JPS6479354A - Cu or cu-alloy ingot for wiredrawing super extra fine wire - Google Patents

Cu or cu-alloy ingot for wiredrawing super extra fine wire

Info

Publication number
JPS6479354A
JPS6479354A JP62238340A JP23834087A JPS6479354A JP S6479354 A JPS6479354 A JP S6479354A JP 62238340 A JP62238340 A JP 62238340A JP 23834087 A JP23834087 A JP 23834087A JP S6479354 A JPS6479354 A JP S6479354A
Authority
JP
Japan
Prior art keywords
billet
wiredrawing
pressurization chamber
wire
extra fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62238340A
Other languages
Japanese (ja)
Inventor
Yoshiharu Mae
Akira Iwai
Masato Koide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP62238340A priority Critical patent/JPS6479354A/en
Publication of JPS6479354A publication Critical patent/JPS6479354A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/745—Apparatus for manufacturing wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01204—4N purity grades, i.e. 99.99%

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Metal Extraction Processes (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To manufacture a Cu billet for wiredrawing super extra fine wire minimal in the occurrence of the breaking of wire during working, by subjecting a Cu billet having a unidirectionally solidified structure and showing the maximum value at a specific angle of reflection in the X-ray diffraction by means of a CuKalpha rays in a cross section at a right angle to a longitudinal direction to czochralski process. CONSTITUTION:The inside of a pressurization chamber 2 is evacuated via an evacuation pipe 1, and Cu or Cu alloy 10 in a crucible 5 disposed in the center of the bottom of the pressurization chamber 2 is melted by means of a high frequency induction coil 6. Subsequently, the inside of the pressurization chamber 2 is formed into a pressurized state by means of an Ar gas-introducing pipe 7, and then, the end of a nozzle mold 8 fitted to the end of a water-cooled jacket 9 is immersed into the molten metal and a billet 11 is pulled up via the nozzle mold 8. This billet 11 has a unidirectionally solidified structure and shows the maximum X-ray intensity at an angle of reflection 2theta of 50-55 deg. when X-ray diffraction is applied by using CuKalpha rays to a cross section perpendicular to the longitudinal direction. By this method, the Cu or Cu-alloy billet 11 free from the breaking of wire in wiredrawing and product working can be obtained.
JP62238340A 1987-09-22 1987-09-22 Cu or cu-alloy ingot for wiredrawing super extra fine wire Pending JPS6479354A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62238340A JPS6479354A (en) 1987-09-22 1987-09-22 Cu or cu-alloy ingot for wiredrawing super extra fine wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62238340A JPS6479354A (en) 1987-09-22 1987-09-22 Cu or cu-alloy ingot for wiredrawing super extra fine wire

Publications (1)

Publication Number Publication Date
JPS6479354A true JPS6479354A (en) 1989-03-24

Family

ID=17028748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62238340A Pending JPS6479354A (en) 1987-09-22 1987-09-22 Cu or cu-alloy ingot for wiredrawing super extra fine wire

Country Status (1)

Country Link
JP (1) JPS6479354A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116117665A (en) * 2023-04-04 2023-05-16 河北庞德铝合金模板科技有限公司 Surface treatment equipment for processing aluminum alloy templates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116117665A (en) * 2023-04-04 2023-05-16 河北庞德铝合金模板科技有限公司 Surface treatment equipment for processing aluminum alloy templates
CN116117665B (en) * 2023-04-04 2023-06-27 河北庞德铝合金模板科技有限公司 Surface treatment equipment for processing aluminum alloy templates

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