路部品を含むことを特徴とする請求項1ないし7のいずれか1項に記載の部品内蔵モジュール。
- 上記絶縁樹脂層の上面にシールド層が設けられており、
上記サブモジュールの上面又は上記モジュール基板の上面にグランド電極が設けられており、
上記シールド層と上記グランド電極とを接続するビア導体が上記絶縁樹脂層に形成されていることを特徴とする請求項1ないし8のいずれか1項に記載の部品内蔵モジュール。 - 支持板上に配線パターンを形成する第1の工程と、
上記配線パターン上に第1の回路部品を実装する第2の工程と、
上記支持板上の上記配線パターンが形成されていない領域に、下面に端子電極を有し、第2の回路部品を内蔵及び/又は搭載したサブモジュールを配置する第3の工程と、
上記第1の回路部品と上記サブモジュールとの少なくとも一部を覆うように、上記支持板上に絶縁樹脂層を形成する第4の工程と、
上記支持板を上記配線パターン、上記サブモジュール及び上記絶縁樹脂層から剥離する第5の工程と、
上記配線パターン、上記サブモジュール及び上記絶縁樹脂層にモジュール基板を積層する第6の工程と、
上記モジュール基板に、上記サブモジュールの端子電極に接するようにビア導体又はスルーホール導体を形成する第7の工程と、を備える部品内蔵モジュールの製造方法。 - 上記第6の工程において、上記モジュール基板を半硬化の状態で積層することを特徴とする請求項10に記載の部品内蔵モジュールの製造方法。
- 上記第3の工程において、上記支持板上に接着シートを介して上記サブモジュールを接着することを特徴とする請求項10又は11に記載の部品内蔵モジュールの製造方法。
- 上記接着シートは、上記絶縁樹脂層と同一材料によって形成された樹脂シートであることを特徴とする請求項12に記載の部品内蔵モジュールの製造方法。
- 上記第3の工程において、上記支持板上にレジストパターンを形成し、該レジストパターンをガイドとして上記サブモジュールを配置することにより、上記サブモジュールの外周を位置決めすることを特徴とする請求項10ないし13のいずれか1項に記載の部品内蔵モジュールの製造方法。
- 上記支持板上の上記配線パターンが形成されていない領域にSnプリコートされた固定用ランドを形成し、上記サブモジュールの下面に上記端子電極から独立したダミー電極を形成し、上記配線パターン上に第1の回路部品をプリコート実装すると同時に上記ダミー電極を上記固定ランドに対してプリコート実装することを特徴とする請求項10又は11に記載の部品内蔵モジュールの製造方法。
- 上面に配線パターンを形成した硬化状態のモジュール基板を準備する第1の工程と、
上記配線パターン上に第1の回路部品を実装する第2の工程と、
上記モジュール基板上の上記配線パターンが形成されていない領域に、上記モジュール基板より小面積に形成され、下面に端子電極を有し、第2の回路部品を内蔵及び/又は搭載したサブモジュールを配置する第3の工程と、
上記第1の回路部品と上記サブモジュールとの少なくとも一部を覆うように、上記モジュール基板上に絶縁樹脂層を形成する第4の工程と、
上記モジュール基板の下面から上記サブモジュールの下面の端子電極に至るビア導体又はスルーホール導体を形成する第5の工程と、を備える部品内蔵モジュールの製造方法。 - 上記第2〜第4の工程は、上記モジュール基板を補強板に固定した状態で行うことを特徴とする請求項16に記載の部品内蔵モジュールの製造方法。
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Application Number | Priority Date | Filing Date | Title |
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JP2007121412 | 2007-05-02 | ||
JP2007121412 | 2007-05-02 | ||
PCT/JP2008/057155 WO2008136251A1 (ja) | 2007-05-02 | 2008-04-11 | 部品内蔵モジュール及びその製造方法 |
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JP4424449B2 JP4424449B2 (ja) | 2010-03-03 |
JPWO2008136251A1 true JPWO2008136251A1 (ja) | 2010-07-29 |
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JP2009512911A Active JP4424449B2 (ja) | 2007-05-02 | 2008-04-11 | 部品内蔵モジュール及びその製造方法 |
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US (1) | US8072769B2 (ja) |
EP (1) | EP2141972B1 (ja) |
JP (1) | JP4424449B2 (ja) |
CN (1) | CN101663926B (ja) |
WO (1) | WO2008136251A1 (ja) |
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