JPS6457732A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6457732A JPS6457732A JP21572687A JP21572687A JPS6457732A JP S6457732 A JPS6457732 A JP S6457732A JP 21572687 A JP21572687 A JP 21572687A JP 21572687 A JP21572687 A JP 21572687A JP S6457732 A JPS6457732 A JP S6457732A
- Authority
- JP
- Japan
- Prior art keywords
- metallic
- epoxy resin
- wiring layers
- wiring
- metallic wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21572687A JPS6457732A (en) | 1987-08-28 | 1987-08-28 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21572687A JPS6457732A (en) | 1987-08-28 | 1987-08-28 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6457732A true JPS6457732A (en) | 1989-03-06 |
Family
ID=16677169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21572687A Pending JPS6457732A (en) | 1987-08-28 | 1987-08-28 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6457732A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0322535A (ja) * | 1989-06-20 | 1991-01-30 | Oki Electric Ind Co Ltd | 樹脂封止型半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5772349A (en) * | 1980-10-23 | 1982-05-06 | Nec Corp | Semiconductor integrated circuit device |
JPS6010645A (ja) * | 1983-06-30 | 1985-01-19 | Toshiba Corp | 樹脂封止型半導体装置 |
-
1987
- 1987-08-28 JP JP21572687A patent/JPS6457732A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5772349A (en) * | 1980-10-23 | 1982-05-06 | Nec Corp | Semiconductor integrated circuit device |
JPS6010645A (ja) * | 1983-06-30 | 1985-01-19 | Toshiba Corp | 樹脂封止型半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0322535A (ja) * | 1989-06-20 | 1991-01-30 | Oki Electric Ind Co Ltd | 樹脂封止型半導体装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY104172A (en) | Method for manufacturing thin-film integrated circuits resistant to damage during flexion | |
IE821477L (en) | Hybrid integrated circuit device | |
DE69017963T2 (de) | Spray-Verkapselung von photovoltaischen Anordnungen. | |
ATE47505T1 (de) | Monolithisch integrierte halbleiterschaltung. | |
JPS5710992A (en) | Semiconductor device and manufacture therefor | |
JPS5429984A (en) | Protector for semiconductor device | |
JPS5365066A (en) | Semiconductor device | |
JPS6457732A (en) | Semiconductor device | |
JPS56114361A (en) | Semiconductor container | |
JPS5258469A (en) | Resin-molded type semiconductor device | |
JPS5650581A (en) | Schottky diode | |
JPS55117254A (en) | Fabrication of electronic device | |
SU637766A1 (ru) | Пассивный элемент интегральных оптоэлектронных устройств | |
JPS5671963A (en) | Semiconductor device | |
JPS5353988A (en) | Semiconductor integrated circuit | |
JPS52151567A (en) | Protecting method of wiring layers | |
JPS5529185A (en) | Small-sized electronics equipment provided with solar battery | |
JPS5318960A (en) | Bonding method | |
JPS5320875A (en) | Semiconductor integrated circuit device | |
JPS52143779A (en) | Input protection circuit | |
JPS57211782A (en) | Semiconductor device | |
JPS5690547A (en) | Semiconductor device | |
JPS5734356A (en) | Semiconductor device | |
JPS5352388A (en) | Semiconductor device | |
JPS5718354A (en) | Semiconductor integrated circuit |