JPS647638A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS647638A JPS647638A JP62162564A JP16256487A JPS647638A JP S647638 A JPS647638 A JP S647638A JP 62162564 A JP62162564 A JP 62162564A JP 16256487 A JP16256487 A JP 16256487A JP S647638 A JPS647638 A JP S647638A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- onto
- shaped
- electrode pad
- bump electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62162564A JPS647638A (en) | 1987-06-30 | 1987-06-30 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62162564A JPS647638A (en) | 1987-06-30 | 1987-06-30 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS647638A true JPS647638A (en) | 1989-01-11 |
Family
ID=15756987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62162564A Pending JPS647638A (en) | 1987-06-30 | 1987-06-30 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS647638A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0582582A (ja) * | 1991-09-24 | 1993-04-02 | Nec Yamagata Ltd | 半導体装置 |
JPH05152605A (ja) * | 1991-11-28 | 1993-06-18 | Nec Corp | アレイ状光素子及びその実装基板 |
US6369490B1 (en) * | 1999-04-28 | 2002-04-09 | Murata Manufacturing Co., Ltd | Surface acoustic wave device having bump electrodes |
US6717334B2 (en) * | 2001-04-25 | 2004-04-06 | Murata Manufacturing Co., Ltd. | Electronic component and method for forming substrate electrode of the same |
-
1987
- 1987-06-30 JP JP62162564A patent/JPS647638A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0582582A (ja) * | 1991-09-24 | 1993-04-02 | Nec Yamagata Ltd | 半導体装置 |
JPH05152605A (ja) * | 1991-11-28 | 1993-06-18 | Nec Corp | アレイ状光素子及びその実装基板 |
US6369490B1 (en) * | 1999-04-28 | 2002-04-09 | Murata Manufacturing Co., Ltd | Surface acoustic wave device having bump electrodes |
US6717334B2 (en) * | 2001-04-25 | 2004-04-06 | Murata Manufacturing Co., Ltd. | Electronic component and method for forming substrate electrode of the same |
US6784598B2 (en) | 2001-04-25 | 2004-08-31 | Murata Manufacturing Co., Ltd. | Electronic component and method for forming substrate electrode of the same |
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